公开(公告)号：US20170031721A1

公开(公告)日：2017-02-02

申请号：US15289940

申请日：2016-10-10

Applicant: Samsung Electronics Co., Ltd

Inventor： Junha Kim ,  Jaeho Ju ,  Dongho Kim

IPC: G06F9/50 ,  G06F9/48

CPC classification number: G06F9/5022 ,  G06F9/485

Abstract: A method and a device dynamically managing background processes according to a memory status so as to efficiently use the memory in a user device supporting a multitasking operating system. The method includes determining reference information for adjustment of the number of background processes; identifying a memory status based on the reference information; and adjusting the number of the background processes in correspondence to the memory status.

Abstract translation: 一种方法和设备，其根据存储器状态动态地管理后台进程，以便有效地使用支持多任​​务操作系统的用户设备中的存储器。 该方法包括确定用于调整后台进程数量的参考信息; 基于参考信息识别存储器状态; 以及根据存储器状态调整后台进程的数量。

公开(公告)号：US09465661B2

公开(公告)日：2016-10-11

申请号：US14261289

申请日：2014-04-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junha Kim ,  Jaeho Ju ,  Dongho Kim

IPC: G06F9/455 ,  G06F9/46 ,  G06F9/50 ,  G06F9/48

CPC classification number: G06F9/5022 ,  G06F9/485

Abstract: A method and a device dynamically managing background processes according to a memory status so as to efficiently use the memory in a user device supporting a multitasking operating system.The method includes determining reference information for adjustment of the number of background processes; identifying a memory status based on the reference information; and adjusting the number of the background processes in correspondence to the memory status.

Abstract translation: 该方法包括确定用于调整后台进程数量的参考信息; 基于参考信息识别存储器状态; 以及根据存储器状态调整后台进程的数量。

公开(公告)号：US12272661B2

公开(公告)日：2025-04-08

申请号：US17564689

申请日：2021-12-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunsu Lee ,  Dongho Kim ,  Jiyong Park ,  Jeonghyun Lee

IPC: H01L23/00 ,  H01L23/48 ,  H01L25/065

Abstract: A semiconductor package includes a first semiconductor chip including a first bonding pad on a first surface of a first substrate, a first through electrode penetrating through the first substrate and electrically connected to the first bonding pad, a first recess with a desired depth in the first substrate from a second surface of the first substrate and exposing an end portion of the first through electrode, and a second bonding pad in the first recess and electrically connected to the first through electrode, a second semiconductor chip stacked on the second surface of the first substrate and including a third bonding pad on a third surface of a second substrate, and a conductive connection member between the second bonding pad and the third bonding pad. At least a portion of the conductive connection member may be in the first recess.

公开(公告)号：US12206045B2

公开(公告)日：2025-01-21

申请号：US17477810

申请日：2021-09-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongho Kim ,  Kyungwook Hwang

IPC: H01L33/10 ,  H01L25/075 ,  H01L33/00 ,  H01L33/04 ,  H01L33/12 ,  H01L33/32

Abstract: Provided is a light emitting device including a buffer layer, a body provided on the buffer layer, the body including a first semiconductor layer, an active layer, and a second semiconductor layer, a reflective layer configured to reflect light incident from the active layer, and a scattering pattern provided between the first semiconductor layer and the buffer layer, the scattering pattern being configured to scatter the light incident from the active layer and light incident from the reflective layer.

公开(公告)号：US11900043B2

公开(公告)日：2024-02-13

申请号：US17701520

申请日：2022-03-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sooyong Lee ,  Dongho Kim ,  Sangwook Kim ,  Jungmin Kim ,  Seunghune Yang ,  Jeeyong Lee ,  Changmook Yim ,  Yangwoo Heo

IPC: G06F30/30 ,  G03F7/00 ,  G06F30/398 ,  G06F30/392 ,  G06F30/27 ,  G06F119/18

CPC classification number: G06F30/398 ,  G03F7/705 ,  G03F7/70441 ,  G06F30/27 ,  G06F30/392 ,  G06F2119/18

Abstract: Disclosed is an operating method of an electronic device which includes receiving a design layout for manufacturing the semiconductor device, generating a first layout by performing machine learning-based process proximity correction (PPC), generating a second layout by performing optical proximity correction (OPC), and outputting the second layout for a semiconductor process. The generating of the first layout includes generating a first after cleaning inspection (ACI) layout by executing a machine learning-based process proximity correction module on the design layout, generating a second after cleaning inspection layout by adjusting the design layout based on a difference of the first after cleaning inspection layout and the design layout and executing the process proximity correction module on the adjusted layout, and outputting the adjusted layout as the first layout, when a difference between the second after cleaning inspection layout and the design layout is smaller than or equal to a threshold value.

公开(公告)号：US11870008B2

公开(公告)日：2024-01-09

申请号：US17227538

申请日：2021-04-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinjoo Park ,  Junhee Choi ,  Nakhyun Kim ,  Dongho Kim ,  Joohun Han

IPC: H01L33/14 ,  H01L33/04 ,  H01L33/00 ,  H01L27/15 ,  H01L33/56

CPC classification number: H01L33/145 ,  H01L27/156 ,  H01L33/005 ,  H01L33/04 ,  H01L33/56

Abstract: A nanorod light-emitting device is provided. The nanorod light-emitting device includes a first semiconductor layer, a light-emitting layer on the first semiconductor layer, a second semiconductor layer disposed on the light-emitting layer, at least one conductive layer disposed between a central portion of a lower surface of the light-emitting layer and the first semiconductor layer, or between a central portion of an upper surface of the light-emitting layer and the second semiconductor layer, at least one current blocking layer that surrounds a side surface of the at least one conductive layer, and an insulating film that surrounds a side surface of the second semiconductor layer, a side surface of the light-emitting layer, and a side surface of the at least one current blocking layer.

公开(公告)号：US20230402439A1

公开(公告)日：2023-12-14

申请号：US17985332

申请日：2022-11-11

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  CHUNGBUK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION

Inventor： Kyungwook Hwang ,  Jaewook Jeong ,  Junsik Hwang ,  Dongkyun Kim ,  Dongho Kim ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong ,  Sanghoon Song ,  Minchul Yu

IPC: H01L25/16 ,  H01L33/38 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01L33/38 ,  H01L24/05 ,  H01L24/95 ,  H01L2224/05559 ,  H01L24/16 ,  H01L2224/16145 ,  H01L2224/95001

Abstract: Provided is a microchip including a chip body having a first surface and a second surface facing the first surface, and an electrode layer on the second surface, wherein a surface roughness of the first surface is smaller than a surface roughness of an upper surface of the electrode layer such that van der Waals force between the first surface and an external contact surface are greater than van der Waals force between the electrode layer and the external contact surface.

公开(公告)号：US11824663B2

公开(公告)日：2023-11-21

申请号：US17519818

申请日：2021-11-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongho Kim ,  Jongmin Baik ,  Jusung Lee

IPC: H04L1/1829 ,  H04L1/1812 ,  H04B17/309 ,  H04L1/1867 ,  H04W72/21

CPC classification number: H04L1/1854 ,  H04B17/309 ,  H04L1/1812 ,  H04L1/1835 ,  H04L1/1848 ,  H04L1/1874 ,  H04W72/21

Abstract: Various embodiments of the disclosure relate to an apparatus and a method for managing a communication buffer of an electronic device in the electronic device. The electronic device includes: a wireless communication circuit, an application processor, and a communication processor operatively connected to the wireless communication circuit and the application processor and including a communication buffer, wherein the communication processor is configured to: identify a Radio Link Control (RLC) retransmission time, identify an uplink transmission rate, and configure a size of an area for storing data in the communication buffer based on the RLC retransmission time and the uplink transmission rate.

公开(公告)号：US20230253179A1

公开(公告)日：2023-08-10

申请号：US17935128

申请日：2022-09-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SUNG MIN NAM ,  Jaeseung Jeong ,  Dongho Kim ,  Seunghune Yang

IPC: H01J37/28 ,  H01J37/22 ,  H01L21/66 ,  G01B11/02

CPC classification number: H01J37/28 ,  H01J37/222 ,  H01L22/12 ,  G01B11/02 ,  H01J2237/2817 ,  H01J2237/223 ,  H01J2237/226 ,  G01B2210/56

Abstract: A pitch walk inspection method includes obtaining a scanning electron microscope (SEM) image for a line and space (L/S) pattern formed by a multi-patterning technology (MPT), where L/S pattern includes a plurality of lines and spaces that are alternately arranged; detecting a main pitch of the L/S pattern in the SEM image; dividing a graph of the main pitch into graphs of component pitches, based on the MPT; performing a Fast Fourier Transform (FFT) on each graph of the component pitches; multiplying a phase and an intensity graph of the FFT of each of the graphs of the component pitches with each other and obtaining compensated FFT phase graphs; and calculating a pitch walk for the L/S pattern by obtaining differences between phase peak values of the compensated FFT phase graphs.

公开(公告)号：US10466100B2

公开(公告)日：2019-11-05

申请号：US15045895

申请日：2016-02-17

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  IMEC VZW

Inventor： Seongho Cho ,  Tom Claes ,  Dongho Kim

IPC: G01J3/02 ,  G02B6/124 ,  G01N21/27 ,  G01J3/18 ,  G01N21/47 ,  A61B5/145 ,  A61B5/1455 ,  A61B5/00 ,  G01J3/26 ,  G01J3/36 ,  G02B6/10 ,  G02B6/27 ,  G01J3/12 ,  G02B6/34

Abstract: Provided are a dual coupler device configured to receive lights of different polarization components, a spectrometer including the dual coupler device, and a non-invasive biometric sensor including the spectrometer. The dual coupler device may include, for example, a first coupler layer configured to receive a light of a first polarization component among incident lights. and a second coupler layer configured to receive a light of a second polarization component among the incident lights, wherein a polarization direction of the light of the first polarization component is perpendicular to a polarization direction of the light of the second polarization component. The first coupler layer and the second coupler layer may be spaced apart from each other and extended along a direction in which the light propagates in the first coupler layer and the second coupler layer.