公开(公告)号：US09976894B2

公开(公告)日：2018-05-22

申请号：US15353397

申请日：2016-11-16

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  Sonja Hanselmann

IPC: H01L31/02 ,  G01J1/02 ,  H01L31/173

CPC classification number: G01J1/0295 ,  G01J1/0209 ,  G01J1/0214 ,  G01J1/0271 ,  H01L31/173

Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

公开(公告)号：US09634051B2

公开(公告)日：2017-04-25

申请号：US14413866

申请日：2013-03-14

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Alexander Bietsch ,  Hartmut Rudmann ,  Markus Rossi ,  Simon Gubser

IPC: H04N5/225 ,  H01L31/0232 ,  H01L27/146 ,  G02B13/00 ,  H01L31/0203 ,  G02B21/36 ,  H01L31/054

CPC classification number: H01L27/14687 ,  G01J3/0208 ,  G01J3/0256 ,  G02B13/0085 ,  G02B21/367 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/0547 ,  H01L2924/0002 ,  Y02E10/52 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  H01L2924/00

Abstract: Then optical device comprises a first member (P) and a second member (O) and, arranged between said first and second members, a third member (S) referred to as spacer. The spacer (S) comprises —one or more portions referred to as distancing portions (Sd) in which the spacer has a vertical extension referred to as maximum vertical extension; —at least two separate portions referred to as open portions (4) in which no material of the spacer is present; and —one or more portions referred to as structured portions (Sb) in which material of the spacer is present and in which the spacer has a vertical extension smaller than said maximum vertical extension. Such optical devices can be used in or as multi-aperture cameras.

公开(公告)号：US09094593B2

公开(公告)日：2015-07-28

申请号：US14339623

申请日：2014-07-24

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L21/00 ,  H04N5/225 ,  H01L25/00

CPC classification number: H01L27/14623 ,  F21V5/048 ,  F21Y2115/10 ,  G02B5/22 ,  G02B7/02 ,  G02B13/0085 ,  H01L24/94 ,  H01L25/50 ,  H01L31/0203 ,  H01L31/0543 ,  H01L33/486 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2933/0033 ,  H04N5/2252 ,  H04N5/2257 ,  Y02E10/52 ,  Y10T29/41 ,  H01L2924/00

Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.

Abstract translation: 光电模块包括光电器件和透明盖。 在透明盖的侧壁上设置不透明的材料，这有助于减少透明盖的侧面的光泄漏，或者有助于减少杂散光进入模块。 模块可以例如在晶片级工艺中制造。 在一些实施方案中，诸如沟槽的开口形成在透明晶片中。 然后可以使用例如真空注射工具用不透明材料填充沟槽。 当随后将包括沟槽填充的透明晶片的晶片堆叠分离成单个模块时，结果是每个模块可以包括具有被不透明材料覆盖的侧壁的透明盖。

公开(公告)号：US08975108B2

公开(公告)日：2015-03-10

申请号：US14303968

申请日：2014-06-13

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Alexander Bietsch ,  Susanne Westenhöfer ,  Simon Gubser

IPC: H01L21/00 ,  H01L31/167 ,  H01L31/12 ,  G01S7/481 ,  H01L31/0232 ,  H01L31/173 ,  G01S17/02

CPC classification number: H01L31/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/173

Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.

Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，所述发光器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如碳黑等含有颜料的不透明聚合物材料构成。

公开(公告)号：US20150034975A1

公开(公告)日：2015-02-05

申请号：US14339657

申请日：2014-07-24

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Sonja Hanselmann ,  Christoph Friese ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L31/16 ,  H01L27/146

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Abstract translation: 描述了包括光电子器件（例如，发光或光检测元件）和透明盖的各种光电模块。 在透明盖的侧壁上设置不透明材料，在一些实施方式中，这可以帮助减少透明盖的侧面的光泄漏，或有助于防止杂散光进入模块。 还描述了制造模块的制造技术。

公开(公告)号：US08791489B2

公开(公告)日：2014-07-29

申请号：US13827264

申请日：2013-03-14

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Alexander Bietsch ,  Susanne Westenhoefer ,  Simon Gubser

IPC: H01L33/00 ,  H01L31/12

CPC classification number: H01L31/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/173

Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.

Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，该光发射器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如碳黑等含有颜料的不透明聚合物材料构成。