A FLUID EXTRACTION SYSTEM, METHOD AND LITHOGRAPHIC APPARATUS

    公开(公告)号:US20240411230A1

    公开(公告)日:2024-12-12

    申请号:US18700780

    申请日:2022-09-15

    Abstract: A fluid extraction system for a lithographic apparatus, the fluid extraction system configured to extract fluid that a fluid handling system, including a fluid handling structure, is arranged to supply along a flow path that includes a gap between an edge of a substrate and an edge of a surrounding structure of the substrate; and a controller arranged to control the flow rate of the fluid in the flow path in dependence on one or more selected from: a property of the substrate, a property of the fluid handling system, a property of the fluid handling structure, a property of the fluid extraction system, and/or the separation between the fluid handling structure and the fluid extraction system.

    Manufacturing a reflective diffraction grating

    公开(公告)号:US12164125B2

    公开(公告)日:2024-12-10

    申请号:US17600420

    申请日:2020-03-06

    Abstract: A grating is provided on a mirror for specularly reflecting and diffracting a grazing-incidence beam of radiation and has a periodic structure with a grating period comprising first (ridge) and second (trench) substructures either side of a sidewall 806 facing the incident beam 800. The ridge is configured to specularly reflect the beam from the flat top 808 of the ridge into a specularly reflected beam 810 in a zeroth-order direction β′=β. The grating is configured with fixed or varying pitch to diffract the beam from the grating periods in one or more non-zero-diffraction-order direction β′≠β. The shape of the trench may be is described by structural parameters top width and depth that define the aspect ratio of the trench. The shape is determined such that any rays (and optionally diffraction) of the beam that reflect once from the trench floor in the zeroth-order direction are obscured by the sidewall.

    Lithographic apparatus and method with improved contaminant particle capture

    公开(公告)号:US12158706B2

    公开(公告)日:2024-12-03

    申请号:US17624901

    申请日:2020-06-04

    Abstract: A lithographic apparatus including a substrate stage for supporting a structure in a compartment, the compartment having a compartment surface facing a top surface of the substrate in at least one operational configuration; and a soft coating on the compartment surface for capturing particles. A heat shield or component thereof for a lithographic apparatus, the heat shield or component thereof including a soft coating on at least one surface for capturing particles and a lithographic apparatus including such a heat shield.

    Method of clamping a substrate to a clamping system, a substrate holder and a substrate support

    公开(公告)号:US12158704B2

    公开(公告)日:2024-12-03

    申请号:US17533947

    申请日:2021-11-23

    Abstract: A method including: generating a first force to attract a substrate holder to a support surface, the holder including a body having opposing first and second body surfaces, first burls at the first body surface, wherein each first burl has a distal end to support a substrate, and second burls at the second body surface to support the substrate holder on the support surface through contact with distal ends of the second burls; generating a second force to attract the substrate to the substrate holder; and controlling the first force and/or second force in a release step to deform the body between the second burls such as to create a gap between the distal ends of a first subset of the plurality of first burls and the substrate and such that the substrate is supported on distal ends of a second subset of the plurality of first burls.

    EUV LITHOGRAPHY SYSTEM HAVING A GAS-BINDING COMPONENT

    公开(公告)号:US20240385541A1

    公开(公告)日:2024-11-21

    申请号:US18790520

    申请日:2024-07-31

    Abstract: A lithography system for extreme ultraviolet (EUV) radiation includes a housing (25) with an interior (24) containing a residual gas (27), and at least one gas-binding component (29) which is arranged in the interior (24) and has a gas-binding material for binding contaminating substances (28). The gas-binding component (29) has at least one flow duct (33) having at least one surface with the gas-binding material, with a gas flow of the residual gas (27) in the flow duct (33) having a Knudsen number of between 0.01 and 5, preferably between 0.01 and 0.5, in particular between 0.01 and 0.3, and with a casing (26) which encapsulates a beam path of the EUV lithography system (1) being arranged in the interior (24) of the housing (25). The casing (26) preferably has an opening (37) with a maintenance shaft (36) in which the gas-binding component (29) is arranged.

    ETCHING SYSTEMS, MODELS, AND MANUFACTURING PROCESSES

    公开(公告)号:US20240385530A1

    公开(公告)日:2024-11-21

    申请号:US18565494

    申请日:2022-05-29

    Abstract: Etch bias is determined based on a curvature of a contour in a substrate pattern. The etch bias is configured to be used to enhance an accuracy of a semiconductor patterning process relative to prior patterning processes. In some embodiments, a representation of the substrate pattern is received, which includes the contour in the substrate pattern. The curvature of the contour of the substrate pattern is determined and inputted to a simulation model. The simulation model includes a correlation between etch biases and curvatures of contours. The etch bias for the contour in the substrate pattern is outputted by the simulation model based on the curvature.

    COMPUTATIONAL METROLOGY BASED SAMPLING SCHEME

    公开(公告)号:US20240377756A1

    公开(公告)日:2024-11-14

    申请号:US18749556

    申请日:2024-06-20

    Abstract: A method for generating metrology sampling scheme for a patterning process, the method including: obtaining a parameter map of a parameter of a patterning process for a substrate; decomposing the parameter map to generate a fingerprint specific to an apparatus of the patterning process and/or a combination of apparatuses of the patterning process; and based on the fingerprint, generating a metrology sampling scheme for a subsequent substrate at the apparatus of the patterning process and/or the combination of apparatuses of the patterning process, wherein the sampling scheme is configured to distribute sampling points on the subsequent substrate so as to improve a metrology sampling density.

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