公开(公告)号：US20030173511A1

公开(公告)日：2003-09-18

申请号：US10328853

申请日：2002-12-24

Inventor： Paul Bacchi ,  Paul S. Filipski

IPC: H01J005/02

CPC classification number: H01L21/67373 ,  H01J61/35 ,  H01J65/046 ,  H01L21/2026 ,  H01L21/67379 ,  H01L21/67772 ,  H01L21/67775 ,  H01L27/1274 ,  H01L27/1296 ,  H01L29/66757 ,  H01L29/66772 ,  H01L29/78654 ,  H01L29/78675

Abstract: An optical scanning assembly detects positions of wafer specimens stored in a transport box. The scanning assembly includes first and second spaced-apart optical component mounts operatively connected to a deployment mechanism that moves them between extended and retracted positions. The extended positions facilitate specimen scanning operation, and the retracted positions facilitate carrier box front side access during specimen non-scanning processing. A preferred embodiment is a scanning assembly of a differential optical type.

Abstract translation: 光学扫描组件检测存储在运输箱中的晶片样品的位置。 扫描组件包括可操作地连接到展开机构的第一和第二间隔开的光学部件安装件，其在延伸位置和缩回位置之间移动它们。 扩展位置便于样品扫描操作，缩回位置便于样品非扫描处理期间的载体箱前侧进入。 优选实施例是差分光学类型的扫描组件。

公开(公告)号：US20030071205A1

公开(公告)日：2003-04-17

申请号：US10298869

申请日：2002-11-18

Applicant: Eaton Corporation

Inventor： Steve S. Wu ,  Martin L. Dickrell ,  George F. Nicholas ,  Timothy A. Christensen

IPC: H01J005/02

CPC classification number: G01D11/245

Abstract: A sensor assembly includes a housing and a plurality of lenses. The lenses are connected with a lens carrier by a plurality of releasable connector elements. A circuit board is disposed on the lens carrier. The circuit board has a black coating. A connector assembly connects the circuit board with an electrical conductor. The connector assembly includes a body portion and a flange portion. The flange portion engages a recess in the sensor housing to hold the body portion of the connector assembly against axial movement relative to the sensor housing. A retainer extends from a cover portion of the sensor housing into engagement with the flange portion of a connector assembly to hold the flange portion against rotation to thereby block unauthorized access to the interior of the sensor housing. A light detector is movable relative to a light source to enable the distance from the light source to a location from which reflected light is received by the detector to be adjusted.

Abstract translation: 传感器组件包括壳体和多个透镜。 透镜通过多个可释放的连接器元件与透镜载体连接。 电路板设置在透镜载体上。 电路板有黑色涂层。 连接器组件将电路板与电导体连接。 连接器组件包括主体部分和凸缘部分。 凸缘部分接合传感器外壳中的凹部，以保持连接器组件的本体部分相对于传感器壳体的轴向移动。 保持器从传感器壳体的盖部分延伸到与连接器组件的凸缘部分接合以保持凸缘部分不旋转，从而阻止未经授权的进入传感器壳体的内部。 光检测器相对于光源是可移动的，以使能够从被检测器接收被反射光的位置被调整。

公开(公告)号：US20030034447A1

公开(公告)日：2003-02-20

申请号：US10259719

申请日：2002-09-30

Applicant: LOCKHEED MARTIN CORPORATION

Inventor： Robert M. Krohn ,  Glenn L. Kehley

IPC: H01J005/02 ,  H01J040/14

CPC classification number: H04N1/00909 ,  H04N1/00989 ,  H04N1/02409 ,  H04N1/03 ,  H04N2201/02456 ,  H04N2201/02458 ,  H04N2201/02468 ,  H04N2201/02485

Abstract: A line scan camera comprises a printed circuit board upon which a charge-coupled device (CCD) is mounted. A lens component is fixed within a lens mount, and the base of the lens mount is adjustably mounted upon an optical bench. Calibration devices adjustably interconnect the lens mount to the printed circuit board and to the optical bench so as to calibrate the positional location of the lens component relative to the charge-coupled device (CCD) and to an object plane past which objects to be scanned and photographed are conveyed. In this manner, the focus distance defined between the lens component and the charge-coupled device (CCD) as well as the focal distance defined between the lens component and the object plane are fixed and do not need any further calibration. The object plane is defined upon the front surface of a sealed housing enclosure and all of the components are disposed within the housing enclosure so as to prevent dust and contaminants from collecting upon the optical components. LED arrays are disposed within the front of the housing so as to illuminate and properly expose the objects conveyed past the object plane. A positive pressure differential is also created within the sealed housing enclosure so as to prevent the ingress of dust and contaminants into the housing enclosure.

公开(公告)号：US20030001083A1

公开(公告)日：2003-01-02

申请号：US10171192

申请日：2002-06-12

Applicant: Greene Tweed of Delaware, Inc.

Inventor： Christopher Corrado ,  George Rawa ,  Carmin Quartapella ,  Timothy Edwards

IPC: H01J005/02

CPC classification number: H01L21/67242 ,  G01D11/245 ,  H01J37/32935 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/681 ,  H01L21/68707 ,  Y10S414/135

Abstract: A self contained sensing apparatus includes a housing establishing an interior compartment, the housing having a maximum thickness which is less than the size of an access portal for inserting the housing into an area for sensing. The housing includes a window extending through a principal housing surface. A sensor is provided within the housing and generally aligned with the window for sensing at least one parameter. In a preferred embodiment, the sensor is an optical sensor for sensing images through the window. A transmitter is provided within the housing and coupled with the sensor for receiving signals representative of the sensed parameter and transmitting the signals out of the housing.

Abstract translation: 自包含感测装置包括建立内部隔室的壳体，该壳体具有小于用于将壳体插入到用于感测的区域中的入口入口的尺寸的最大厚度。 壳体包括延伸穿过主壳体表面的窗口。 传感器设置在壳体内并且通常与窗口对准以便感测至少一个参数。 在优选实施例中，传感器是用于通过窗口感测图像的光学传感器。 发射器设置在壳体内并与传感器耦合，用于接收表示感测参数的信号，并将信号传输出外壳。

公开(公告)号：US20020199048A1

公开(公告)日：2002-12-26

申请号：US10090423

申请日：2002-03-01

Inventor： Josef Rabinovitz

IPC: G06F013/00 ,  H01J005/02

CPC classification number: G06F1/184 ,  G06F1/181 ,  G06F1/187 ,  G06F1/20 ,  G11B33/022 ,  G11B33/128 ,  G11B33/142

Abstract: A peripheral computer enclosure includes a casing, a plurality of slots, a plurality of canisters being disposed in the slots, a plurality of storage devices, a plurality of canisters, a back plane, a power supply, a blower, a controller card and a personality board. The casing has an open front and a back. The slots are disposed inside the casing. The back plane is disposed in the casing. The power supply is disposed in the casing. The blower is disposed in the casing. Each storage device is disposed in one of the canisters. The back plane interconnects the storage devices. The personality board is connected to the back plane. The controller card is connected to the back plane.

Abstract translation: 外围计算机机壳包括壳体，多个槽，多个罐设置在槽中，多个存储装置，多个罐，背板，电源，鼓风机，控制器卡和 个性板 套管具有敞开的前部和后部。 槽设置在壳体内。 背板设置在外壳中。 电源设置在外壳中。 鼓风机设置在壳体内。 每个存储装置设置在一个罐中。 背板互连存储设备。 个性板连接到背面。 控制器卡连接到背板。

公开(公告)号：US20020085197A1

公开(公告)日：2002-07-04

申请号：US10023621

申请日：2001-12-18

Inventor： David Slocum ,  Cormic K. Merle

IPC: G01J001/42 ,  H01J005/02

CPC classification number: H04N17/04 ,  G01J1/0271 ,  G01J1/04

Abstract: A symmetric monitor calibrator for mounting on a cathode ray tube or monitor with a surface. The calibrator has a case that holds electronic and optic components. Suction cups hold the calibrator to the surface, in which the suction cups are attached to the end of supporting elements that surround the case. At least three supporting elements with a common connecting point to form one support structure are connected to the top of the case. The supporting elements extend out creating a greater diameter than the case. The supporting elements and therefore suction cups uniformly surround the center point of the case to prevent rotation caused by the effects of gravity.

Abstract translation: 用于安装在阴极射线管或具有表面的监视器上的对称监视器校准器。 校准器具有保持电子和光学部件的情况。 抽吸杯将校准器固定在表面上，其中吸盘附接到围绕外壳的支撑元件的端部。 具有共同连接点以形成一个支撑结构的至少三个支撑元件连接到壳体的顶部。 支撑元件延伸出来，形成比壳体更大的直径。 支撑元件，因此吸盘均匀地围绕壳体的中心点，以防止重力作用引起的旋转。

公开(公告)号：US20020079438A1

公开(公告)日：2002-06-27

申请号：US09748201

申请日：2000-12-27

Inventor： Vincent Lin

IPC: H01J005/02 ,  H01J040/14

CPC classification number: H01L27/14618 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An image sensor package mainly comprises a main body and an image sensor chip directly attached to a chip-supporting member integrally formed with the main body through an adhesive layer. The image sensor chip is electrically connected to a lead frame integrally formed with the main body. The main body has a wall erected around the image sensor chip with a height taller than the height of the image sensor chip. A optically transparent cover sealed over the top of the wall of the main body thereby allowing the image sensor chip to be exposed to the object to be sensed on an optical principle.

Abstract translation: 图像传感器封装主要包括主体和图像传感器芯片，图像传感器芯片通过粘合剂层直接附接到与主体一体形成的芯片支撑部件。 图像传感器芯片电连接到与主体一体形成的引线框架。 主体具有竖立在图像传感器芯片周围的壁，其高度高于图像传感器芯片的高度。 一个光学透明的盖子，密封在主体壁的顶部上，从而允许图像传感器芯片以光学原理暴露于被感测物体。

公开(公告)号：US20040149898A1

公开(公告)日：2004-08-05

申请号：US10356756

申请日：2003-01-30

Inventor： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Abnet Chen

IPC: H01J005/02

CPC classification number: H01L27/14601 ,  H01L23/055 ,  H01L23/49861 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: An injection-molded structure of an image sensor to be electrically connected to a printed circuit board. The image sensor includes metal sheets arranged in a matrix, a U-shaped injection molding structure encapsulating the metal sheets by way of injection molding, a photosensitive chip having a plurality of bonding pads, wires, and a transparent layer. Each metal sheet includes a first board. The injection molding structure has a first molded body, a second molded body, and a cavity. The first boards are exposed from the injection molding structure to form signal input and output terminals, respectively. The chip is arranged within the cavity. The wires electrically connect the bonding pads to the signal input terminals, respectively. The transparent layer is arranged on a top of the first molded body to cover over the chip. The invention also discloses a method for manufacturing the image sensor.

Abstract translation: 与印刷电路板电连接的图像传感器的注模结构。 图像传感器包括以矩阵形式布置的金属片，通过注射成型封装金属片的U形注塑结构，具有多个接合焊盘，导线和透明层的感光芯片。 每个金属片包括第一板。 注塑结构具有第一成型体，第二成型体和空腔。 第一板从注塑结构露出，分别形成信号输入和输出端。 芯片布置在腔内。 导线分别将接合焊盘电连接到信号输入端子。 透明层设置在第一成型体的顶部上以覆盖芯片。 本发明还公开了一种用于制造图像传感器的方法。

公开(公告)号：US20040119005A1

公开(公告)日：2004-06-24

申请号：US10321608

申请日：2002-12-18

Applicant: LOCKHEED MARTIN CORPORATION

Inventor： Robert M. Krohn ,  James S. Howard ,  Glenn L. Kehley ,  Steven J. Pratt

IPC: H01J005/02

CPC classification number: H04N1/00013 ,  H04N1/00002 ,  H04N1/00031 ,  H04N1/00045 ,  H04N1/00053 ,  H04N1/00058 ,  H04N1/00087 ,  H04N1/193 ,  H04N17/002

Abstract: A new and improved line scan camera achieves the proper framing of the image field of view by using a first test card to calibrate the true bottom and leading edge portions of the test card which simulate the true bottom and leading portions of an article being scanned or photographed. Still further, the architecture of the electronic chip incorporated within the charge coupled device (CCD) of the camera effectively divides the linear array of pixels into a plurality of channels, and amplifier gain and black offset adjustments are made with respect to exposure levels, characteristic of the pixels disposed at the channel boundaries, under different degrees of input whiteness signals applied to a test card of a predetermined color shade, so as to achieve channel-to-channel seam matching. Subsequently, correction factors are effectively superimposed upon substantially all of the exposure levels characteristic of substantially all of the pixels comprising the line scan of the line scan camera such that true uniform exposure levels are in fact achieved.

Abstract translation: 新的和改进的线扫描相机通过使用第一测试卡来校准测试卡的真实底部和前缘部分来模拟正在扫描的物品的真实底部和前导部分，从而实现图像视场的适当构图， 拍照 另外，结合在照相机的电荷耦合器件（CCD）中的电子芯片的结构有效地将线性阵列阵列划分成多个通道，并且相对于曝光水平进行放大器增益和黑色偏移调整 在施加到预定色调的测试卡的不同程度的输入白度信号下，设置在通道边界处的像素，以实现通道到通道缝合匹配。 随后，校正因子有效地叠加在基本上所有的包括行扫描照相机的行扫描的像素的所有像素的曝光水平之上，实际上实现了真正的均匀曝光水平。

公开(公告)号：US20040016873A1

公开(公告)日：2004-01-29

申请号：US10448283

申请日：2003-05-30

Applicant: Matsushita Electric Works, Ltd.

Inventor： Shinobu Kida ,  Jun Tatsuta ,  Hiroyuki Yoshida ,  Mikio Masui

IPC: H01J040/14 ,  H01J005/02

CPC classification number: H01L33/62 ,  H01L24/45 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In a photoelectric device-part, a bonding pad is formed without increasing a plane area of a concave part for housing a photoelectric device to implement miniaturization and improvement of the light usability efficiency. A light reflecting surface 3 of nearly a parabola configuration or the like provided for light emission and reception by a photoelectric device 5 is formed on a slanting curved surface constituting a concave part 2 of a circuit substrate 1. A convex portion 9a projecting from the light reflecting surface 3 and a receding concave portion 9b are formed in the middle of the concave part 2. A stage 9 is formed by an upper and bottom surfaces of the convex and concave portions 9a and 9b, respectively. A bonding pad 7 for connecting circuits of the photoelectric device 5 is formed at the stage 9. Since a space for the bonding pad 7 is provided by both concave and convex portions, deformation of the light reflecting surface 3 caused by the receding concave portion 9b and a ratio of intrusion to the bottom surface of the concave part by the projecting convex portion 9a can be both minimized. As a result, the photoelectric device 5 can be mounted without largely lowering light emission efficiency or without decentering the light emitting and receiving center, whereby a photoelectric device-part 10 can be miniaturized.

Abstract translation: 在光电器件部分中，形成接合焊盘，而不增加用于容纳光电器件的凹部的平面面积，以实现光可用性效率的小型化和提高。 在构成电路基板1的凹部2的倾斜曲面上，形成由光电设备5发光和接收而设置的近抛光结构等的光反射面3。 反射面3和后退凹部9b形成在凹部2的中间。台9由凸部9a和凹部9b的上下面分别形成。 在阶段9中形成用于连接光电器件5的电路的接合焊盘7.由于凹凸部分由凹部和凸部两者提供，所以由后退凹部9b引起的光反射面3的变形 并且通过突出凸部9a侵入凹部的底面的比例能够最小化。 结果，可以安装光电器件5而不会大大降低发光效率，或者不会使发光和接收中心偏心，由此可以使光电器件部件10小型化。