公开(公告)号：US09957631B2

公开(公告)日：2018-05-01

申请号：US15038161

申请日：2014-12-11

申请人： NIPPON STEEL & SUMITOMO METAL CORPORATION ,  VALLOUREC OIL AND GAS FRANCE

发明人： Masanari Kimoto ,  Kazuya Ishii ,  Masahiro Oshima ,  Tatsuya Yamamoto

IPC分类号： C25D5/08 ,  C25D21/10 ,  C25D7/04 ,  C25D17/00 ,  C25D5/02 ,  C25D17/12 ,  C25D17/02

CPC分类号： C25D5/026 ,  C25D5/08 ,  C25D7/04 ,  C25D17/004 ,  C25D17/02 ,  C25D17/12

摘要： An electroplating apparatus applies an electroplated coating to a female thread formed on a pipe end portion of a steel pipe. The apparatus includes an inner seal member, a capsule, a discharge outlet, an opening, a cylindrical insoluble anode, a plating solution supply tube, and a plurality of nozzles. The seal member divides the interior of the steel pipe at a location longitudinally inward of a region on which the female thread is formed. The capsule is attached to the pipe end portion. The outlet is designed to discharge a plating solution inside the capsule therefrom. The opening facilitates discharge of the solution inside the capsule. The anode is disposed in the inside of the pipe end portion. The supply tube projects from an end of the anode. The nozzles eject a plating solution between the outer surface of the anode and the inner surface of the pipe end portion.

公开(公告)号：US09901865B2

公开(公告)日：2018-02-27

申请号：US15085496

申请日：2016-03-30

申请人： Chien-Hsun Chuang ,  Hsing-Hua Tsai

发明人： Chien-Hsun Chuang ,  Hsing-Hua Tsai

IPC分类号： B01D53/22 ,  B01D53/04 ,  C25D7/04 ,  C25D5/48 ,  C23C14/24 ,  C23C14/16 ,  B23K1/008 ,  C22F1/14 ,  C22C5/04 ,  C23C14/34 ,  B23K101/06 ,  B23K101/34

CPC分类号： B01D53/22 ,  B01D53/0407 ,  B01D2053/223 ,  B01D2253/1122 ,  B01D2256/16 ,  B01D2257/102 ,  B23K1/008 ,  B23K20/008 ,  B23K20/16 ,  B23K20/24 ,  B23K2101/06 ,  B23K2101/34 ,  B23K2103/04 ,  B23K2103/08 ,  B23K2103/18 ,  B23K2103/26 ,  C01B3/505 ,  C22C5/04 ,  C22F1/14 ,  C23C14/165 ,  C23C14/24 ,  C23C14/34 ,  C25D5/48 ,  C25D7/04

摘要： A structure of assembly grasp for palladium-alloy tubes and the manufacturing method thereof are described. The structure of assembly grasp for palladium-alloy tubes includes a grasp with a plurality of holes, a plurality of palladium-alloy tubes inserted into the plurality of holes, and an intermetallic compound layer between the palladium-alloy tubes and the inner sidewalls of the plurality of holes.

公开(公告)号：US09828863B2

公开(公告)日：2017-11-28

申请号：US14121919

申请日：2014-11-03

申请人： Howmet Corporation

发明人： Willard N. Kirkendall ,  Scott A. Meade ,  Donald R. Clemens

IPC分类号： F01D5/28 ,  C25D17/12 ,  F01D9/02 ,  C25D17/10 ,  C25D7/00 ,  F01D5/18 ,  C25D17/00 ,  C25D5/02 ,  C25D5/08 ,  C25D5/48 ,  C25D7/04 ,  C25D3/50

CPC分类号： F01D5/286 ,  C25D3/50 ,  C25D5/022 ,  C25D5/08 ,  C25D5/48 ,  C25D7/00 ,  C25D7/04 ,  C25D17/004 ,  C25D17/10 ,  C25D17/12 ,  F01D5/186 ,  F01D9/02 ,  F05D2230/31 ,  F05D2300/143 ,  F05D2300/1431 ,  F05D2300/175 ,  F05D2300/177

摘要： Method and apparatus are provided for electroplating a surface area of an internal wall defining a cooling cavity present in a gas turbine engine component.

公开(公告)号：US20170073833A1

公开(公告)日：2017-03-16

申请号：US15125314

申请日：2015-02-26

申请人： THINK LABORATORY CO., LTD.

发明人： Kazuhiro SUKENARI

IPC分类号： C25D17/12 ,  C25D3/38 ,  C25D5/04 ,  C25D3/04 ,  C25D7/04 ,  C25D17/06

CPC分类号： C25D17/12 ,  C25D3/04 ,  C25D3/38 ,  C25D5/04 ,  C25D7/00 ,  C25D7/04 ,  C25D17/06

摘要： Provided are a cylinder plating apparatus and a cylinder plating method, in which the distance between an insoluble electrode and a cylinder to be processed can be kept constant regardless of the diameter of the cylinder to be processed, and the surface area of the insoluble electrode is increased to reduce the current density of the insoluble electrode, thereby being capable of reducing burden on the insoluble electrode. The cylinder plating apparatus is configured to plate an outer peripheral surface of the cylinder to be processed in such a manner that a pair of the insoluble electrodes each having a shape in which at least a lower part thereof is curved inward and being constructed such that at least the lower part has a comb-like portion are brought close to both side surfaces of the cylinder to be processed with predetermined intervals. The insoluble electrodes face each other in a staggered pattern so that projections of the comb-like portion of one of the insoluble electrodes are located at positions of recesses of the comb-like portion of another one of the insoluble electrodes. The insoluble electrode is configured to rotate about an upper end of the insoluble electrode so that the distance of closeness of the insoluble electrode to the outer peripheral surface of the cylinder to be processed is adjustable depending on the diameter of the cylinder to be processed.

摘要翻译： 提供了一种圆筒镀覆装置和圆筒镀覆方法，其中不溶性电极和待处理圆筒之间的距离可以保持恒定，而不管待处理圆筒的直径如何，不溶性电极的表面积是 增加以降低不溶性电极的电流密度，从而能够减少不溶性电极的负担。 气缸电镀装置被构造成使待加工气缸的外周面以这样一种方式平板化：一对不溶性电极，每个不溶电极的至少其下部向内弯曲并被构造成使得在 至少下部具有梳状部分以预定的间隔靠近待处理气缸的两个侧表面。 不溶性电极以交错图案彼此面对，使得不溶性电极之一的梳状部分的突起位于另一个不溶性电极的梳状部分的凹部的位置。 不溶性电极被配置为围绕不溶性电极的上端旋转，使得不可溶电极与待处理气缸的外周表面的接近距离可根据待处理气缸的直径而调节。

公开(公告)号：US20170051422A1

公开(公告)日：2017-02-23

申请号：US15308107

申请日：2015-05-15

申请人： NIPPON STEEL & SUMITOMO METAL CORPORATION ,  VALLOUREC OIL AND GAS FRANCE

发明人： Masanari KIMOTO ,  Kazuya ISHII ,  Kunio GOTO ,  Tatsuya YAMAMOTO ,  Masahiro OSHIMA ,  Seiichiro NAKAO ,  Daisuke YAMAGUCHI

IPC分类号： C25D3/58 ,  C25D7/04 ,  F16L15/04 ,  C25D7/00

CPC分类号： C25D3/58 ,  C25D3/56 ,  C25D7/003 ,  C25D7/04 ,  F16L15/04

摘要： Provided is a plating solution for a threaded connection for pipe or tube used for forming a plating film excellent in galling resistance, crevice corrosion resistance, and exposure corrosion resistance. The plating solution for a threaded connection for pipe or tube of the present embodiment contains no cyanide, but contains: a water-soluble copper salt; a water-soluble tin salt; a water-soluble bismuth salt; a free acid; and a thiourea-based compound of 10 g/L or less (excluding 0) that is represented by Chemical Formula (1): X1X2N—C(═S)—NX3X4  (1), where each of X1, X2, X3, and X4 is any one of hydrogen, an alkyl group, an allyl group, a tolyl group, or a group represented by Chemical Formula (2), but excluding that X1, X2, X3, and X4 are all hydrogen: —CH2—CH2—S—CH2—CH2—X5  (2), where X5 is OH or NH2.

摘要翻译： 其中X 5是OH或NH 2。

公开(公告)号：US09556511B2

公开(公告)日：2017-01-31

申请号：US14205413

申请日：2014-03-12

申请人： Materion Corporation

发明人： William Guenley

IPC分类号： C23C14/34 ,  H01J37/34 ,  C25D5/10 ,  C25D5/36 ,  C25D7/00 ,  C25D7/04

CPC分类号： C23C14/3407 ,  C25D5/10 ,  C25D5/36 ,  C25D7/00 ,  C25D7/04 ,  H01J37/3417 ,  H01J37/3435 ,  H01J37/3491

摘要： A rotary sputtering target assembly and method of making the same including a target and a backing tube having a plated bonding surface. The backing tube and the target are bonded together along the plated bonding surface.

摘要翻译： 一种旋转溅射靶组件及其制造方法，包括具有电镀接合表面的靶和背衬管。 背衬管和靶沿着电镀接合面接合在一起。

公开(公告)号：US20160355942A1

公开(公告)日：2016-12-08

申请号：US15242491

申请日：2016-08-20

申请人： International Business Machines Corporation

发明人： Stefan Harrer ,  Stephen M. Rossnagel ,  Philip S. Waggoner

IPC分类号： C25D11/02 ,  C25D11/26 ,  C25D7/04 ,  B81C1/00

CPC分类号： C25D11/022 ,  B81C1/00071 ,  B81C2201/0114 ,  C25D7/04 ,  C25D11/26 ,  C25D11/34

摘要： Nanofluidic passages such as nanochannels and nanopores are closed or opened in a controlled manner through the use of a feedback system. An oxide layer is grown or removed within a passage in the presence of an electrolyte until the passage reaches selected dimensions or is closed. The change in dimensions of the nanofluidic passage is measured during fabrication. The ionic current level through the passage can be used to determine passage dimensions. Fluid flow through an array of fluidic elements can be controlled by selective oxidation of fluidic passages between elements.

摘要翻译： 纳米流体通道如纳米通道和纳米孔通过使用反馈系统以受控的方式封闭或打开。 在存在电解液的情况下，在通道内生长或除去氧化物层，直到通道达到所选尺寸或闭合。 在制造过程中测量纳米流体通道的尺寸变化。 通过通道的离子电流水平可用于确定通道尺寸。 通过流体元件阵列的流体流动可以通过元件之间的流体通道的选择性氧化来控制。

公开(公告)号：US09498933B2

公开(公告)日：2016-11-22

申请号：US13521037

申请日：2010-12-28

申请人： Tatsuo Tomomori ,  Koh Yoshioka

发明人： Tatsuo Tomomori ,  Koh Yoshioka

IPC分类号： B32B15/01 ,  C25D5/14 ,  C25D5/18 ,  H01M2/08 ,  H01M2/02 ,  C25D3/12 ,  C25D5/12 ,  C25D7/04 ,  C25D21/12 ,  B21D31/00 ,  C25C3/12 ,  C25D5/36

CPC分类号： H01M2/0287 ,  B21D31/00 ,  B32B1/08 ,  B32B15/015 ,  B32B15/018 ,  B32B2457/10 ,  B32B2597/00 ,  C25C3/12 ,  C25D3/12 ,  C25D5/12 ,  C25D5/14 ,  C25D5/18 ,  C25D5/36 ,  C25D5/50 ,  C25D7/04 ,  C25D7/0614 ,  C25D21/12 ,  H01M2/0285 ,  Y10T428/12944

摘要： Provided are a surface-treated metal sheet which includes a nickel layer having improved corrosion resistance and a method of manufacturing a formed article. In a surface-treated metal sheet where a nickel layer is formed on a substrate, the proportion of (200) planes to a total of (111) planes, (200) planes, (220) planes and (311) planes with respect to the crystal plane orientations of the nickel layer is set to 40% or less. In a method of manufacturing a formed article using a surface-treated metal sheet where a nickel layer is formed on a substrate, the surface-treated metal sheet having the nickel layer where the proportion of (200) planes to a total of (111) planes, (200) planes, (220) planes and (311) planes is set to 40% or less with respect to the crystal plane orientations of the nickel layer is worked using a mold.

摘要翻译： 提供一种表面处理金属片，其包括具有改善的耐腐蚀性的镍层和制造成型制品的方法。 在基板上形成镍层的表面处理金属片中，（200）面相对于（111）面，（200）面，（220）面和（311）面的总和 镍层的晶面取向为40％以下。 在使用在基板上形成有镍层的表面处理金属板的成形体的制造方法中，具有（200）面的比例为（111）〜（111）的表面处理金属板， 使用模具来加工相对于镍层的晶面取向的平面，（200）面，（220）面和（311）面的40％以下。

公开(公告)号：US20160329075A1

公开(公告)日：2016-11-10

申请号：US15213907

申请日：2016-07-19

申请人： MicroContinuum, Inc.

发明人： W. Dennis Slafer

IPC分类号： G11B7/26 ,  B29C59/04 ,  C25D1/02 ,  C25D1/10 ,  C25D3/12 ,  C25D3/46 ,  C25D3/48 ,  C25D3/04 ,  C25D5/02 ,  C25D7/04 ,  C25D17/06 ,  C25D21/02 ,  C25D21/06 ,  C25D21/10 ,  B29C33/38

摘要： Durable seamless replication tools are disclosed for replication of seamless relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including preparing a recording substrate on the inner surface of a support cylinder, recording and developing a relief pattern in the substrate, creating a durable negative relief replica of the pattern, extracting the resulting durable tool sleeve from a processing cell, and mounting the tool sleeve on a mounting fixture. Apparatus are disclosed for fabricating such seamless replication tools, including systems for recording a desired relief pattern on a photosensitive layer on an inner surface of a support cylinder. Also disclosed are electrodeposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.

摘要翻译： 公开了耐久的无缝复制工具，用于在期望的介质（例如光学记录或数据存储介质）中复制无缝浮雕图案。 公开了制造这种耐用的复制工具的方法，包括在支撑圆筒的内表面上制备记录基底，在基底中记录和显影浮雕图案，形成图案的耐久的负浮雕复制品，提取所得到的耐用的工具套 并且将工具套筒安装在安装夹具上。 公开了用于制造这种无缝复制工具的装置，包括用于在支撑筒的内表面上的感光层上记录期望的浮雕图案的系统。 还公开了用于形成具有期望的浮雕图案的耐用工具套筒的电沉积池。 复制工具浮雕功能可能具有至微米和纳米方面的关键尺寸。

公开(公告)号：US09487881B2

公开(公告)日：2016-11-08

申请号：US13184675

申请日：2011-07-18

申请人： Shu Chuen Ho ,  Kai Fat Yip ,  Eng Cheng Chng ,  Yew Lan Ngo ,  Saravana Ranganathan Damodaran

发明人： Shu Chuen Ho ,  Kai Fat Yip ,  Eng Cheng Chng ,  Yew Lan Ngo ,  Saravana Ranganathan Damodaran

IPC分类号： C25D5/02 ,  C25D7/04 ,  C25D17/12 ,  C25D17/06 ,  C25D1/02 ,  C25D17/00

CPC分类号： C25D17/001 ,  C25D17/06 ,  C25D17/12

摘要： An apparatus is disclosed for electroplating an inside wall of a transfer mold, the transfer mold being suitable for use in semiconductor device encapsulation. Specifically, the apparatus comprises a fixture, as well as a through-hole in the fixture for receiving an electrode to electroplate the inside wall of the transfer mold. In particular, the through-hole is configured to receive the electrode in a slide-fit to form a mutual interference fit for securing the electrode to the fixture. Upon fitting the electrode into the through-hole, the apparatus can then be used to electroplate the inside wall of the transfer mold by introducing the electrode into the space adjacent to the inside wall of the transfer mold. A device for use as an electrode in the apparatus is also disclosed.

摘要翻译： 公开了一种用于电镀转移模具的内壁的装置，该转移模具适用于半导体器件封装。 具体地，该装置包括固定装置，以及夹具中的通孔，用于接收用于电镀转移模具的内壁的电极。 特别地，通孔被配置为以滑动配合接收电极以形成用于将电极固定到固定装置上的相互干涉配合。 在将电极安装到通孔中之后，该装置可用于通过将电极引入与转移模具的内壁相邻的空间中来电镀转移模具的内壁。 还公开了一种在装置中用作电极的装置。