公开(公告)号：US06554179B2

公开(公告)日：2003-04-29

申请号：US09900252

申请日：2001-07-06

申请人： Mervyn H. Horner ,  Paul W. Trester ,  Peter G. Valentine

发明人： Mervyn H. Horner ,  Paul W. Trester ,  Peter G. Valentine

IPC分类号： B23K3102

CPC分类号： H01J9/02 ,  B23K35/001 ,  B23K35/005 ,  B23K35/327 ,  C04B35/5622 ,  C04B35/5626 ,  C04B35/5805 ,  C04B37/00 ,  C04B37/026 ,  C04B2235/3813 ,  C04B2235/3839 ,  C04B2235/3847 ,  C04B2235/404 ,  C04B2235/422 ,  C04B2235/6581 ,  C04B2235/9607 ,  C04B2237/122 ,  C04B2237/36 ,  C04B2237/363 ,  C04B2237/385 ,  C04B2237/403 ,  C04B2237/525 ,  H01J35/08 ,  H01J2235/083

摘要： Reaction-brazing of tungsten or molybdenum metal bodies to carbonaceous supports enables an x-ray generating anode to be joined to a preferred lightweight substrate. Complementary surfaces are provided on a dense refractory metal body and a graphite or a carbon-carbon composite support. A particulate braze mixture comprising Hf or Zr carbide, Mo or W boride, Hf or Zr powder and Mo or W powder is coated onto the support surface, and hafnium or zirconium foil may be introduced between the braze mixture and the refractory metal body complementary surface. Reaction-brazing is carried out at or near the eutectic point of the components, which may be influenced to some extent by the presence of carbon and boride. Heating to about 1865° C. for a Mo/Hf combination creates a thin, dense, strong braze that securely joins the two bodies and creates a thin barrier of carbide and boride microphases near and along the interface with the carbon support that diminishes carbon diffusion into the metal body during extended exposures at elevated temperatures (above those presently used in x-ray tubes), even well above the eutectoid temperature.

摘要翻译： 钨或钼金属体对碳质载体的反应钎焊使得x射线产生阳极能够接合到优选的轻质基底上。 互补表面设置在致密的耐火金属体和石墨或碳 - 碳复合材料载体上。 包含Hf或Zr碳化物，Mo或W硼化物，Hf或Zr粉末和Mo或W粉末的颗粒状钎焊混合物涂覆在载体表面上，并且铪或锆箔可以引入钎焊混合物和难熔金属体互补表面 。 反应钎焊在组分的共晶点处或附近进行，这可能在一定程度上受到碳和硼化物的存在的影响。 对于Mo / Hf组合，加热至约1865℃产生薄而致密的强钎焊，其牢固地连接两个主体，并且在与碳载体的界面附近和沿着碳载体的界面产生薄碳屏障和硼化物微相，从而减少碳扩散 在升高的温度（高于目前在x射线管中使用的那些）下延伸曝光时，甚至远高于共析温度，进入金属体。

公开(公告)号：US06550668B2

公开(公告)日：2003-04-22

申请号：US09850398

申请日：2001-05-07

申请人： Larry J. Costa

发明人： Larry J. Costa

IPC分类号： B23K3102

CPC分类号： B23K3/085 ,  B23K3/087

摘要： A method and system for instantaneous heat-sink soldering comprising a gripper device, an intense heat source, and an air-jet cooling system is provided for soldering terminals to structures of dissimilar material composition. The gripper device is adapted to secure the terminal between a pair of jaws and selectively position the terminal closely adjacent the structure. The jaws further serve as heat sinks to continually remove residual heat from the terminal, both during and after the application of heat to the terminal. Upon termination of the heat application, air-jet cooling is provided to the terminal to quickly cool the terminal and the molten layer of solder. The method of rapidly heating and cooling the terminal and layer of solder prevents the annealing of certain silica substrates and provides better solder connections.

公开(公告)号：US06550665B1

公开(公告)日：2003-04-22

申请号：US09876780

申请日：2001-06-06

申请人： William J. Parrish ,  Jeffrey B. Barton

发明人： William J. Parrish ,  Jeffrey B. Barton

IPC分类号： B23K3102

CPC分类号： H01L24/81 ,  B23K35/26 ,  H01L21/563 ,  H01L24/28 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/01031 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/0665

摘要： Methods of forming arrays of electrical interconnects between substrates are provided. These methods allow the use of large interconnect bump arrays to physically and electrically connect substrates without the need to use excess pressure on the substrates to form the interconnects, thus reducing damage to the substrates. To form the interconnects, an array of bumps is formed on a first substrate from a material that forms a eutectic composition with a second material. An array of bumps composed of the second material is formed on the second substrate. The arrays are aligned and the bumps contacted at a temperature above the eutectic temperature of the eutectic composition. Each of the bumps on the first substrate melts and diffuises into the corresponding bumps on the second substrate to form the interconnects.

摘要翻译： 提供了在基板之间形成电互连阵列的方法。 这些方法允许使用大的互连凸点阵列来物理和电连接衬底，而不需要在衬底上使用过量的压力来形成互连，从而减少对衬底的损伤。 为了形成互连，从第二材料形成共晶组合物的材料在第一衬底上形成凸起阵列。 由第二材料构成的凸起阵列形成在第二基板上。 将阵列对准，并且凸块在高于共晶组成的共晶温度的温度下接触。 第一基板上的每个凸起熔化并扩散到第二基板上的相应凸块中以形成互连。

公开(公告)号：US06527162B2

公开(公告)日：2003-03-04

申请号：US09907599

申请日：2001-07-19

申请人： Makoto Totani ,  Toshihiro Miyake ,  Tomohiro Yokochi ,  Takehito Teramae ,  Yoshitaro Yazaki ,  Kazuyuki Deguchi ,  Hajime Nakagawa

发明人： Makoto Totani ,  Toshihiro Miyake ,  Tomohiro Yokochi ,  Takehito Teramae ,  Yoshitaro Yazaki ,  Kazuyuki Deguchi ,  Hajime Nakagawa

IPC分类号： B23K3102

CPC分类号： H05K3/363 ,  H05K3/3452 ,  H05K3/3494 ,  H05K2201/0129 ,  H05K2201/091 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10772 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/065

摘要： Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

公开(公告)号：US06513702B2

公开(公告)日：2003-02-04

申请号：US09983188

申请日：2001-10-23

申请人： Shohei Mawatari

发明人： Shohei Mawatari

IPC分类号： B23K3102

CPC分类号： B23K3/0653

摘要： An automatic wave soldering apparatus includes a solder reservoir for holding a supply of molten solder and a solder nozzle vertically disposed in the solder reservoir to establish a solder wave through which a printed circuit board is moved. A pair of trapezoidal elements are secured within the nozzle. A Y-shaped baffle is disposed between the trapezoidal elements to form upwardly inclined narrowed upstream and downstream outlets. The upstream and downstream outlets are inclined at an acute angle against and in the direction of movement of the printed circuit board, respectively. A pair of valves are disposed at opposite sides of the baffle to selectively open and close the outlets. The bottom side of each of the trapezoidal elements forms a step to promote turbulence in the solder wave. The trapezoidal elements and the baffle collectively serve to increase the flow velocity of the molten solder through the outlets.

摘要翻译： 自动波峰焊装置包括用于保持熔融焊料供应的焊料储存器和垂直设置在焊料储存器中的焊接喷嘴，以建立移动印刷电路板的焊料波。 一对梯形元件固定在喷嘴内。 Y形挡板设置在梯形元件之间以形成向上倾斜的变窄的上游和下游出口。 上游和下游出口分别相对于印刷电路板的移动方向倾斜成锐角。 一对阀设置在挡板的相对侧，以选择性地打开和关闭出口。 每个梯形元件的底侧形成了促进焊波中的湍流的步骤。 梯形元件和挡板共同用于增加熔融焊料通过出口的流速。

公开(公告)号：US06494357B2

公开(公告)日：2002-12-17

申请号：US09876806

申请日：2001-06-07

申请人： Michael B. Ball

发明人： Michael B. Ball

IPC分类号： B23K3102

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K2101/40 ,  H01L21/4825 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05553 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  Y10S269/903 ,  H01L2924/00014 ,  H01L2924/00

摘要： An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provide for the use of either a penetrating or nonpenetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The apparatus and method contemplate the replacement of the penetrating fixed clamp with another, or second, penetrating independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.

摘要翻译： 一种在半导体器件上的接触焊盘和引线框架的单个引线框架指状物之间形成改进的引线接合的装置和方法。 该装置和方法包括在引线接合过程期间使用穿透的独立的独立引线夹，以提供单独的引线指针的增强的稳定性，以通过夹具穿过被接合的引线的一部分来改善接合。 如果需要，该装置和方法还提供了在引线接合过程期间使用穿透或非穿透性固定夹子用于引线指，除了在引线接合过程期间穿透的独立引导夹具以提供增强的稳定性 单个引线用于改善粘合。 该设备和方法除了在引线接合过程中的第一独立引导夹具之外，考虑用另一个或第二个穿透的独立夹具替换穿透固定夹具。

公开(公告)号：US06488199B1

公开(公告)日：2002-12-03

申请号：US09674939

申请日：2000-12-29

申请人： Jürgen Schwaiger ,  Rolf Becker

发明人： Jürgen Schwaiger ,  Rolf Becker

IPC分类号： B23K3102

CPC分类号： H05K3/403 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/248 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/035 ,  H05K2201/09181 ,  H05K2201/10909 ,  Y02P70/613

摘要： A method for increasing the manufacturing certainty of soldered connections between a ceramic carrier and a printed-circuit board. It includes the method step of applying a first decomposition-resistant metallization layer on a ceramic carrier and the subsequent imprinting onto the first metallizing layer of a second metallizing layer, improving the wetting performance. In this manner, it is possible to achieve an increase in the overall metallizing layer thickness in the edge area of a soldered connection, whose solder rise in turn makes possible an optical, fully-automatic monitoring of the soldered connection.

摘要翻译： 一种用于增加陶瓷载体和印刷电路板之间的焊接连接的制造确定性的方法。 其包括在陶瓷载体上施加第一耐分解金属化层的方法步骤，以及随后的压印到第二金属化层的第一金属化层上，改善润湿性能。 以这种方式，可以实现焊接连接的边缘区域中的整体金属化层厚度的增加，其焊料上升反过来使得焊接连接的光学全自动监控成为可能。

公开(公告)号：US06467679B2

公开(公告)日：2002-10-22

申请号：US09912960

申请日：2001-07-25

申请人： Ryuichi Kyomasu ,  Fumio Miyano ,  Toshihiko Toyama

发明人： Ryuichi Kyomasu ,  Fumio Miyano ,  Toshihiko Toyama

IPC分类号： B23K3102

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/26 ,  B23K37/003 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85048 ,  H01L2224/85075 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

摘要： A wire bonding apparatus equipped with a chip heating assembly which is installed above a heater block that contains heaters so as to heat the chip portion of a device such as a semiconductor device, and a cooling pipe which is installed in the heater block so as to cool the heater block. The temperature of the bonding surface of the device is maintained by the chip heating assembly at a temperature that allows bonding to be executed while the heater block is cooled by cooling water or a cooling air draft that flows through the cooling pipe so that the temperature of the heater block is maintained at a low temperature that cause no softening of the resin substrate of the device.

摘要翻译： 一种装配有芯片加热组件的引线接合装置，其安装在加热器块的上方，该加热器块包含加热器，以加热诸如半导体器件的器件的芯片部分，以及安装在加热器块中的冷却管，以便 冷却加热器块。 装置的接合表面的温度由芯片加热组件保持在允许结合进行的温度，同时加热器块通过冷却水冷却或冷却空气通过冷却管道，使得温度 加热器块保持在不会使装置的树脂基板软化的低温下。

公开(公告)号：US06467672B2

公开(公告)日：2002-10-22

申请号：US09944470

申请日：2001-08-30

申请人： Michael B. Ball ,  Rich Fogal

发明人： Michael B. Ball ,  Rich Fogal

IPC分类号： B23K3102

CPC分类号： H01L24/85 ,  B23K3/0623 ,  B23K20/004 ,  B23K2101/40 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.

摘要翻译： 引线接合机包括用于在引线接合期间支撑引线框的热块。 机器中的夹紧机构在引线接合期间通过将引线的组合固定地固定在一次一组的热块上来夹紧引线框架的引线。 引线接合工具将由夹紧机构夹紧的引线接合，以将集成电路管芯上的焊盘接合。 通过将引线框架的引线夹在不同的套件中，该机器可以提供针对需要在不同平面上夹紧的引线框架的改进夹紧。

公开(公告)号：US06454160B2

公开(公告)日：2002-09-24

申请号：US09726015

申请日：2000-11-30

申请人： François Gueissaz

发明人： François Gueissaz

IPC分类号： B23K3102

CPC分类号： B81C1/00293 ,  H01L21/50 ,  H01L23/10 ,  H01L23/315 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/3025 ,  H01L2924/00

摘要： The method for hermetically encapsulating microsystems in situ consists, in a first phase, of mounting on a common substrate (1), several microsystems (6) surrounded by a metal adhesion layer (4) deposited on the substrate (1). In a second phase, in a common deposition step a first metal layer (7) is deposited by electrolytic means on each microsystem (6) and on an annular zone (7a) of the adhesion layer (4) surrounding each microsystem (6), so as to completely cover each microsystem by overlap. Subsequently a second metal layer (9) is deposited by electrolytic means on the first metal layer (7) and on the adhesion layer so as to cover most of the first layer with the exception of at least one passage (10) per microsystem (6), providing access to the first layer (7). The metal of the first layer is different from the metals of the adhesion layer, the second layer and the microsystem. The first layer (7) is removed by selective chemical etching through the passages (10) which are closed to obtain metal capsules hermetically enclosing each microsystem.

摘要翻译： 原位气密封装微系统的方法包括在第一阶段中安装在公共衬底（1）上，由沉积在衬底（1）上的金属粘附层（4）围绕的几个微系统（6）。 在第二阶段中，在公共沉积步骤中，第一金属层（7）通过电解装置沉积在每个微系统（6）上以及围绕每个微系统（6）的粘附层（4）的环形区域（7a）上， 以便通过重叠来完全覆盖每个微系统。 随后，通过电解装置将第二金属层（9）沉积在第一金属层（7）上和粘合层上，以覆盖大部分第一层，除了每个微系统的至少一个通道（10）（6 ），提供对第一层（7）的访问。 第一层的金属与粘合层，第二层和微系统的金属不同。 通过选择性化学蚀刻通过封闭的通道（10）去除第一层（7），以获得密封地包围每个微系统的金属胶囊。