Abstract:
A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer.
Abstract:
A packaged device includes a device substrate and a packaging unit. The device substrate includes a first surface and a device formed in the device substrate. The packaging unit includes an insulating layer which faces the device substrate. The insulating layer includes a second surface bonded to the first surface. A metal concentration of at least part of a peripheral surface in the insulating layer is higher than a metal concentration of an end surface on the device substrate side in the insulating layer. An outline of the first surface is retreated inward from an outline of the second surface.
Abstract:
Each of transducers of a touch panel device includes a piezoelectric thin film, a plate electrode disposed at one surface of the piezoelectric thin film and a comb-like electrode disposed at the other surface of the piezoelectric thin film. The comb-like electrode has a plurality of comb-like electrode fingers and a linear bus electrode to which one end of each of the plural comb-like electrode fingers is connected. A plurality of wiring electrodes is provided at the outer side of any of the transducers in parallel with the bus electrode of the transducer and is connected to the bus electrode and the plate electrode of any of the transducers. Each of the wiring electrodes includes an electrode base portion formed by printing silver paste containing fine particles on the substrate and an electrode main body formed by printing silver paste containing large particles and fine particles in a mixed manner on the electrode base portion.
Abstract:
A vibration sensor includes a tuning-fork vibrator having a base and arms extending from the base, a mounting portion for mounting the tuning-fork vibrator, and a supporting member that mounts the tuning-fork vibrator on the mounting portion and has a narrow portion.
Abstract:
A vibration sensor includes a tuning-fork vibrator having a base and arms extending from the base, a mounting portion for,mounting the tuning-fork vibrator, and multiple supporting members that mount the tuning-fork vibrator on the mounting portion.
Abstract:
A piezoelectric device (X) includes a substrate (11) a piezoelectric film (12), a first electrode (13), and a second electrode (14). At least one of the first electrode (13) and the second electrode (14) is interposed between the substrate (11) and the piezoelectric film (12), and made of an Al alloy containing 0.1 to 3 wt % of at least one metal selected from the group consisting of Ti, Cr, Ni, Cu, Zn, Pd, Ag, Hf, W, Pt and Au.
Abstract:
A transducer for excitation including two electrode, and at least one of the two electrodes is a comb-like electrode including a plurality of comb-like electrode fingers and a linear bus electrode to which one end of each of the plural comb-like electrode finger is connected. When dividing the transducer into two areas in the length direction of the bus electrode, at least one connection portion for one of the two electrodes is disposed in one of the two areas, while at least one connection portion for the other electrode is disposed in the other area.
Abstract:
A piezoelectric element includes a substrate, a lower electrode on the substrate, a piezoelectric layer on the lower electrode, and an upper electrode on the piezoelectric layer. The upper electrode includes a common base and a plurality of parallel branches extending from the base. The branches are arranged at a regular interval or pitch λ1. The lower electrode faces the branches of the upper electrode via the piezoelectric layer. The thickness h of the piezoelectric layer and the branch pitch λ1 are determined to satisfy an inequality 0.005≦h/λ1≦0.1. The lower electrode has a hillock occurrence rate which is no greater than 0.1%.
Abstract:
An image reader apparatus includes an illuminating element to illuminate a document face to be read, an optical element to form an image of the document face illuminated by the illuminating element, an image sensor to photoelectrically convert the image formed by light passing through the optical element, and a running roller rotating in contact with the document face, wherein a horizontal distance between a document contact portion of the running roller where the running roller contacts the document and a center of imaging of the optical element is shorter than or equal to 10 mm.
Abstract:
A method of manufacturing a semiconductor apparatus according to aspects of the invention can include the steps of coating solder on an predetermined area in the upper surface of a lead frame, mounting a chip on solder and melting solder with a hot plate for bonding the chip to the lead frame. The method can also include wiring with bonding wires, turning lead frame upside down, placing lead frame turned upside down on heating cradle, coating solder, the melting point of which is lower than the solder melting point and mounting electronic part on solder; and melting solder with heating cradle for bonding electronic part to lead frame. The bonding with solder can be conducted at a high ambient temperature. Aspects of the semiconductor apparatus can facilitate mounting semiconductor devices and electronic parts on both surfaces of a lead frame divided to form wiring circuits without through complicated manufacturing steps.