Abstract:
Compounds of formula (I): ##STR1## [wherein X represents a hydrogen atom or a 2-methylbutyryl group, Y represents a hydrogen atom or a methyl group and R.sup.1 and R.sup.2 are the same or different and each represents an oxygen atom or a group of formula .dbd.N--OR.sup.3 (wherein R.sup.3 represents a hydrogen atom or an alkyl group)], the free hydroxy-carboxylic acids corresponding thereto and salts and esters of said acids may be prepared by oxidizing and, if necessary, oximating a corresponding ML-236A, ML-236B, MB-530A or MB-530B compound, and these compounds have valuable antihypercholesteraemic activity.
Abstract:
A circuit for exciting an ultrasonic transducer element comprises a diode switch exhibiting a long reverse recovery time duration connected between an input and an output terminal. A transducer exciting signal varying in both positive and negative directions and applied to the input terminal is conducted to the output terminal through the diode switch.
Abstract:
A one-way clutch comprises rollers disposed respectively in a plurality of wedge-shaped spaces defined between an outer ring provided with a plurality of clutch slopes on its inner peripheral surface and the cylindrical outer peripheral surface of a shaft or inner ring, S-shaped spring members lightly pressing the rollers against the wedge surfaces, and bearing rings installed between the outer ring and the shaft or inner ring and on opposite sides of the rollers.
Abstract:
Physiologically active substances ML-236 of the formula ##STR1## wherein R is hydrogen atom, hydroxy group or 2-methyl-butyryloxy group having cholesterol- and lipid-lowering effects in blood and liver and thus utility as hypocholesteremic and hypolipemic medicaments. They are obtained by cultivation of an ML-236-producing micro-organism belonging to the genus Penicillium in a culture medium and subsequent recovery thereof from a cultured broth.
Abstract:
A method for manufacturing a wiring board which can simplify a manufacturing step. In a preparation step, a core board and an electronic component are prepared. In an insulating layer formation and fixing step, after accommodating the electronic component in an accommodation hole, a lowermost resin insulating layer is formed, and a gap between the electronic component and the core board is filled with a part of the lowermost resin insulating layer so as to fix the electronic component to the core board. In an opening portion formation step, a portion of the lowermost resin insulating layer located directly above the gap between the electronic component and the core board is removed so as to form an opening portion exposing a part of a core board main surface side conductor and a component main surface side electrode. In a main surface side connecting conductor formation step, a main surface side connecting conductor is formed in the opening portion so as to connect the core board main surface side conductor to the component main surface side electrode.
Abstract:
In a multi-layer wiring board having a strip line structure in which a grounding conductor wiring and a signal circuit wiring are disposed by interposing therebetween an insulation layer, the grounding conductor wiring is in the form of a grid and an open area ratio Rx [%]of the grid and a line width ratio Ry=Wg/Ws have a relationship expressed by Ry, .ltoreq.25.98.times.Rx.sup.-0.3871 -4.370 where Wg is the line width of the grounding conductor wiring, Sg is the width of an opening of the grid, Ws is the line width of the signal circuit wiring, and Rx={Sg/(Wg+Sg)}.sup.2 .times.100.
Abstract:
Compounds of formula (I): ##STR1## in which R is hydrogen, methyl or hydroxy; X is alkyl, alkenyl, cycloalkyl, aryl or aralkyl; A is a single bond or alkylene, alkenylene, alkynylene or alkadienylene and Y is aryl. The compounds have valuable antihypercholesteremic activities and can be used in the treatment of disorders arising from a blood cholesterol imbalance in humans and animals.
Abstract:
An object of the present invention is to match impedance of each portion of whole lines of a signal wiring with the integrated circuit mounted on the package. All ground planes are deleted within a region vertically under/above a connection pad provided on the top- or bottom-surface of a polyimide multilayer part, whereby no capacitance is generated between the connection pad and the ground planes, so that the impedance of the signal wiring within the region right under/above the connection pad is prevented from being lowered.
Abstract:
The present integrated circuit package provides both a high density of conductor poles, and reduced crosstalk noise between the conductor poles. The conductor poles are arranged within a selected number of holes in an insulating substrate. Metallized layers for shielding the conductor poles are provided on the walls of the holes in the insulating substrate which receive the conductor poles. In addition, an insulating layer is provided on the inner circumferences of the metallized layers, which insulating layers directly surround the conductor poles to preclude direct contact between the conductor poles and the metallized layers.
Abstract:
Monacolin K, which is an antihypercholesteraemic agent of molecular formula C.sub.24 H.sub.36 O.sub.5, is prepared by cultivating one or more of the microorganisms Monascus anka SANK 10171 (IFO 6540), Monascus purpureus SANK 10271 (IFO 4513), Monascus ruber SANK 10671 (FERM 4958), Monascus vitreus SANK 10960 (FERM 4960), Monascus paxii SANK 11172 (IFO 8201), Monascus ruber SANK 13778 (FERM 4959), Monascus ruber SANK 15177 (FERM 4956) or Monascus ruber SANK 18174 (FERM 4957) in a suitable culture medium and then isolating the Monacolin K from the resulting culture broth.