One-way clutch
    33.
    发明授权
    One-way clutch 失效
    单向离合器

    公开(公告)号:US4236619A

    公开(公告)日:1980-12-02

    申请号:US954595

    申请日:1978-10-25

    Applicant: Masao Kuroda

    Inventor: Masao Kuroda

    CPC classification number: F16D41/067 F16C17/26 F16C33/14

    Abstract: A one-way clutch comprises rollers disposed respectively in a plurality of wedge-shaped spaces defined between an outer ring provided with a plurality of clutch slopes on its inner peripheral surface and the cylindrical outer peripheral surface of a shaft or inner ring, S-shaped spring members lightly pressing the rollers against the wedge surfaces, and bearing rings installed between the outer ring and the shaft or inner ring and on opposite sides of the rollers.

    Abstract translation: 单向离合器包括分别设置在多个楔形空间中的多个楔形空间,所述多个楔形空间限定在其内周表面上设置有多个离合器斜面的外圈和轴或内圈的圆柱形外周表面之间,S形 弹簧构件轻轻地将辊压靠在楔形表面上,以及安装在外圈与轴或内圈之间以及辊的相对侧上的轴承环。

    Method for manufacturing wiring board
    35.
    发明授权
    Method for manufacturing wiring board 有权
    线路板制造方法

    公开(公告)号:US07704548B2

    公开(公告)日:2010-04-27

    申请号:US11739798

    申请日:2007-04-25

    Abstract: A method for manufacturing a wiring board which can simplify a manufacturing step. In a preparation step, a core board and an electronic component are prepared. In an insulating layer formation and fixing step, after accommodating the electronic component in an accommodation hole, a lowermost resin insulating layer is formed, and a gap between the electronic component and the core board is filled with a part of the lowermost resin insulating layer so as to fix the electronic component to the core board. In an opening portion formation step, a portion of the lowermost resin insulating layer located directly above the gap between the electronic component and the core board is removed so as to form an opening portion exposing a part of a core board main surface side conductor and a component main surface side electrode. In a main surface side connecting conductor formation step, a main surface side connecting conductor is formed in the opening portion so as to connect the core board main surface side conductor to the component main surface side electrode.

    Abstract translation: 一种制造布线板的方法,其可以简化制造步骤。 在准备步骤中,制备核心板和电子部件。 在绝缘层形成和定影步骤中,在将电子部件容纳在容纳孔中之后,形成最下层的树脂绝缘层,并且用最下层的树脂绝缘层的一部分填充电子部件与芯板之间的间隙 以将电子部件固定到核心板。 在开口部形成工序中,除去位于电子部件与芯板之间的间隙正上方的最下层树脂绝缘层的一部分,以形成露出芯板主面侧导体和 部件主表面侧电极。 在主表面侧连接导体形成步骤中,在开口部分形成主表面侧连接导体,以将芯板主表面侧导体连接到部件主表面侧电极。

    Multi-layer wiring board
    36.
    发明授权
    Multi-layer wiring board 失效
    多层接线板

    公开(公告)号:US5479138A

    公开(公告)日:1995-12-26

    申请号:US364041

    申请日:1994-12-27

    Abstract: In a multi-layer wiring board having a strip line structure in which a grounding conductor wiring and a signal circuit wiring are disposed by interposing therebetween an insulation layer, the grounding conductor wiring is in the form of a grid and an open area ratio Rx [%]of the grid and a line width ratio Ry=Wg/Ws have a relationship expressed by Ry, .ltoreq.25.98.times.Rx.sup.-0.3871 -4.370 where Wg is the line width of the grounding conductor wiring, Sg is the width of an opening of the grid, Ws is the line width of the signal circuit wiring, and Rx={Sg/(Wg+Sg)}.sup.2 .times.100.

    Abstract translation: 在具有带状结构的多层布线板中,其中接地导体布线和信号电路布线之间设置有绝缘层,所述接地导体布线为格栅形式,开口面积比Rx [ %],线宽比Ry = Wg / Ws具有由Ry表示的关系,其中Wg是接地导体布线的线宽,Sg是开口的宽度, Ws是信号电路布线的线宽,Rx = {Sg /(Wg + Sg)}×100×100。

    Integrated circuit package and process for producing same
    39.
    发明授权
    Integrated circuit package and process for producing same 失效
    集成电路封装及其制造方法

    公开(公告)号:US5286926A

    公开(公告)日:1994-02-15

    申请号:US868568

    申请日:1992-04-15

    Abstract: The present integrated circuit package provides both a high density of conductor poles, and reduced crosstalk noise between the conductor poles. The conductor poles are arranged within a selected number of holes in an insulating substrate. Metallized layers for shielding the conductor poles are provided on the walls of the holes in the insulating substrate which receive the conductor poles. In addition, an insulating layer is provided on the inner circumferences of the metallized layers, which insulating layers directly surround the conductor poles to preclude direct contact between the conductor poles and the metallized layers.

    Abstract translation: 本集成电路封装提供高密度的导体极,并减少导体极之间的串扰噪声。 导体极被布置在绝缘基板中的选定数量的孔内。 用于屏蔽导体极的金属化层设置在接收导体极的绝缘基板中的孔的壁上。 此外,绝缘层设置在金属化层的内周上,这些绝缘层直接围绕导体极,以防止导体极与金属化层之间的直接接触。

    Preparation of Monacolin K
    40.
    发明授权
    Preparation of Monacolin K 失效
    莫纳可林K的制备

    公开(公告)号:US4323648A

    公开(公告)日:1982-04-06

    申请号:US137821

    申请日:1980-04-04

    CPC classification number: C12P17/06 C07D309/30 Y10S435/911

    Abstract: Monacolin K, which is an antihypercholesteraemic agent of molecular formula C.sub.24 H.sub.36 O.sub.5, is prepared by cultivating one or more of the microorganisms Monascus anka SANK 10171 (IFO 6540), Monascus purpureus SANK 10271 (IFO 4513), Monascus ruber SANK 10671 (FERM 4958), Monascus vitreus SANK 10960 (FERM 4960), Monascus paxii SANK 11172 (IFO 8201), Monascus ruber SANK 13778 (FERM 4959), Monascus ruber SANK 15177 (FERM 4956) or Monascus ruber SANK 18174 (FERM 4957) in a suitable culture medium and then isolating the Monacolin K from the resulting culture broth.

    Abstract translation: 作为分子式C24H36O5的抗高胆固醇血症药的莫纳可林K是通过培养一种或多种微生物Monkaus又名SANK 10171(IFO 6540),红曲霉SANK 10271(IFO 4513),红曲霉SANK 10671(FERM 4958), 红曲霉玻璃体SANK 10960(FERM 4960),红曲霉SANK 11172(IFO 8201),红曲霉SANK 13778(FERM 4959),红曲霉SANK 15177(FERM 4956)或红曲霉SANK 18174(FERM 4957)在合适的培养基中, 然后从所得培养液中分离出莫纳可林K。

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