公开(公告)号：US10573536B2

公开(公告)日：2020-02-25

申请号：US16264250

申请日：2019-01-31

Applicant: MediaTek Inc.

Inventor： Wen-Sung Hsu ,  Ta-Jen Yu

IPC: H01L23/64 ,  H01L23/538 ,  H01L23/66 ,  H01L21/48 ,  H01L25/00 ,  H01L23/498 ,  H01L23/00 ,  H05K1/18 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/30 ,  H01F17/00 ,  H01L21/683 ,  H01L21/70 ,  H01L21/56 ,  H05K1/16

Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.

公开(公告)号：US10340198B2

公开(公告)日：2019-07-02

申请号：US15881030

申请日：2018-01-26

Applicant: MEDIATEK INC.

Inventor： Ta-Jen Yu ,  Wen-Sung Hsu

IPC: H01L23/52 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L21/683

Abstract: The invention provides a semiconductor package and a method for fabricating the same. The semiconductor package includes a redistribution layer (RDL) structure, a semiconductor die, a molding compound and a supporter. The RDL structure has a first surface and a second surface opposite to the first surface. The semiconductor die is disposed on the first surface of the RDL structure and electrically coupled to the RDL structure. The molding compound is positioned overlying the semiconductor die and the first surface of the RDL structure. The supporter is positioned beside the semiconductor die and in contact with the first surface of the RDL structure.

公开(公告)号：US10236187B2

公开(公告)日：2019-03-19

申请号：US15893527

申请日：2018-02-09

Applicant: MediaTek Inc.

Inventor： Wen-Sung Hsu ,  Ta-Jen Yu

IPC: H01L23/34 ,  H01L21/48 ,  H01L23/64 ,  H01L23/538 ,  H01L23/66 ,  H01L25/00 ,  H01L23/00 ,  H05K1/18 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/30 ,  H01F17/00 ,  H01L21/683 ,  H01L21/70 ,  H01L21/56 ,  H01L23/498 ,  H05K1/16

Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.

公开(公告)号：US10217716B2

公开(公告)日：2019-02-26

申请号：US15638388

申请日：2017-06-30

Applicant: MEDIATEK INC.

Inventor： Ta-Jen Yu ,  Yu-Sheng Hung ,  Wen-Sung Hsu

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H01L21/683 ,  H01L25/065 ,  H01L25/10

Abstract: A method for fabricating a semiconductor is disclosed. A carrier substrate is provided. A redistribution layer (RDL) structure is formed on the carrier substrate. The RDL structure comprises at least a bump pad. A semiconductor die is mounted on the RDL structure. A molding compound is formed on the semiconductor die and the RDL structure. The carrier substrate is removed to reveal a plurality of solder ball pads of the RDL structure. A plurality of conductive structures are formed on the solder ball pads.

公开(公告)号：US10115604B2

公开(公告)日：2018-10-30

申请号：US14663772

申请日：2015-03-20

Applicant: MediaTek Inc

Inventor： Wen-Sung Hsu ,  Ta-Jen Yu

IPC: H01L29/74 ,  H01L21/48 ,  H01L23/64 ,  H01L23/538 ,  H01L23/66 ,  H01L25/00 ,  H01L23/00 ,  H05K1/18 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/30 ,  H01F17/00 ,  H01L21/683 ,  H01L21/70 ,  H01L21/56 ,  H01L23/498 ,  H05K1/16

Abstract: A method for fabricating a base for a semiconductor package is provided. The method operates by providing a carrier with conductive seed layers on the top surface and the bottom surface of the carrier, forming radio-frequency (RF) devices respectively on the conductive seed layers, laminating a first base material layer and a second base material layer respectively on the conductive seed layers, covering the RF devices, and separating the first base material layer the second base material layer, which contain the RF devices thereon, from the carrier to form a first base and a second base.

公开(公告)号：US20180166297A1

公开(公告)日：2018-06-14

申请号：US15893527

申请日：2018-02-09

Applicant: MediaTek Inc.

Inventor： Wen-Sung Hsu ,  Ta-Jen Yu

IPC: H01L21/48 ,  H05K3/00 ,  H05K1/18 ,  H05K3/10 ,  H01L23/498 ,  H01L23/538 ,  H01L23/64 ,  H01L23/66 ,  H01L23/00 ,  H01L25/00 ,  H05K3/18 ,  H05K3/30 ,  H01F17/00 ,  H05K1/16

CPC classification number: H01L21/485 ,  H01F17/00 ,  H01F17/0006 ,  H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/705 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L24/17 ,  H01L25/50 ,  H01L2224/13147 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2924/12042 ,  H01L2924/1206 ,  H01L2924/1421 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/2064 ,  H05K1/165 ,  H05K1/181 ,  H05K1/183 ,  H05K3/0017 ,  H05K3/0026 ,  H05K3/0047 ,  H05K3/107 ,  H05K3/188 ,  H05K3/303 ,  H05K2201/10098 ,  H01L2924/00

Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.

公开(公告)号：US09922844B2

公开(公告)日：2018-03-20

申请号：US14205836

申请日：2014-03-12

Applicant: MediaTek Inc.

Inventor： Wen-Sung Hsu ,  Ta-Jen Yu

IPC: H01L23/02 ,  H01L21/48 ,  H01L23/64 ,  H01L23/538 ,  H01L23/66 ,  H01L25/00 ,  H01L23/00 ,  H05K1/18 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/30 ,  H01F17/00 ,  H01L23/498 ,  H05K1/16

CPC classification number: H01L21/485 ,  H01F17/00 ,  H01F17/0006 ,  H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/705 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L24/17 ,  H01L25/50 ,  H01L2224/13147 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2924/12042 ,  H01L2924/1206 ,  H01L2924/1421 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/2064 ,  H05K1/165 ,  H05K1/181 ,  H05K1/183 ,  H05K3/0017 ,  H05K3/0026 ,  H05K3/0047 ,  H05K3/107 ,  H05K3/188 ,  H05K3/303 ,  H05K2201/10098 ,  H01L2924/00

Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.

公开(公告)号：US09852973B2

公开(公告)日：2017-12-26

申请号：US15455200

申请日：2017-03-10

Applicant: MediaTek Inc.

Inventor： Wen-Sung Hsu ,  Ta-Jen Yu

IPC: H01L21/336 ,  H01L29/40 ,  H01L23/498 ,  H01L21/768 ,  H01L23/538

CPC classification number: H01L23/49827 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/5384 ,  H01L2224/16227 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/185 ,  H05K3/205 ,  H01L2924/00012 ,  H01L2924/0001

Abstract: A manufacturing method of a package substrate is provided. The method includes forming a first circuit layer on a carrier. A passive component is disposed on the first circuit layer and the carrier. A dielectric layer is formed on the carrier to embed the passive component and the first circuit layer in the dielectric layer. A second circuit layer is formed on the dielectric layer. The carrier is removed from the dielectric layer. A manufacturing method of a chip package is also provided.

公开(公告)号：US09553040B2

公开(公告)日：2017-01-24

申请号：US13835701

申请日：2013-03-15

Applicant: MediaTek Inc.

Inventor： Wen-Sung Hsu ,  Tzu-Hung Lin ,  Ta-Jen Yu

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49811 ,  H01L21/563 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3178 ,  H01L23/3192 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/08 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/26 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/02331 ,  H01L2224/0401 ,  H01L2224/05012 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05552 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81385 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention provides a semiconductor package. The semiconductor package includes a semiconductor package includes a substrate having a die attach surface. A die is mounted on die attach surface of the substrate via a conductive pillar bump. The die comprises a metal pad electrically coupling to the conductive pillar bump, wherein the metal pad has a first edge and a second edge substantially vertical to the first edge, wherein the length of the first edge is different from that of the second edge from a plan view.

Abstract translation: 本发明提供一种半导体封装。 半导体封装包括半导体封装，其包括具有管芯附接表面的衬底。 模具通过导电柱凸块安装在基板的芯片附着表面上。 芯片包括电耦合到导电柱凸起的金属焊盘，其中金属焊盘具有基本上垂直于第一边缘的第一边缘和第二边缘，其中第一边缘的长度与第二边缘的长度不同于 平面图。

公开(公告)号：US09520349B2

公开(公告)日：2016-12-13

申请号：US14611354

申请日：2015-02-02

Applicant: MediaTek Inc.

Inventor： Wen-Sung Hsu ,  Tzu-Hung Lin ,  Ta-Jen Yu

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/49811 ,  H01L21/563 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3178 ,  H01L23/3192 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/08 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/26 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/02331 ,  H01L2224/0401 ,  H01L2224/05012 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05552 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81385 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package is provided. In one configuration, the semiconductor package includes a substrate. A conductive trace is disposed on the substrate. A conductive pillar bump is disposed on the conductive trace, wherein the conductive bump is coupled to a die. In another configuration, a first conductive trace is disposed on the substrate, and a second conductive trace is disposed on the substrate. In the second configuration, a conductive pillar bump disposed on the second conductive trace, connecting to a conductive bump or a metal pad of the semiconductor die. A first conductive structure is disposed between the second conductive trace and the conductive pillar bump or between the second conductive trace and the substrate, and a die is disposed over the first conductive trace.

Abstract translation: 提供半导体封装。 在一种配置中，半导体封装包括衬底。 导电迹线设置在基板上。 导电柱凸块设置在导电迹线上，其中导电凸块连接到管芯。 在另一种结构中，第一导电迹线设置在衬底上，并且第二导电迹线设置在衬底上。 在第二构造中，设置在第二导电迹线上的导电柱凸块连接到半导体管芯的导电凸块或金属焊盘。 第一导电结构设置在第二导电迹线和导电柱突起之间或第二导电迹线和衬底之间，并且管芯设置在第一导电迹线上。