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    STRUCTURED-STEREO IMAGING ASSEMBLY INCLUDING SEPARATE IMAGERS FOR DIFFERENT WAVELENGTHS
    33.
    发明申请
    STRUCTURED-STEREO IMAGING ASSEMBLY INCLUDING SEPARATE IMAGERS FOR DIFFERENT WAVELENGTHS 审中-公开
    结构化立体成像组件，包括用于不同波长的分离图像

    公开(公告)号：US20170034499A1

    公开(公告)日：2017-02-02

    申请号：US15300997

    申请日：2015-03-31

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Moshe Doron ,  Ohad Meitav ,  Markus Rossi ,  Dmitry Ryuma ,  Alireza Yasan

    IPC: H04N13/02 ,  H04N5/33 ,  G06T7/00 ,  H04N5/225

    CPC classification number: H04N13/25 ,  G06T7/521 ,  G06T7/596 ,  G06T2207/10012 ,  G06T2207/10048 ,  H04N5/2256 ,  H04N5/332 ,  H04N2213/003

    Abstract: The present disclosure describes structured-stereo imaging assemblies including separate imagers for different wavelengths. The imaging assembly can include, for example, multiple imager sub-arrays, each of which includes a first imager to sense light of a first wavelength or range of wavelengths and a second imager to sense light of a different second wavelength or range of wavelengths. Images acquired from the imagers can be processed to obtain depth information and/or improved accuracy. Various techniques are described that can facilitate determining whether any of the imagers or sub-arrays are misaligned.

    Abstract translation: 本公开描述了包括用于不同波长的单独成像器的结构化立体成像组件。 成像组件可以包括例如多个成像器子阵列，每个成像器子阵列包括用于感测第一波长或波长范围的光的第一成像器和用于感测不同第二波长或波长范围的光的第二成像器。 可以处理从成像器获得的图像以获得深度信息和/或改进的准确度。 描述了可以便于确定是否任何一个成像器或子阵列不对准的各种技术。

    Sensor module and method of manufacturing the same
    34.
    发明授权
    Sensor module and method of manufacturing the same 有权
    传感器模块及其制造方法

    公开(公告)号：US09559224B2

    公开(公告)日：2017-01-31

    申请号：US14413890

    申请日：2013-07-09

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Markus Rossi

    IPC: H01J3/14 ,  H01L31/0232 ,  G01S17/88 ,  G01S7/481 ,  H01L31/0203 ,  H01L27/146 ,  G01L9/00 ,  H01L27/144

    CPC classification number: G01D5/30 ,  G01L9/0077 ,  G01S7/4813 ,  G01S17/88 ,  H01L27/144 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L31/173 ,  H01L31/1876 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The opto-electronic module (1) comprises —a first substrate member (P); —a third substrate member (B); —a second substrate member (O) arranged between said first and third substrate members and comprising one or more transparent portions (ta, tb) through which light can pass, said at least one transparent portion comprising at least a first optical structure (5a;5a′;5b;5b′); —a first spacer member (S1) comprised in said first substrate member (P) or comprised in said second substrate member (O) or distinct from and located between these, which comprises at least one opening (4a;4b); —a second spacer member (S2) comprised in said second substrate member (O) or comprised in said third substrate member (B) or distinct from and located between these, which comprises at least one opening (3); —a light detecting element (D) arranged on and electrically connected to said first substrate member (P); —a light emission element (E) arranged on and electrically connected to said first substrate member (P); —and a sensing element (8) comprised in or arranged at said third substrate member (B). Such modules (1) are particularly suitable as sensor modules for sensing a magnitude such as a pressure.

    Abstract translation: 光电模块（1）包括：第一衬底构件（P）; - 第三衬底构件（B）; - 第二衬底构件（O），布置在所述第一和第三衬底构件之间并且包括光可以通过的一个或多个透明部分（ta，tb），所述至少一个透明部分至少包括第一光学结构（5a; 5a'; 5b; 5b'）; - 包括在所述第一衬底构件（P）中或包含在所述第二衬底构件（O）中的第一间隔构件（S1）或与所述第一衬底构件（P）中的至少一个开口（4a; 4b）不同并位于所述第一衬底构件 - 包括在所述第二衬底构件（O）中或包括在所述第三衬底构件（B）中的第二间隔构件（S2）或者不同于所述第二衬底构件（B）中的第二衬垫构件（S2），其包括至少一个开口（3）; - 设置在所述第一基板部件（P）上并与其电连接的光检测元件（D）。 - 发光元件（E），布置在所述第一基板部件（P）上并与所述第一基板部件（P）电连接。 以及包含在所述第三衬底构件（B）中或布置在所述第三衬底构件（B）上的感测元件（8）。 这样的模块（1）特别适用于用于感测诸如压力的量值的传感器模块。

    ILLUMINATION SYSTEM
    36.
    发明申请
    ILLUMINATION SYSTEM 审中-公开
    照明系统

    公开(公告)号：US20150070870A1

    公开(公告)日：2015-03-12

    申请号：US14517225

    申请日：2014-10-17

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Daniel Dias ,  Ville Kettunen ,  Markus Rossi

    IPC: G02B27/30 ,  G02B5/18 ,  G03B15/05 ,  F21V5/00

    CPC classification number: G02B27/30 ,  F21V5/00 ,  F21V5/002 ,  F21V33/0052 ,  G02B5/18 ,  G02B5/1885 ,  G03B15/05

    Abstract: An illumination system including at least one light source such as an electroluminescent element, e.g. a light emitting diode (LED), and at least one optical element whose surface is structured by diffraction and/or refraction type optical microstructures. In order to shape the beam, the optical element includes at least two sections whose optical microstructures and therefore optical properties are different from one another. The pattern of the microstructures in each of the at least two sections is, at least over a predetermined angular range, rotationally symmetric with respect to the optical axis or another symmetry axis.

    Abstract translation: 一种照明系统，包括至少一个光源，例如电致发光元件，例如， 发光二极管（LED），以及表面由衍射和/或折射型光学微结构构成的至少一个光学元件。 为了形成光束，光学元件包括至少两个部分，其光学微结构因此光学性质彼此不同。 所述至少两个部分中的每一个中的微结构的图案至少在预定角度范围内相对于光轴或另一对称轴线旋转对称。

    OPTO-ELECTRONIC MODULE AND DEVICES COMPRISING THE SAME
    38.
    发明申请
    OPTO-ELECTRONIC MODULE AND DEVICES COMPRISING THE SAME 有权

    公开(公告)号：US20130284908A1

    公开(公告)日：2013-10-31

    申请号：US13926058

    申请日：2013-06-25

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Markus Rossi ,  Ville Kettunen

    IPC: G01V8/12 ,  G01J1/04

    CPC classification number: G01V8/12 ,  G01J1/0411 ,  G01J5/08 ,  G01S7/4811 ,  G01S17/026

    Abstract: An opto-electronic module includes a detecting channel comprising a detecting member for detecting light and an emission channel comprising an emission member for emitting light generally detectable by said detecting member. Therein, a radiation distribution characteristic for an emission of light from said emission channel is non rotationally symmetric; and/or a sensitivity distribution characteristic for a detection in said detecting channel of light incident on said detection channel is non rotationally symmetric; and/or a central or main emission direction for an emission of light from said emission channel and a central or main detection direction for a detection of light incident on said detection channel are aligned not parallel to each other; and/or at least a first one of the channels comprises one or more passive optical components.

    SPACER ELEMENT AND METHOD FOR MANUFACTURING A SPACER ELEMENT
    39.
    发明申请
    SPACER ELEMENT AND METHOD FOR MANUFACTURING A SPACER ELEMENT 审中-公开
    间隔元件和制造间隔元件的方法

    公开(公告)号：US20130280492A1

    公开(公告)日：2013-10-24

    申请号：US13923861

    申请日：2013-06-21

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Markus Rossi ,  Hartmut Rudmann ,  Nicola Spring ,  Alexander Bietsch

    IPC: B32B41/00 ,  B32B37/02

    CPC classification number: B32B41/00 ,  B32B37/02 ,  G02B2006/12166 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L2924/0002 ,  H04N5/2257 ,  Y10T156/10 ,  Y10T428/15 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/2457 ,  H01L2924/00

    Abstract: A spacer wafer for a wafer stack includes a spacer body with a first surface and a second surface, and is intended to be sandwiched between a first wafer and a second wafer. That is, the spacer is to keep a first wafer placed against the first surface and a second wafer placed against the second surface at a constant distance from each other. The spacer provides openings arranged such that functional elements of the first wafer and of the second wafer can be aligned with the openings. The spacer is formed from a forming tool by means of a shape replication process and is preferably made of a material hardened by curing. At least one of the first and second surface includes edges separating the surface from the openings, and the thickness of the spacer wafer at the edges exceeds the thickness of the spacer wafer at surface locations around the edges.

    Abstract translation: 用于晶片堆叠的间隔晶片包括具有第一表面和第二表面的间隔体，并且旨在夹在第一晶片和第二晶片之间。 也就是说，间隔件是保持第一晶片放置在第一表面上，并且第二晶片以彼此保持恒定的距离放置在第二表面上。 间隔件提供开口布置成使得第一晶片和第二晶片的功能元件可与开口对准。 间隔件通过形状复制工艺由成形工具形成，并且优选由通过固化硬化的材料制成。 第一和第二表面中的至少一个包括将表面与开口分开的边缘，并且边缘处的间隔晶片的厚度在边缘周围的表面位置超过间隔晶片的厚度。

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