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    SEMICONDUCTOR PROCESS EQUIPMENT
    32.
    发明公开
    SEMICONDUCTOR PROCESS EQUIPMENT 审中-公开

    公开(公告)号：US20240153800A1

    公开(公告)日：2024-05-09

    申请号：US18141920

    申请日：2023-05-01

    Applicant: Applied Materials, Inc.

    Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Lakshmikanth Krishnamurthy SHIRAHATTI

    IPC: H01L21/677

    CPC classification number: H01L21/67706 ,  H01L21/67709 ,  H01L21/6773

    Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

    PROCESS KIT HAVING TALL DEPOSITION RING AND SMALLER DIAMETER ELECTROSTATIC CHUCK (ESC) FOR PVD CHAMBER
    38.
    发明申请
    PROCESS KIT HAVING TALL DEPOSITION RING AND SMALLER DIAMETER ELECTROSTATIC CHUCK (ESC) FOR PVD CHAMBER 有权

    公开(公告)号：US20220406573A1

    公开(公告)日：2022-12-22

    申请号：US17351535

    申请日：2021-06-18

    Applicant: Applied Materials, Inc.

    Inventor： David GUNTHER ,  Siew Kit HOI ,  Kirankumar Neelasandra SAVANDAIAH

    IPC: H01J37/32 ,  C23C14/35 ,  C23C14/50

    Abstract: Embodiments of process kits are provided herein. In some embodiments, a process kit, includes: a deposition ring configured to be disposed on a substrate support, the deposition ring comprising: an annular band having an upper surface and a lower surface, the lower surface including a step between a radially inner portion and a radially outer portion, the step extending downward from the radially inner portion to the radially outer portion; an inner lip extending upwards from the upper surface of the annular band and adjacent an inner surface of the annular band, and wherein an outer surface of the inner lip extends radially outward and downward from an upper surface of the inner lip to the upper surface of the annular band; a channel disposed radially outward of the annular band; and an outer lip extending upwardly and disposed radially outward of the channel.

    APPARATUS FOR CONTROLLING LIFT PIN MOVEMENT
    39.
    发明申请
    APPARATUS FOR CONTROLLING LIFT PIN MOVEMENT 有权

    公开(公告)号：US20220336258A1

    公开(公告)日：2022-10-20

    申请号：US17233213

    申请日：2021-04-16

    Applicant: Applied Materials, Inc.

    Inventor： Anubhav SRIVASTAVA ,  Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Nitin Bharadwaj SATYAVOLU

    IPC: H01L21/687

    Abstract: Embodiments of the present disclosure generally relate to lift pins and to apparatus for controlling lift pin movement. In an embodiment, an apparatus for positioning a substrate in a chamber is provided. The apparatus includes a chamber component, a lift pin having a top surface for supporting the substrate and a lift pin shaft and a stopper. The apparatus further includes a compressible element positioned between the chamber component and the stopper, the compressible element further positioned around the lift pin shaft, the lift pin being moveable relative to a substrate transfer plane by movement of a substrate support in contact with the compressible element.

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