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公开(公告)号：US20110223778A1
公开(公告)日：2011-09-15
申请号：US12719975
申请日：2010-03-09
CPC分类号： H01L23/49811 , H01L21/4853 , H01L21/6835 , H01L23/13 , H01L23/147 , H01L23/15 , H01L23/49827 , H01L23/544 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0652 , H01L2221/68309 , H01L2221/68345 , H01L2223/54426 , H01L2223/54473 , H01L2224/13 , H01L2224/13016 , H01L2224/131 , H01L2224/136 , H01L2224/16237 , H01L2224/81005 , H01L2224/81007 , H01L2224/81136 , H01L2224/81138 , H01L2224/81141 , H01L2224/81191 , H01L2224/81192 , H01L2224/81801 , H01L2224/81901 , H01L2924/0001 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15156 , H01L2924/15787 , Y10T29/49165 , Y10T29/49204 , Y10T29/49895 , Y10T29/49947 , H01L2924/00012 , H01L2224/13099 , H01L2924/00
摘要： A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors.
摘要翻译： 描述了包括多层插入板的多层插入板和多芯片模块（MCM）。 多层插入板的不同区域中的第一表面和第二表面具有相关联的不同厚度。 此外，第一微弹簧连接器和第二微弹簧连接器分别设置在第一表面和第二表面上。 在MCM中，多级插入板的给定的一个第一表面面向MCM中芯片阵列的第一层中的桥式芯片，使得设置在桥式芯片上的第一连接器机械地和电耦合到 第一个微型弹簧连接器。 类似地，多层插入板的给定的一个第二表面面向芯片阵列中的第二层中的岛状芯片，使得设置在岛状芯片上的第二连接器机械地和电耦合到第二微型弹簧 连接器
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公开(公告)号：US07848599B2
公开(公告)日：2010-12-07
申请号：US12415858
申请日：2009-03-31
CPC分类号： G02F1/025 , G02F1/0147 , G02F1/3133 , H01L2224/48091 , H01L2224/48472 , Y10T29/49124 , H01L2924/00014
摘要： Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented on a substrate (such as silicon), and includes a thermally tunable optical waveguide that has good thermal isolation from its surroundings. In particular, a portion of a semiconductor in the optical device, which includes the optical waveguide, is free standing above a gap between the semiconductor layer and the substrate. By reducing the thermal coupling between the optical waveguide and the external environment, the optical device can be thermally tuned with significantly less power consumption.
摘要翻译： 描述了光学器件，光学器件阵列以及用于制造光学器件或阵列的技术的实施例。 该光学器件实现在基板（例如硅）上，并且包括具有与其周围环境良好热隔离的热可调谐光波导。 特别地，包括光波导的光学器件中的半导体的一部分自由地位于半导体层和衬底之间的间隙之上。 通过减少光波导和外部环境之间的热耦合，可以以显着更少的功耗来热调谐光学器件。
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公开(公告)号：US20100247021A1
公开(公告)日：2010-09-30
申请号：US12415858
申请日：2009-03-31
CPC分类号： G02F1/025 , G02F1/0147 , G02F1/3133 , H01L2224/48091 , H01L2224/48472 , Y10T29/49124 , H01L2924/00014
摘要： Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented on a substrate (such as silicon), and includes a thermally tunable optical waveguide that has good thermal isolation from its surroundings. In particular, a portion of a semiconductor in the optical device, which includes the optical waveguide, is free standing above a gap between the semiconductor layer and the substrate. By reducing the thermal coupling between the optical waveguide and the external environment, the optical device can be thermally tuned with significantly less power consumption.
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