公开(公告)号：US12092658B2

公开(公告)日：2024-09-17

申请号：US17871978

申请日：2022-07-24

申请人： MPI CORPORATION

发明人： Sebastian Giessmann ,  Po-Yi Ting

IPC分类号： G01B11/30 ,  G01B11/26 ,  G01R1/067 ,  G01R1/18 ,  G01R31/28 ,  G06T7/33 ,  G06T11/00 ,  H04N5/272

CPC分类号： G01R1/06772 ,  G01B11/26 ,  G01R1/18 ,  G01R31/2891 ,  G06T7/33 ,  G06T11/00 ,  H04N5/272 ,  G06T2210/62

摘要： An optical detection system and an alignment method for a predetermined target object are provided. The optical detection system includes a chuck stage, an optical detection module, a vision inspection module and a control module. The chuck stage includes a chuck configured for carrying a plurality of predetermined objects to be tested. The optical detection module includes an optical probe device, and the optical probe device is configured to be disposed above the chuck for optically detecting the predetermined object. The vision inspection module includes an image capturing device and an image display device. The image capturing device is configured for capturing a real-time image of the predetermined object in real time, and the image display device is configured for displaying the real-time image of the predetermined object in real time. The control module is configured to execute the alignment method for the predetermined target object.

公开(公告)号：USD1031738S1

公开(公告)日：2024-06-18

申请号：US29796877

申请日：2021-06-28

申请人： MPI CORPORATION

设计人： Chin-Yi Lin ,  Keng-Min Su ,  Che-Wei Lin ,  Hsin-Cheng Hung

摘要： FIG. 1 is a perspective view of a die plate assembly for probe head, showing the upper die plate and lower die plate in an assembled position according to our design;
FIG. 2 is a front view thereof, showing the upper die plate and lower die plate in an assembled position, the rear side, the left side and the right side being an identical image;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is an enlarged sectional view taken along line 5-5 of FIG. 3, showing the upper die plate and lower die plate of the die plate assembly for probe head in an assembled position;
FIG. 6 is an enlarged sectional view taken along line 6-6 of FIG. 3, showing the upper die plate and lower die plate of the die plate assembly for probe head in an assembled position;
FIG. 7 is a top perspective view of the upper die plate of the die plate assembly for probe head;
FIG. 8 is a front view of the upper die plate of the die plate assembly for probe head, the rear side being an identical image;
FIG. 9 is a left side elevational view of the upper die plate of the die plate assembly for probe head, the right side being an identical image;
FIG. 10 is a top plan view of the upper die plate of the die plate assembly for probe head;
FIG. 11 is a bottom plan view of the upper die plate of the die plate assembly for probe head;
FIG. 12 is a bottom perspective view of the upper die plate of the die plate assembly for probe head;
FIG. 13 is a top perspective view of the lower die plate of the die plate assembly for probe head;
FIG. 14 is a front view of the lower die plate of the die plate assembly for probe head, the rear side, the left side and the right side being an identical image;
FIG. 15 is a top plan view of the lower die plate of the die plate assembly for probe head;
FIG. 16 is a bottom plan view of the lower die plate of the die plate assembly for probe head; and,
FIG. 17 is a bottom perspective view of the lower die plate of the die plate assembly for probe head.
The broken lines depict portions of the die assembly and form no part of the claimed design.

公开(公告)号：US11852679B2

公开(公告)日：2023-12-26

申请号：US17720510

申请日：2022-04-14

申请人： MPI CORPORATION

发明人： Shih-Ching Chen ,  Jun-Liang Lai ,  Shung-Bo Lin ,  Ta-Cheng Liao ,  Yu-Chih Hsiao ,  Kun-Han Hsieh

IPC分类号： G01R31/26 ,  G01R31/28 ,  G01R1/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073

CPC分类号： G01R31/2889 ,  G01R1/07328 ,  G01R1/07342 ,  G01R31/2601

摘要： A circuit board for semiconductor test includes first and second sub-circuit boards, and an insulating dielectric layer therebetween. Each sub-circuit board includes a substrate and circuits including upper and lower contacts. The insulating dielectric layer includes through holes, and connecting conductors disposed therein and electrically connected with the upper and lower contacts of two sub-circuit boards. The circuit board is defined with central and peripheral regions. The lower contacts of the first sub-circuit board in the central region are electrically connected with a probe head. The upper contacts of the second sub-circuit board in the peripheral region are electrically connected with a tester, larger in pitch than the lower contacts of the first sub-circuit board in the central region, and larger in amount than the lower contacts of the first sub-circuit board in the peripheral region. The circuit board has great power test uniformity.

公开(公告)号：US20230314505A1

公开(公告)日：2023-10-05

申请号：US18121475

申请日：2023-03-14

申请人： MPI Corporation

发明人： Sebastian Giessmann ,  Yu-Hsun Hsu

IPC分类号： G01R31/308 ,  B23Q3/16 ,  G01R31/28

CPC分类号： G01R31/308 ,  B23Q3/16 ,  G01R31/2831 ,  B23Q2240/002

摘要： A motorized chuck stage controlling method adapted to a wafer probing device is provided. The wafer probing device includes a control rod and a motorized chuck stage. The control rod can be moved between an upper limit position and a lower limit position, and the motorized chuck stage is moved along a Z-axis direction in response to a movement of the control rod. One purpose of the motorized chuck stage controlling method is to allow the operator to define the highest position to which the motorized chuck stage can be moved in response to the movement of the control rod, thereby preventing the probe and the wafer from colliding with each other.

公开(公告)号：US11733267B2

公开(公告)日：2023-08-22

申请号：US16822896

申请日：2020-03-18

申请人： MPI Corporation

发明人： Che-Wei Lin ,  Ting-Ju Wu ,  Keng-Min Su ,  Chin-Yi Lin

IPC分类号： G01R1/073 ,  G01R1/067

CPC分类号： G01R1/07314 ,  G01R1/06733

摘要： A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.

公开(公告)号：US20230251303A1

公开(公告)日：2023-08-10

申请号：US18105103

申请日：2023-02-02

申请人： MPI CORPORATION

发明人： YI-HSUAN CHENG ,  HUNG-I LIN ,  PO-HAN PENG

IPC分类号： G01R31/28

CPC分类号： G01R31/2831

摘要： A wafer inspection system includes probe and supporting devices opposite to each other. The probe device includes a probe and an electrically conductive module for transmitting test signal of a driver IC. The supporting device includes a chuck, an annular elastic module detachably disposed on the chuck, and a carrier. The chuck has a supporting portion located correspondingly to a hollow portion of the annular elastic module, which is larger than or equal to the carrier in size on an imaginary horizontal plane, enabling the carrier carrying a wafer to be placed on the supporting portion to be electrically connected with the annular elastic module. When the wafer is contacted by the probe, the electrically conductive module is abutted against the annular elastic module to form a short-path test loop. As a result, it is convenient to pick and place the carrier and wafer, enhancing inspection efficiency.

公开(公告)号：US11656271B2

公开(公告)日：2023-05-23

申请号：US17699610

申请日：2022-03-21

申请人： MPI CORPORATION

发明人： Yi-Hsuan Cheng ,  Hung-I Lin ,  Po-Han Peng

IPC分类号： G01R1/067 ,  G01R31/28

CPC分类号： G01R31/2865 ,  G01R1/06727

摘要： A wafer inspection system includes a supporting device having electrically connected supporting and contact portions for supporting a wafer's back, and a probe device having a probe and elastic contact members. When a probe tip of the probe contacts the wafer's front, a contact tip of the elastic contact member is abutted against a contact surface of the contact portion. The contact tip is higher than the probe tip. The contact surface is higher than the wafer's front. Alternatively, the contact surface having a radius larger than or equal to twice the wafer's radius. The horizontal distance between the probe tip and the contact tip is larger than or equal to twice the wafer's radius. This satisfies the test requirement of short-pulse test signal and prevents the structural design and transmitting stability of the elastic contact members from being affected by the inspection temperature.

公开(公告)号：US11585832B2

公开(公告)日：2023-02-21

申请号：US17221368

申请日：2021-04-02

申请人： MPI Corporation

发明人： Chung-Yen Huang ,  Chih-Wei Wen ,  Sheng-Feng Xu ,  Fuh-Chyun Tang ,  Chih-Hao Ho

IPC分类号： G01R1/073

摘要： A probe card and a probe module thereof are provided. The probe card includes a first strengthening board, a fixed frame, a probe module, and a slidable frame. The first strengthening board includes a top surface, a bottom surface, and a mounting hole. An inner wall of the mounting hole is formed with an inner flange. The fixed frame is disposed on the top surface of the first strengthening board and surrounds the mounting hole. The probe module is disposed in the mounting hole and includes an outer flange including a physical region and multiple gap regions. The physical region abuts against the inner flange of the first strengthening board. The slidable frame is disposed on an inner wall of the fixed frame and is slidable between a released position and a fixed position. Multiple pressing portions are disposed on an inner wall of the slidable frame.

公开(公告)号：US20230007997A1

公开(公告)日：2023-01-12

申请号：US17858424

申请日：2022-07-06

申请人： MPI CORPORATION

发明人： CHIN-TIEN YANG ,  YANG-HUNG CHENG ,  YU-HAO CHEN ,  CHIN-YI TSAI ,  HUI-PIN YANG ,  HORNG-CHUAN SUN

IPC分类号： G01R1/073

摘要： A vertical probe head includes upper and lower die units having upper and lower through holes, and probes each including a body portion between the die units, tail and head portion installation parts in the upper and lower through holes respectively, and a head portion contact part for electrically contacting a device under test. The probes include a pair of signal probes including at least one distinctive probe, for which, the body portion is smaller in width than the head portion installation part, and a body portion center line is deviated from a head portion installation part center line toward the probe paired thereto. For the paired probes, a head portion contact part pitch is larger than a body portion pitch for matching a large-pitch high-speed differential pair of the device under test, great impedance matching effect, and consistent contact force and stable elasticity of the probes in operation.

公开(公告)号：US11526978B2

公开(公告)日：2022-12-13

申请号：US17117513

申请日：2020-12-10

申请人： MPI CORPORATION

发明人： Ping-Ying Wu ,  Yung-Chin Liu

IPC分类号： G06T7/00 ,  G06T3/00 ,  G01N21/95 ,  G01N21/88

摘要： An image processing method includes the steps of lighting up at least a part of light emitting units of a light emitting device; capturing a plurality of detection images corresponding to a plurality of sections of the light emitting device respectively, wherein each section includes a plurality of lighted-up light emitting units, each detection image includes a plurality of light spots respectively corresponding to the light emitting units of the associated section, and every two adjacent sections have an overlap area including at least one lighted-up light emitting unit; and stitching the detection images of the adjacent sections together by taking the light spots corresponding to at least one lighted-up light emitting unit of the overlap area as alignment reference spots, so that the light emitting statuses of all the light emitting units are presented by a single image.