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公开(公告)号：US11346789B2
公开(公告)日：2022-05-31
申请号：US17117477
申请日：2020-12-10
申请人： MPI CORPORATION
发明人： Ping-Ying Wu , Chiu-Wang Chen , Yung-Chin Liu
IPC分类号： G01N21/88
摘要： An optical inspection system includes a brightness inspection module for inspecting the brightness of a light emitting element, an integrated inspection module for inspecting the near field optical characteristic and the beam quality factor of the light emitting element, and a far field inspection module for inspecting the far field optical characteristic of the light emitting element. As a result, the optical inspection system is space-saving and capable of reducing the distance and time of the movement of the device under test.
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公开(公告)号：US10678370B2
公开(公告)日：2020-06-09
申请号：US16104309
申请日：2018-08-17
申请人： MPI Corporation
发明人： Lin-Lin Chih , Guan-Jhih Liou , Chien-Hung Chen , Yung-Chin Liu
摘要： An aligning method for use in semiconductor inspection apparatus is provided. The semiconductor inspection apparatus includes a stage and a touch-control screen. The aligning method includes defining a reference direction; displaying an image of a device under test supported by the stage on the touch-control screen; detecting a first touch point and a second touch point occurred on the touch-control screen; defining a straight line according to the first touch point and the second touch point; calculating an included angle defined by the straight and the reference direction; and rotating the stage according to the included angle.
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公开(公告)号：US10048844B2
公开(公告)日：2018-08-14
申请号：US14996282
申请日：2016-01-15
申请人： MPI Corporation
IPC分类号： G06F3/0484 , G06F3/041 , G06F3/0488 , G01R31/28 , G03F7/20 , G01N21/95
摘要： The instant disclosure provides an operating method of inspecting equipment, with the method applicable to semiconductor inspecting equipment having a movable element. The method includes: displaying a wafer graphic by a touch display; detecting a touch signal generated by the touch display; detecting the magnification of the wafer graphic when the touch signal is generated; and determining the moving speed of the movable element based on the magnification of the wafer graphic when the touch signal is generated. In addition, the moving direction of the movable element can be determined according to the touch signal. Through the instant disclosure, the operator can more intuitively operate each movable element of semiconductor inspecting equipment.
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公开(公告)号：USD922396S1
公开(公告)日：2021-06-15
申请号：US29650384
申请日：2018-06-06
申请人： MPI Corporation
设计人： Lin-Lin Chih , Guan-Jhih Liou , Chien-Hung Chen , Yung-Chin Liu
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公开(公告)号：US20190171328A1
公开(公告)日：2019-06-06
申请号：US16104309
申请日：2018-08-17
申请人： MPI Corporation
发明人： Lin-Lin Chih , Guan-Jhih Liou , Chien-Hung Chen , Yung-Chin Liu
摘要： An aligning method for use in semiconductor inspection apparatus is provided. The semiconductor inspection apparatus includes a stage and a touch-control screen. The aligning method includes defining a reference direction; displaying an image of a device under test supported by the stage on the touch-control screen; detecting a first touch point and a second touch point occurred on the touch-control screen; defining a straight line according to the first touch point and the second touch point; calculating an included angle defined by the straight and the reference direction; and rotating the stage according to the included angle.
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公开(公告)号：US11526978B2
公开(公告)日：2022-12-13
申请号：US17117513
申请日：2020-12-10
申请人： MPI CORPORATION
发明人： Ping-Ying Wu , Yung-Chin Liu
摘要： An image processing method includes the steps of lighting up at least a part of light emitting units of a light emitting device; capturing a plurality of detection images corresponding to a plurality of sections of the light emitting device respectively, wherein each section includes a plurality of lighted-up light emitting units, each detection image includes a plurality of light spots respectively corresponding to the light emitting units of the associated section, and every two adjacent sections have an overlap area including at least one lighted-up light emitting unit; and stitching the detection images of the adjacent sections together by taking the light spots corresponding to at least one lighted-up light emitting unit of the overlap area as alignment reference spots, so that the light emitting statuses of all the light emitting units are presented by a single image.
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公开(公告)号：US11451714B2
公开(公告)日：2022-09-20
申请号：US17118037
申请日：2020-12-10
申请人： MPI CORPORATION
发明人： Ping-Ying Wu , Yung-Chin Liu , Hsuan-Chiao Huang
摘要： A light emitting element detecting method includes the steps of generating a first control signal to open a shutter of an image capturing device which captures an image toward a light outlet of a light emitting element, generating a pulse signal to light up the light emitting element, generating a second control signal to close the shutter of the image capturing device and obtaining a detection image, and determining the light emitting status of the light outlet of the light emitting element according to the detection image. As a result, the present invention can accurately detect whether the light outlet of the light emitting element has the problem of emitting no light or flashing.
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公开(公告)号：US20160210028A1
公开(公告)日：2016-07-21
申请号：US14996282
申请日：2016-01-15
申请人： MPI Corporation
IPC分类号： G06F3/0484 , G06F3/0488 , G06F3/041
CPC分类号： G06F3/04845 , G01N21/9501 , G01R31/2808 , G03F7/7065 , G03F7/708 , G06F3/0412 , G06F3/04847 , G06F3/04883 , G06F2203/04806
摘要： The instant disclosure provides an operating method of inspecting equipment, with the method applicable to semiconductor inspecting equipment having a movable element. The method includes: displaying a wafer graphic by a touch display; detecting a touch signal generated by the touch display; detecting the magnification of the wafer graphic when the touch signal is generated; and determining the moving speed of the movable element based on the magnification of the wafer graphic when the touch signal is generated. In addition, the moving direction of the movable element can be determined according to the touch signal. Through the instant disclosure, the operator can more intuitively operate each movable element of semiconductor inspecting equipment.
摘要翻译： 本公开提供了一种可用于具有可移动元件的半导体检查设备的方法来检查设备的操作方法。 该方法包括：通过触摸显示器显示晶片图形; 检测由所述触摸显示器产生的触摸信号; 当生成触摸信号时检测晶片图形的放大率; 以及当产生所述触摸信号时，基于所述晶片图形的放大率来确定所述可移动元件的移动速度。 此外，可以根据触摸信号来确定可移动元件的移动方向。 通过本公开，操作者可以更直观地操作半导体检查设备的每个可移动元件。
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