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公开(公告)号：US12196779B2
公开(公告)日：2025-01-14
申请号：US17888500
申请日：2022-08-16
Applicant: MPI CORPORATION
Inventor： Stojan Kanev , Mei-Ting Lu , Sebastian Giessmann
Abstract: A probe system and a machine apparatus thereof are provided. The machine apparatus can be configured for optionally carrying at least one probe assembly. The machine apparatus includes a temperature control carrier module, a machine frame structure and a temperature shielding structure. The temperature control carrier module can be configured for carrying at least one predetermined object. The machine frame structure can be configured for partially covering the temperature control carrier module, and the machine frame structure has a frame opening for exposing the temperature control carrier module. The temperature shielding structure can be disposed on the machine frame structure for partially covering the frame opening, and the temperature shielding structure has a detection opening for exposing the at least one predetermined object. The temperature shielding structure has a gas guiding channel formed thereinside for allowing a predetermined gas in the gas guiding channel.
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公开(公告)号：US12092658B2
公开(公告)日：2024-09-17
申请号：US17871978
申请日：2022-07-24
Applicant: MPI CORPORATION
Inventor： Sebastian Giessmann , Po-Yi Ting
CPC classification number: G01R1/06772 , G01B11/26 , G01R1/18 , G01R31/2891 , G06T7/33 , G06T11/00 , H04N5/272 , G06T2210/62
Abstract: An optical detection system and an alignment method for a predetermined target object are provided. The optical detection system includes a chuck stage, an optical detection module, a vision inspection module and a control module. The chuck stage includes a chuck configured for carrying a plurality of predetermined objects to be tested. The optical detection module includes an optical probe device, and the optical probe device is configured to be disposed above the chuck for optically detecting the predetermined object. The vision inspection module includes an image capturing device and an image display device. The image capturing device is configured for capturing a real-time image of the predetermined object in real time, and the image display device is configured for displaying the real-time image of the predetermined object in real time. The control module is configured to execute the alignment method for the predetermined target object.
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公开(公告)号：US20230314505A1
公开(公告)日：2023-10-05
申请号：US18121475
申请日：2023-03-14
Applicant: MPI Corporation
Inventor： Sebastian Giessmann , Yu-Hsun Hsu
IPC: G01R31/308 , B23Q3/16 , G01R31/28
CPC classification number: G01R31/308 , B23Q3/16 , G01R31/2831 , B23Q2240/002
Abstract: A motorized chuck stage controlling method adapted to a wafer probing device is provided. The wafer probing device includes a control rod and a motorized chuck stage. The control rod can be moved between an upper limit position and a lower limit position, and the motorized chuck stage is moved along a Z-axis direction in response to a movement of the control rod. One purpose of the motorized chuck stage controlling method is to allow the operator to define the highest position to which the motorized chuck stage can be moved in response to the movement of the control rod, thereby preventing the probe and the wafer from colliding with each other.
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公开(公告)号：US20220155366A1
公开(公告)日：2022-05-19
申请号：US17524833
申请日：2021-11-12
Applicant: MPI Corporation
Inventor： Volker Hansel , Sebastian Giessmann , Frank Fehrmann , Chien-Hung Chen
IPC: G01R31/28
Abstract: The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.
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公开(公告)号：US11703541B2
公开(公告)日：2023-07-18
申请号：US17524788
申请日：2021-11-12
Applicant: MPI Corporation
Inventor： Volker Hansel , Sebastian Giessmann , Frank Fehrmann , Chien-Hung Chen
CPC classification number: G01R31/2891 , G01R31/2887 , H01L22/12
Abstract: A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.
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Patent Agency Ranking
公开(公告)号：US11313883B2
公开(公告)日：2022-04-26
申请号：US17016409
申请日：2020-09-10
Applicant: MPI Corporation
Inventor： Yu-Hsun Hsu , Jhih-Wei Fang , Sebastian Giessmann
Abstract: A probe station includes a base, a adaptor, a probe holder and a probe. The adaptor has a first portion and a second portion away from the first portion towards a first direction by a first length. The first portion connects to the base. A probe holder connects to the second portion and extends towards a second direction opposite to the first direction by a second length. The probe connects to an end of the probe holder away from the second portion and extends towards the second direction by a third length. A product of a thermal coefficient of the adaptor and the first length is equal to a sum of a product of a thermal coefficient of the probe holder and the second length and a product of a thermal coefficient of the probe and the third length.
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公开(公告)号：US20220155365A1
公开(公告)日：2022-05-19
申请号：US17524788
申请日：2021-11-12
Applicant: MPI Corporation
Inventor： Volker Hansel , Sebastian Giessmann , Frank Fehrmann , Chien-Hung Chen
Abstract: A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.
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公开(公告)号：US12196808B2
公开(公告)日：2025-01-14
申请号：US18121475
申请日：2023-03-14
Applicant: MPI Corporation
Inventor： Sebastian Giessmann , Yu-Hsun Hsu
IPC: G01R31/308 , B23Q3/16 , G01R31/28
Abstract: A motorized chuck stage controlling method adapted to a wafer probing device is provided. The wafer probing device includes a control rod and a motorized chuck stage. The control rod can be moved between an upper limit position and a lower limit position, and the motorized chuck stage is moved along a Z-axis direction in response to a movement of the control rod. One purpose of the motorized chuck stage controlling method is to allow the operator to define the highest position to which the motorized chuck stage can be moved in response to the movement of the control rod, thereby preventing the probe and the wafer from colliding with each other.
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9.发明授权公开(公告)号：US12007319B2
公开(公告)日：2024-06-11
申请号：US17979748
申请日：2022-11-02
Applicant: MPI CORPORATION
Inventor： Po-Yi Ting , Ting-An Yen , Yu-Hsun Hsu , Sebastian Giessmann
IPC: G01N15/0205 , G11B7/135 , H01S5/00
CPC classification number: G01N15/0205 , G11B7/135 , H01S5/005
Abstract: An optical path correction subassembly, an optical detection assembly, and an optical detection system are provided. The optical path correction subassembly can be optionally configured to be applied to a light detector. The optical path correction subassembly includes a holder structure and an optical path correction structure carried by the holder structure, and the optical path correction structure has a light beam guiding surface arranged as a reverse inclination inclined relative to a vertical line. The light beam guiding surface of the optical path correction structure can be configured to effectively or accurately guide a predetermined light beam to a light receiving surface of the light detector so as to facilitate collection of the predetermined light beam. The light beam guiding surface of the optical path correction structure can be arranged at an acute angle relative to the light receiving surface of the light detector.
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公开(公告)号：US11693050B2
公开(公告)日：2023-07-04
申请号：US17524833
申请日：2021-11-12
Applicant: MPI Corporation
Inventor： Volker Hansel , Sebastian Giessmann , Frank Fehrmann , Chien-Hung Chen
CPC classification number: G01R31/2891 , G01R31/2887 , H01L22/12
Abstract: The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.
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