公开(公告)号：US11852679B2

公开(公告)日：2023-12-26

申请号：US17720510

申请日：2022-04-14

申请人： MPI CORPORATION

发明人： Shih-Ching Chen ,  Jun-Liang Lai ,  Shung-Bo Lin ,  Ta-Cheng Liao ,  Yu-Chih Hsiao ,  Kun-Han Hsieh

IPC分类号： G01R31/26 ,  G01R31/28 ,  G01R1/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073

CPC分类号： G01R31/2889 ,  G01R1/07328 ,  G01R1/07342 ,  G01R31/2601

摘要： A circuit board for semiconductor test includes first and second sub-circuit boards, and an insulating dielectric layer therebetween. Each sub-circuit board includes a substrate and circuits including upper and lower contacts. The insulating dielectric layer includes through holes, and connecting conductors disposed therein and electrically connected with the upper and lower contacts of two sub-circuit boards. The circuit board is defined with central and peripheral regions. The lower contacts of the first sub-circuit board in the central region are electrically connected with a probe head. The upper contacts of the second sub-circuit board in the peripheral region are electrically connected with a tester, larger in pitch than the lower contacts of the first sub-circuit board in the central region, and larger in amount than the lower contacts of the first sub-circuit board in the peripheral region. The circuit board has great power test uniformity.