公开(公告)号：USD1031738S1

公开(公告)日：2024-06-18

申请号：US29796877

申请日：2021-06-28

申请人： MPI CORPORATION

设计人： Chin-Yi Lin ,  Keng-Min Su ,  Che-Wei Lin ,  Hsin-Cheng Hung

摘要： FIG. 1 is a perspective view of a die plate assembly for probe head, showing the upper die plate and lower die plate in an assembled position according to our design;
FIG. 2 is a front view thereof, showing the upper die plate and lower die plate in an assembled position, the rear side, the left side and the right side being an identical image;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is an enlarged sectional view taken along line 5-5 of FIG. 3, showing the upper die plate and lower die plate of the die plate assembly for probe head in an assembled position;
FIG. 6 is an enlarged sectional view taken along line 6-6 of FIG. 3, showing the upper die plate and lower die plate of the die plate assembly for probe head in an assembled position;
FIG. 7 is a top perspective view of the upper die plate of the die plate assembly for probe head;
FIG. 8 is a front view of the upper die plate of the die plate assembly for probe head, the rear side being an identical image;
FIG. 9 is a left side elevational view of the upper die plate of the die plate assembly for probe head, the right side being an identical image;
FIG. 10 is a top plan view of the upper die plate of the die plate assembly for probe head;
FIG. 11 is a bottom plan view of the upper die plate of the die plate assembly for probe head;
FIG. 12 is a bottom perspective view of the upper die plate of the die plate assembly for probe head;
FIG. 13 is a top perspective view of the lower die plate of the die plate assembly for probe head;
FIG. 14 is a front view of the lower die plate of the die plate assembly for probe head, the rear side, the left side and the right side being an identical image;
FIG. 15 is a top plan view of the lower die plate of the die plate assembly for probe head;
FIG. 16 is a bottom plan view of the lower die plate of the die plate assembly for probe head; and,
FIG. 17 is a bottom perspective view of the lower die plate of the die plate assembly for probe head.
The broken lines depict portions of the die assembly and form no part of the claimed design.

公开(公告)号：US11733267B2

公开(公告)日：2023-08-22

申请号：US16822896

申请日：2020-03-18

申请人： MPI Corporation

发明人： Che-Wei Lin ,  Ting-Ju Wu ,  Keng-Min Su ,  Chin-Yi Lin

IPC分类号： G01R1/073 ,  G01R1/067

CPC分类号： G01R1/07314 ,  G01R1/06733

摘要： A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.

公开(公告)号：US11493536B2

公开(公告)日：2022-11-08

申请号：US17329465

申请日：2021-05-25

申请人： MPI Corporation

发明人： Tzu-Yang Chen ,  Chin-Yi Lin ,  Chen-Rui Wu ,  Sheng-Yu Lin ,  Ming-Ta Hsu ,  Chia-Ju Wei

IPC分类号： G01R1/067

摘要： A probe head includes upper and lower die units, and a linear probe inserted therethrough and thereby defined with tail, body and head portions. A first bottom surface of the upper die unit and a second top surface of the lower die unit face each other, thereby defining an inner space wherein the body portion is located and includes a plurality of sections each having front width larger than or equal to back width, including a narrowest section whose upper and lower ends have a distance from the first bottom surface and the second top surface respectively. The head and tail portions are offset from each other along two horizontal axes and the body portion is thereby curved. The present invention is favorable in dynamic behavior control of the linear probe which is easy in manufacturing, lower in cost and has more variety in material.

公开(公告)号：US20240118316A1

公开(公告)日：2024-04-11

申请号：US18544756

申请日：2023-12-19

申请人： MPI Corporation

发明人： Chin-Yi Lin ,  Che-Wei Lin ,  Ting-Ju Wu ,  Chien-Kai Hung

IPC分类号： G01R3/00 ,  G01R1/073

CPC分类号： G01R3/00 ,  G01R1/07342

摘要： A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.

公开(公告)号：US11874313B2

公开(公告)日：2024-01-16

申请号：US17518311

申请日：2021-11-03

申请人： MPI Corporation

发明人： Chin-Yi Lin ,  Che-Wei Lin ,  Ting-Ju Wu ,  Chien-Kai Hung

IPC分类号： G01R3/00 ,  G01R1/073

CPC分类号： G01R3/00 ,  G01R1/07342

摘要： A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.

公开(公告)号：US20220170961A1

公开(公告)日：2022-06-02

申请号：US17518311

申请日：2021-11-03

申请人： MPI Corporation

发明人： Chin-Yi Lin ,  Che-Wei Lin ,  Ting-Ju Wu ,  Chien-Kai Hung

IPC分类号： G01R3/00 ,  G01R1/073

摘要： A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.

公开(公告)号：US12050235B2

公开(公告)日：2024-07-30

申请号：US17569080

申请日：2022-01-05

申请人： MPI CORPORATION

发明人： Chin-Yi Lin ,  Keng-Min Su ,  Che-Wei Lin ,  Ko-Chun Wu

IPC分类号： G01R1/00 ,  G01R1/073 ,  G01R1/44

CPC分类号： G01R1/44 ,  G01R1/07342

摘要： A heat dissipatable die unit includes an outer die, a metal heat dissipating layer and an inner die piled in order. The inner die includes a probe installation section, and a peripheral portion surrounding the probe installation section and having an inner connecting surface for being connected to a die and an outer connecting surface opposite thereto. The probe installation section has a recessed portion recessed from the inner connecting surface, and a protruding portion protruding from the outer connecting surface, thereby forming a level difference portion bordering the peripheral portion. The outer die includes an installation recess and a supporting portion surrounding the installation recess. The installation recess is recessed from an inner surface of the supporting portion and accommodates the protruding portion of the inner die. The metal heat dissipating layer is disposed between the peripheral portion and the supporting portion to attain heat dissipating effect.

公开(公告)号：US11619656B2

公开(公告)日：2023-04-04

申请号：US17565075

申请日：2021-12-29

申请人： MPI CORPORATION

发明人： Chin-Yi Lin ,  Keng-Min Su ,  Che-Wei Lin ,  Hsin-Cheng Hung

IPC分类号： G01R1/073

摘要： A probe head includes a middle die, upper and lower die units, at least one of which includes inner and outer dies detachably fastened to the middle die and each other, and a plurality of buckled probes inserted through the upper and lower die units. The inner die has an outer connecting surface connected with an inner surface of the outer die, where an installation recess is provided, an inner connecting surface connected with the middle die, and a probe installation section having a protruding portion protruding from the outer connecting surface and located in the installation recess, and a recessed portion recessed from the inner connecting surface and located correspondingly to the protruding portion. The protruding portion and the installation recess have a horizontal distance therebetween. Therefore, the outer die is horizontally fine adjustable to make the positions of the probes meet the requirement.

公开(公告)号：US20200309819A1

公开(公告)日：2020-10-01

申请号：US16822896

申请日：2020-03-18

申请人： MPI Corporation

发明人： Che-Wei Lin ,  Ting-Ju Wu ,  Keng-Min Su ,  Chin-Yi Lin

IPC分类号： G01R1/073 ,  G01R1/067

摘要： A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.