Measurement system and measurement method

    公开(公告)号:US11789079B2

    公开(公告)日:2023-10-17

    申请号:US17211030

    申请日:2021-03-24

    发明人: Michael Feilen

    CPC分类号: G01R31/31926 G01R31/31935

    摘要: A measurement system is described. The measurement system includes a test-and-measurement (T&A) circuit and an error analysis circuit. The T&A circuit is configured to generate measurement data. The measurement data includes at least one of analysis data and configuration data. The analysis data is associated with an analysis of at least one input signal. The configuration data is associated with at least one of a physical measurement setup of the measurement system and measurement settings of the measurement system. The T&A circuit further is configured to generate a graphic representation of the measurement data. The error analysis circuit is configured to identify errors or anomalies associated with the measurement data based on the graphic representation. Further, a measurement method is described.

    Decoupling BTI and HCI mechanism in ring oscillator

    公开(公告)号:US11789064B1

    公开(公告)日:2023-10-17

    申请号:US17852181

    申请日:2022-06-28

    摘要: A ring oscillator circuit design includes three or more inverter stages connected in series. Each inverter stage includes one or more inverter devices including a PMOS device and a coupled NMOS device. The PMOS device in each of odd alternating inverter devices of the three or more inverter stages having a source terminal receiving power from a power rail conductor, and a source terminal of the coupled NMOS device in each of first alternating inverter devices is grounded. An output of a last inverter device of a last stage of the three or more inverter stages is connected to an input of a first inverter stage. The method measures a first frequency of a first ring oscillator circuit and measures a second frequency of a second ring oscillator circuit design to determine either a BTI or HCI failure mechanism of the first ring oscillator circuit based on the measurements.

    IN-CIRCUIT EMULATOR DEVICE
    23.
    发明公开

    公开(公告)号:US20230314513A1

    公开(公告)日:2023-10-05

    申请号:US18192488

    申请日:2023-03-29

    发明人: Hiroshi YAMASAKI

    IPC分类号: G01R31/319 G01R31/317

    摘要: An in-circuit emulator device includes a CPU that generates a first address signal by executing a program in synchronization with a first clock signal, a real-time capture circuit that generates a second address signal in synchronization with a second clock signal having a higher frequency than the first clock signal, and a selector circuit that supplies the second address signal to a storage device during a first period of one cycle of the first clock signal, and supplies the first address signal to the storage device during the remaining second period. The storage device reads data from a storage location of an address identified by the second address signal while the second address signal is supplied, and writes data from the CPU to a storage location of an address identified by the first address signal or reads data from said storage location while the first address signal is supplied.

    Test equipment diagnostics systems and methods

    公开(公告)号:US11714132B2

    公开(公告)日:2023-08-01

    申请号:US17219297

    申请日:2021-03-31

    IPC分类号: G01R31/319 G01R31/28

    摘要: Presented embodiments facilitate efficient and effective diagnostic of test system operations, including temperature control of test equipment components. In one embodiment a test equipment diagnostic method includes applying a known/expected first bit pattern to a test equipment component, applying a known/expected second bit pattern to a test equipment component, and performing a test equipment temperature control analysis based upon the results of applying the known/expected first bit pattern and known/expected second bit pattern. The first bit pattern and second bit pattern have known/expected respective thermal loads and corresponding respective first known/expected/expected temperature and second known/expected/expected temperature. In one embodiment, performing a test equipment temperature control analysis includes determining if temperature control components control a temperature of the test equipment component within acceptable tolerances. In one exemplary implementation, the test equipment component is a test control component (e.g., a field programmable gate array (FPGA), etc.).