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    Method of chemical polishing of planar silicon structures having filled grooves therein
    21.
    发明授权
    Method of chemical polishing of planar silicon structures having filled grooves therein 失效
    具有填充槽的平面硅结构的化学抛光方法

    公开(公告)号：US3911562A

    公开(公告)日：1975-10-14

    申请号：US43283974

    申请日：1974-01-14

    Applicant: SIGNETICS CORP

    Inventor： YOUMANS ALBERT PEEPLIS

    IPC: H01L21/318 ,  H01L21/321 ,  H01L21/763 ,  H01L23/29 ,  B01J17/00 ,  H01L1/10

    CPC classification number: H01L21/763 ,  H01L21/3185 ,  H01L21/321 ,  H01L21/3212 ,  H01L23/291 ,  H01L2924/0002 ,  Y10S438/959 ,  H01L2924/00

    Abstract: Method of chemical polishing of planar silicon structures by use of a silicon semiconductor body having planar surfaces with recesses therein opening through the surface. A stop layer is formed on the surface and then the recesses are filled with a filling material. The semiconductor structure with the filled surface is then polished by the use of a polishing pad and applying to the polishing pad a first active chemical agent and applying a second chemical agent to the pad at the same time that the first chemical agent is being applied. The polishing is continued until the stop layer is reached.

    Abstract translation: 通过使用具有通过表面开口的具有凹部的平面表面的硅半导体本体对平面硅结构进行化学抛光的方法。 在表面上形成止挡层，然后用填充材料填充凹部。 然后通过使用抛光垫对具有填充表面的半导体结构进行抛光，并将第一活性化学试剂施加到抛光垫上，并在施加第一化学试剂的同时将第二化学试剂施加到焊盘。 继续研磨直到达到止挡层。

    Encapsulated packaged electronic assembly
    22.
    发明授权
    Encapsulated packaged electronic assembly 失效
    封装包装电子总成

    公开(公告)号：US3749601A

    公开(公告)日：1973-07-31

    申请号：US3749601D

    申请日：1971-04-01

    Applicant: HUGHES AIRCRAFT CO

    Inventor： TITTLE H

    IPC: H01C1/034 ,  H01L23/31 ,  H05K3/28 ,  H05K5/06 ,  H01L1/10

    CPC classification number: H05K5/065 ,  H01C1/034 ,  H01L23/3135 ,  H01L2924/0002 ,  H05K3/284 ,  H05K2201/0179 ,  H05K2201/09872 ,  H05K2203/1316 ,  H05K2203/1322 ,  Y10T29/49146 ,  Y10T428/239 ,  Y10T428/31515 ,  Y10T428/31587 ,  H01L2924/00

    Abstract: AN IMPROVEMENT IN THE ECONOMY OF PACKAGING BY LOCKING OUT HARMFUL PARTICULATES BEFORE APPLICATON OF INSULATION PACKING AND SAVINGS IN REWORK OR REPAIR OF INSULATION PACKAGED AND ENCAPSULATED ELECTRICAL COMPONENTS, ASSEMBLIES OR CIRCUITRY. THE THREE COMPONENT PACKAGE STRUCTURE PROVIDED IS PREFABRICATED ELECTRONIC CIRCUITRY COMPONENTS STRUCTURE HAVING A CONFORMAL COATING OF RELATIVELY SOLVENT INSOLUBLE POLYMERS AS POLYMERS OF PARA-XYLYLENE MATERIAL OR RELATIVELY SOLVENT INSOLUBLE POLYMERS OF POLYPHENYLENE AND CURING AGENT INTERMEDIATE THE ELECTRONIC COMPONENTS AND A CONVENTIONALLY APPLIED RELATIVELY SOLVENT SOLUBLE COATING OF INSULATING RESIN MATERIAL OR CONVENTIONAL FOAM AS POLYURETHANE, EPOXY RESIN, AND THE LIKE POTTING MATERIAL APPLIED THEREOVER. IN ADDITION TO IMPROVING UPON THE INSULATION ENCAPSULATED PREFABRICATED ELECTRONIC CIRCUITRY BY REDUCING THE NUMBER OF DEFECTIVE ELECTRONIC UNIT MANUFACTURED, THIS IMPROVED PACKAGING ALSO IS OF ECONOMIC VALUE TO THE INDUSTRY BY ENABLING ECONOMIC CHEMICAL REMOVAL OF THE INSULATING FOAM OR POTTING COMPOUND AND REWORKING THE CIRCUITRY OR REPLACEMENT OF A DEFECTIVE CIRCUITRY COMPONENT.

    FURTHER, THE MULTIPLE COATINGS PROVIDE MORE ASSURANCE OF MAINTAINING RESONATE FREQUENCY AND AIDS IN IMPROVING VIBRATION AND SHOCK RESISTANCE.

    Silicon carbide lamp mounted on a ceramic of poor thermal conductivity
    23.
    发明授权
    Silicon carbide lamp mounted on a ceramic of poor thermal conductivity 失效
    陶瓷碳化硅灯安装在不良热导率陶瓷上

    公开(公告)号：US3715636A

    公开(公告)日：1973-02-06

    申请号：US3715636D

    申请日：1972-01-03

    Applicant: GEN ELECTRIC

    Inventor： JAFFE M ,  POTTER R

    IPC: H01L33/34 ,  H01L33/48 ,  H01L33/56 ,  H01L33/64 ,  H01L15/00 ,  H01L1/02 ,  H01L1/10

    CPC classification number: H01L33/64 ,  H01L33/343 ,  H01L33/483 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A boron-doped silicon carbide light-emitting diode chip is mounted, such as on a support member of porous ceramic or other material of similarly low thermal conductivity, so as to operate at a temperature of at least 150*C. Such a construction increases the amount of light produced by the boron-doped silicon carbide diode, due to increased operating temperature. A cover is placed over the diode to prevent convection cooling, thus further increasing the operating temperature and hence the light output. Instead of boron doping, the silicon carbide diode can be doped with other materials that produce similarly deep acceptor levels.

    Abstract translation: 硼掺杂的碳化硅发光二极管芯片安装在多孔陶瓷的支撑构件或类似的低导热性的其它材料上，以便在至少150℃的温度下工作。这种结构增加 硼掺杂碳化硅二极管产生的光量，由于工作温度的升高。 在二极管上放置盖子以防止对流冷却，从而进一步增加工作温度，从而进一步增加光输出。 代替硼掺杂，碳化硅二极管可以掺杂有产生类似深受主电平的其它材料。

    System for maintaining uniform temperature conditions throughout a body
    25.
    发明授权
    System for maintaining uniform temperature conditions throughout a body 失效
    通过身体维持均匀温度条件的系统

    公开(公告)号：US3590327A

    公开(公告)日：1971-06-29

    申请号：US3590327D

    申请日：1969-04-24

    Applicant: TRANSMATION INC

    Inventor： THOMAE MAURICIO A

    IPC: H05K7/20 ,  H01L1/10 ,  H01L1/12

    CPC classification number: H05K7/20509

    Abstract: The disclosure relates to a temperature regulating system for maintaining temperatures relatively constant throughout a capsule containing electronic components and for causing gradual change, if any, of temperature caused by changes in the outer environment. This is provided by placing the components in a high thermal conductivity material which is enclosed by a low thermal conductivity material. Electronic components and electrical components are glued and potted in apertures within the interior high thermal conductivity member by means of a substantially electrically nonconducting and thermally highly conductive material such as an epoxy filled with beryllium oxide. According to a second embodiment the inner capsule is molded from a high thermal conductivity ceramic such as aluminum oxide or beryllium oxide. It is also possible to encapsulate the components prior to baking of the ceramic material. According to a third embodiment, the electrical and electronic components are potted directly in a beryllium oxide epoxy which will keep the components mechanically rigid within the potting material. Such a material would have substantially no electrical conductivity and very high thermal conductivity.

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