公开(公告)号：US3566458A

公开(公告)日：1971-03-02

申请号：US3566458D

申请日：1968-05-22

Applicant: SPRAGUE ELECTRIC CO

Inventor： O'CONE ATTILLIO

IPC: H01L21/56 ,  H01L23/29 ,  H01L23/488 ,  H01L23/495 ,  B01J17/00 ,  H01L1/10

CPC classification number: H01L21/56 ,  H01L23/293 ,  H01L23/488 ,  H01L23/49558 ,  H01L24/48 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/45099

Abstract: THE METHOD OF ENCAPSULATING A TRANSISTOR INVOLVING MOUNTING A TRANSISTOR TO THE LEAD POSTS OF A HEADER. THE HEADER IS A PLURALITY OF LEAD POSTS FIXED IN POSITION BY A FIRST INSULATIVE MATERIAL. ENCAPSULATING THE TRANSISTOR IN A SECOND INSULATIVE MATERIAL AND SELECTIVELY SOLVENT REMOVING THE FIRST INSULATIVE MATERIAL.