Abstract:
The disclosure relates to a temperature regulating system for maintaining temperatures relatively constant throughout a capsule containing electronic components and for causing gradual change, if any, of temperature caused by changes in the outer environment. This is provided by placing the components in a high thermal conductivity material which is enclosed by a low thermal conductivity material. Electronic components and electrical components are glued and potted in apertures within the interior high thermal conductivity member by means of a substantially electrically nonconducting and thermally highly conductive material such as an epoxy filled with beryllium oxide. According to a second embodiment the inner capsule is molded from a high thermal conductivity ceramic such as aluminum oxide or beryllium oxide. It is also possible to encapsulate the components prior to baking of the ceramic material. According to a third embodiment, the electrical and electronic components are potted directly in a beryllium oxide epoxy which will keep the components mechanically rigid within the potting material. Such a material would have substantially no electrical conductivity and very high thermal conductivity.