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358 条记录 (耗时 0.021 秒)

    Photosensitive composition comprising photosensitive saponified poly(vinyl acetate) and pattern formation method making use of the composition
    21.
    发明申请
    Photosensitive composition comprising photosensitive saponified poly(vinyl acetate) and pattern formation method making use of the composition 失效
    包含光敏皂化聚乙酸乙烯酯的光敏组合物和使用该组合物的图案形成方法

    公开(公告)号：US20030022104A1

    公开(公告)日：2003-01-30

    申请号：US10198657

    申请日：2002-07-12

    发明人： Masahiro Takano ,  Shin Utsunomiya ,  Nobuji Sakai ,  Noriaki Tochizawa

    IPC分类号： G03C001/73 ,  G03C001/725 ,  G03C001/74 ,  G03F007/20 ,  G03F007/30

    CPC分类号： G03F7/0048 ,  G03F7/0388 ,  Y10S430/106 ,  Y10S430/11

    摘要： A photosensitive resin composition which includes a photosensitive saponified PVA having a pendant group derived from a quaternary styrylpyridinium or styrylquinolinium, or a derivative thereof. The composition comprises a photosensitive saponified PVA which has structural units represented by formulas (1) to (4): 1 which product is dissolved in at least one organic solvent selected from the group consisting of compounds represented by formulas (5), (6), and (7). 2 The resin composition can be dissolved in a comparatively safe high-boiling-point solvent, such as propylene glycol, and can be developed with water.

    摘要翻译： 一种感光性树脂组合物，其包含具有衍生自季戊烯基吡啶鎓或苯乙烯基喹啉鎓的侧基的感光性皂化PVA或其衍生物。 该组合物包含具有由式（1）至（4）表示的结构单元的光敏皂化PVA：该产物溶于至少一种选自式（5），（6）， 和（7）。 树脂组合物可以溶解在比较安全的高沸点溶剂如丙二醇中，并且可以用水显影。

    Low “K” factor hybrid photoresist
    25.
    发明授权
    Low “K” factor hybrid photoresist 失效
    低“K”因子混合光刻胶

    公开(公告)号：US06440635B1

    公开(公告)日：2002-08-27

    申请号：US09675608

    申请日：2000-09-29

    申请人： Steven J. Holmes ,  Ahmad D. Katnani ,  Niranjan M. Patel ,  Paul A. Rabidoux

    发明人： Steven J. Holmes ,  Ahmad D. Katnani ,  Niranjan M. Patel ,  Paul A. Rabidoux

    IPC分类号： G03F7039

    CPC分类号： G03F7/0045 ,  G03F7/095 ,  Y10S430/106 ,  Y10S430/11 ,  Y10S430/111

    摘要： A photoresist having both positive and negative tone components resulting in a lower “k” factor than the single tone photoresist is disclosed. The hybrid resist may either have the negative tone resist or the positive tone resist as the major portion, while the other tone is a relatively minor portion. For examples, a positive tone resist may include a minor portion of a negative tone cross-linker or a negative tone resist may include positively acting functional groups. The hybrid resist of the present invention allows for wider exposure dosage windows, therefore increasing the yield or performance and line density.

    摘要翻译： 公开了具有比单色光致抗蚀剂低的“k”因子的具有正和负色调分量的光致抗蚀剂。 混合抗蚀剂可以具有负色调抗蚀剂或正色调抗蚀剂作为主要部分，而另一种色调是相对较小的部分。 例如，正色调抗蚀剂可以包括负色调交联剂的较小部分或负色调抗蚀剂可以包括正性官能团。 本发明的混合抗蚀剂允许更宽的曝光剂量窗口，从而提高产量或性能和线密度。

    Water-developable plate package
    26.
    发明授权
    Water-developable plate package 失效
    水显板包装

    公开(公告)号：US06291060B1

    公开(公告)日：2001-09-18

    申请号：US09486650

    申请日：2000-02-25

    申请人： Takeshi Oyoshi ,  Yoshifumi Araki

    发明人： Takeshi Oyoshi ,  Yoshifumi Araki

    IPC分类号： B65D8126

    CPC分类号： G03C3/00 ,  G03F7/09 ,  Y10S430/11 ,  Y10T428/249987 ,  Y10T428/249991 ,  Y10T428/249992

    摘要： The present invention concerns a water-developable plate package comprising water-developable plates packaged in a laminated state. The water-developable plate is a sheet-like plate comprising a photosensitive layer made of a photosensitive resin composition having water-developability and protective films covering both surfaces of this photosensitive layer. The package of the present invention is obtained by sandwiching an open cell foamed sheet (2) between a water-developable plate (1) and between a water-developable plate (1) to make a laminate (3), packaging the laminate (3) with a light-screening film and fixing the packaging ends with a tape. The subject of the present invention is to prevent the occurrence of deformation of the plates in the package during transportation or storage at a high temperature and high humidity in summer, without complicating the operations at the time of use or packaging of the plates and without increasing the cost remarkably.

    摘要翻译： 本发明涉及一种水可显影板包装，其包括以层压状态包装的可水显示板。 水可显影板是包括由具有水显影性的感光性树脂组合物制成的感光层和覆盖该感光层的两个表面的保护膜的片状板。 本发明的包装是通过将开孔单元发泡片材（2）夹在水显影板（1）之间和水显影板（1）之间并制成层压体（3），将层压体（3） ），并用胶带固定包装端。 本发明的主题是为了防止在夏季高温高湿运输或储存期间包装件中的板的变形，而不会使板或使用时的操作复杂化，并且不增加 成本显着。

    Resist compositions
    27.
    发明申请
    Resist compositions 失效
    抗蚀剂组合物

    公开(公告)号：US20010018161A1

    公开(公告)日：2001-08-30

    申请号：US09742084

    申请日：2000-12-22

    发明人： Kazuhiko Hashimoto

    IPC分类号： G03F007/004

    CPC分类号： G03F7/004 ,  G03F7/0757 ,  Y10S430/106 ,  Y10S430/11 ,  Y10S430/111

    摘要： There is provided a resist composition containing a photosensitive resin and used in photolithography, said photosensitive resin having a transmittance of 40% or more for a light having a wavelength of 157 nm in applying to a thickness of 0.1 nullm. The composition has a characteristic that it allows easy formation of a fine pattern having a good profile, particularly at a wavelength for exposure with an F2 excimer laser.

    摘要翻译： 提供了含有感光性树脂并用于光刻的抗蚀剂组合物，所述感光性树脂在施加厚度为0.1μm的情况下对波长为157nm的光具有40％以上的透射率。 该组合物具有容易形成具有良好外形的细微图案的特征，特别是在用F2准分子激光曝光的波长下。

    Photoresist, compounds for composing the photoresist, and method of forming pattern by using the photoresist
    28.
    发明授权
    Photoresist, compounds for composing the photoresist, and method of forming pattern by using the photoresist 失效
    光致抗蚀剂，用于构成光致抗蚀剂的化合物，以及通过使用光致抗蚀剂形成图案的方法

    公开(公告)号：US5994025A

    公开(公告)日：1999-11-30

    申请号：US763054

    申请日：1996-12-10

    申请人： Shigeyuki Iwasa ,  Kaichiro Nakano ,  Katsumi Maeda ,  Takeshi Ohfuji ,  Etsuo Hasegawa

    发明人： Shigeyuki Iwasa ,  Kaichiro Nakano ,  Katsumi Maeda ,  Takeshi Ohfuji ,  Etsuo Hasegawa

    IPC分类号： C08F220/04 ,  C08F220/06 ,  C08F220/10 ,  C08F220/18 ,  C08F220/26 ,  C08F220/28 ,  C09D133/04 ,  C09D133/14 ,  G03F7/004 ,  G03F7/039 ,  H01L21/027

    CPC分类号： G03F7/039 ,  G03F7/0045 ,  Y10S430/11 ,  Y10S430/111

    摘要： There is provided a photoresist including (a) a resin composed of a polymer represented with the following general formula [1], and (b) a photo acid generator which produces acid when exposed to a light: ##STR1## wherein each of R.sup.1, R.sup.3 and R.sup.7 represents one of a hydrogen atom and a methyl group, R.sup.2 represents a hydrocarbon group including a bridged cyclic hydrocarbon group and having a carbon number in the range of 7 to 13 both inclusive, R.sup.4 represents one of a hydrogen atom and a hydrocarbon group having a carbon number of 1 or 2, R.sup.5 represents a hydrocarbon group having a carbon number of 1 or 2, R.sup.6 represents one of (a) a hydrocarbon group having a carbon number in the range of 1 to 12 both inclusive, (b) a hydrocarbon group having a carbon number in the range of 1 to 12 both inclusive and replaced with an alkoxy group having a carbon number in the range of 1 to 12 both inclusive, and (c) a hydrocarbon group having a carbon number in the range of 1 to 12 both inclusive and replaced with an acyl group having a carbon number in the range of 1 to 13 both inclusive, x+y+z=1, x is in the range of 0.1 to 0.9, y is in the range of 0.1 to 0.7, and z is in the range of 0 to 0.7. The resin has a weight percent in the range of 75 to 99.8 both inclusive, and the photo acid generator has a weight percent in the range of 0.2 to 25 both inclusive. The above mentioned photoresist produces no extra polymer by side reaction. Thus, the photoresist has high resolution to thereby make it possible to form a fine pattern without resist residue.

    摘要翻译： 提供了包含（a）由以下通式[1]表示的聚合物构成的树脂的光致抗蚀剂，（b）暴露于光时产生酸的光酸产生剂：其中R1，R3和R7 表示氢原子和甲基中的一个，R 2表示包含桥连环烃基并且碳数为7〜13的碳原子的烃基，R4表示氢原子和具有 碳原子数1或2，R 5表示碳数为1或2的烃基，R 6表示（a）碳原子数为1〜12的烃基，（b）烃 碳数为1〜12的碳原子数为2〜12的碳原子数为2〜12的烷氧基，（c）碳数为1以上的烃基 到12，并用a替代 碳原子数为1〜13的碳原子，x + y + z = 1，x在0.1〜0.9的范围内，y在0.1〜0.7的范围内，z在范围 为0〜0.7。 树脂的重量百分比在75〜99.8之间，光酸产生剂的重量百分比在0.2〜25的范围内。 上述光致抗蚀剂通过副反应不产生额外的聚合物。 因此，光致抗蚀剂具有高分辨率，从而可以形成没有抗蚀剂残留物的精细图案。

    Resist composition, a process for forming a resist pattern and a process for manufacturing a semiconductor device
    30.
    发明授权
    Resist composition, a process for forming a resist pattern and a process for manufacturing a semiconductor device 失效
    抗蚀剂组合物，形成抗蚀剂图案的工艺和制造半导体器件的工艺

    公开(公告)号：US5910392A

    公开(公告)日：1999-06-08

    申请号：US882734

    申请日：1997-06-26

    申请人： Koji Nozaki ,  Ei Yano ,  Keiji Watanabe ,  Takahisa Namiki ,  Miwa Igarashi

    发明人： Koji Nozaki ,  Ei Yano ,  Keiji Watanabe ,  Takahisa Namiki ,  Miwa Igarashi

    IPC分类号： H01L21/3065 ,  G03F7/004 ,  G03F7/039 ,  G03F7/40 ,  H01L21/027 ,  H01L21/302 ,  G03C1/492

    CPC分类号： G03F7/0045 ,  G03F7/039 ,  Y10S430/106 ,  Y10S430/11 ,  Y10S430/111

    摘要： The present invention discloses a chemically amplified resist composition that is able to form a resist pattern that can be exposed in short wavelength regions, has good transparency, sensitivity, dry-etch resistance and resolution, while also exhibiting excellent adhesion to the substrate. This chemically amplified resist composition comprises: the combination of a base resin comprised of a polymer that is itself insoluble in a basic aqueous solution and contains at least (A) a monomer unit I having carboxylic acid or phenol protected with a specific protective group, and (B) a monomer unit II having an ester group or ether group that contains a cyclic carbonate structure, and can become soluble in a basic aqueous solution when the protective group of the monomer unit I is deprotected by the effect of the acid; and, a photo acid generator capable of generating an acid that can provoke deprotection of the protective group of monomer unit I when decomposed by absorption of imaging radiation.

    摘要翻译： 本发明公开了一种化学放大抗蚀剂组合物，其能够形成可在短波长区域中曝光的抗蚀剂图案，具有良好的透明度，灵敏度，耐干蚀刻性和分辨率，同时对基材表现出优异的粘合性。 该化学放大抗蚀剂组合物包括：由本身不溶于碱性水溶液且至少包含（A）具有被特定保护基保护的羧酸或苯酚的单体单元I的聚合物组成的基础树脂的组合，以及 （B）具有含有环状碳酸酯结构的酯基或醚基的单体单元II，当单体单元I的保护基被酸的作用脱保护时，可溶于碱性水溶液; 以及能够产生当通过吸收成像辐射分解时能够引发单体单元I的保护基的脱保护的酸的光酸反应产物。