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229 条记录 (耗时 0.022 秒)

    COMPOSITE MATERIAL STRUCTURE PROTECTED AGAINST THE EFFECTS OF LIGHTNING
    21.
    发明申请
    COMPOSITE MATERIAL STRUCTURE PROTECTED AGAINST THE EFFECTS OF LIGHTNING 审中-公开
    复合材料结构受到防雷效果的保护

    公开(公告)号：US20110318981A1

    公开(公告)日：2011-12-29

    申请号：US13139633

    申请日：2009-12-15

    申请人： Yohann Duval ,  Marie-Paule Guillou ,  Franck Uhlig

    发明人： Yohann Duval ,  Marie-Paule Guillou ,  Franck Uhlig

    IPC分类号： H05K9/00 ,  B32B3/10

    CPC分类号： H05K9/0086 ,  B64D45/02 ,  H05K9/0079 ,  Y10T442/10

    摘要： The invention relates to a part (1) including a structural portion made of an electrically insulating or low-conductive composite material (2), such that a piece containing glass fibres or carbon fibres is protected against the accumulation of electric charges or impact from lightning by a metallisation of the surface to be protected. The metallisation includes a screen (31) of an electrically conductive material covered with a layer of an electrically conductive paint (32). A sizing and priming layer (33) is also provided between the screen and the conductive paint, as well as a finish paint covering the conductive paint (32). The assembly results in a protection against impacts from lightning with a reduced size as compared to traditional metallisations with a metal screen.

    摘要翻译： 本发明涉及包括由电绝缘或低导电复合材料（2）制成的结构部分的部分（1），使得包含玻璃纤维或碳纤维的部件被保护免受电荷积聚或闪电的冲击 通过待保护表面的金属化。 金属化包括覆盖有导电涂料层（32）的导电材料的筛网（31）。 在筛网和导电涂料之间还设有施胶和起泡层（33），以及覆盖导电涂料（32）的涂漆。 与使用金属屏幕的传统金属镀层相比，该组件能够防止来自具有减小的尺寸的雷击的冲击。

    SHIELDING DEVICE
    24.
    发明申请
    SHIELDING DEVICE 有权
    屏蔽装置

    公开(公告)号：US20090114437A1

    公开(公告)日：2009-05-07

    申请号：US12193045

    申请日：2008-08-18

    申请人： Lung-Fai Tuen ,  Andy C.H. Chang

    发明人： Lung-Fai Tuen ,  Andy C.H. Chang

    IPC分类号： H05K9/00 ,  H01F1/00

    CPC分类号： H05K9/0079 ,  H01F1/26 ,  H01F1/37 ,  H05K9/0075 ,  H05K9/0081

    摘要： A shielding device configured to provide EMI and ESD protection includes an anti-ESD layer, a conductive layer, and an EMI blocking layer attached to each other in sequence. In addition, a supporting layer can be optionally attached to the EMI blocking layer to increase the strength of the shielding device.

    摘要翻译： 被配置为提供EMI和ESD保护的屏蔽装置包括依次连接到彼此的抗ESD层，导电层和EMI阻挡层。 此外，支撑层可以可选地附接到EMI阻挡层以增加屏蔽装置的强度。

    SYSTEM AND METHOD OF IMPROVING THE DIELECTRIC PROPERTIES OF LAMINATES
    25.
    发明申请
    SYSTEM AND METHOD OF IMPROVING THE DIELECTRIC PROPERTIES OF LAMINATES 审中-公开
    改善层压介电性能的系统及方法

    公开(公告)号：US20080178929A1

    公开(公告)日：2008-07-31

    申请号：US12016553

    申请日：2008-01-18

    申请人： Richard Skov ,  Eric Barker ,  Kenneth Burnham ,  Winsor Cho ,  John Pennace

    发明人： Richard Skov ,  Eric Barker ,  Kenneth Burnham ,  Winsor Cho ,  John Pennace

    IPC分类号： H01L31/042 ,  H02N6/00

    CPC分类号： B32B27/18 ,  B32B2307/202 ,  B32B2457/00 ,  H05K9/0079

    摘要： A laminate of dielectric materials is disclosed for use in protecting an electronic device. The laminate includes at least one layer of a polymeric material having an active material dispersed within the polymeric material and having a first thickness. The active material is responsive to external electric fields such that a higher voltage external electric field may be applied to one side of the laminate without any voltage passing through the laminate than a maximum voltage that could be applied to the laminate without passing through the laminate when the active material is not present within the polymeric material having the first thickness.

    摘要翻译： 公开了用于保护电子设备的电介质材料层压体。 所述层压体包括至少一层聚合物材料，所述聚合材料层具有分散在所述聚合材料内并具有第一厚度的活性材料。 活性材料响应于外部电场，使得可以将较高电压的外部电场施加到层压体的一侧，而没有任何电压通过层压体，而不是可以施加到层压板上的最大电压，而不通过层压体， 活性材料不存在于具有第一厚度的聚合材料内。

    Electrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereof
    27.
    发明授权
    Electrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereof 失效
    导电和耐磨损/耐刮擦的聚合材料，其制造方法及其用途

    公开(公告)号：US5721299A

    公开(公告)日：1998-02-24

    申请号：US193926

    申请日：1994-02-09

    申请人： Marie Angelopoulos ,  Ali Afzali-Ardakani ,  Jack A. Dickerson ,  Thomas B. Pillsbury ,  Karl J. Puttlitz ,  Jane M. Shaw ,  Jeffrey D. Gelorme

    发明人： Marie Angelopoulos ,  Ali Afzali-Ardakani ,  Jack A. Dickerson ,  Thomas B. Pillsbury ,  Karl J. Puttlitz ,  Jane M. Shaw ,  Jeffrey D. Gelorme

    IPC分类号： C08G61/12 ,  H01B1/12 ,  H01J29/86 ,  H01L23/498 ,  H01L23/60 ,  H01L33/38 ,  H01L33/42 ,  H05K9/00 ,  H01B1/06

    CPC分类号： H05K9/0079 ,  C08G61/12 ,  H01B1/125 ,  H01B1/127 ,  H01B1/128 ,  H01J29/868 ,  H01L23/49894 ,  H01L23/60 ,  H01L33/40 ,  H01L33/42 ,  H01L2924/0002

    摘要： Electrically conductive and abrasion resistant polymeric compositions, methods of fabrication thereof and uses thereof are described. Admixtures of abrasion resistant materials and electrically conductive polymeric materials are formed. Many of these admixtures are light transmitting and can be used as an abrasion resistant light transmitting electrostatic discharge layers. The light transmitting discharge layer is useful as a surface coating for visual displays such as CRT screens to avoid electrostatic accumulation of dust and scratching. The compositions can be admixtures of abrasion resistant silicones, polysiloxanes, acrylates, epoxies, methacrylates, epoxyacrylates, epoxymethacrylates, styrenes and electrically conductive polymers selected from the group of substituted and unsubstituted polyanilines, polyparaphenylenevinyles, substituted and unsubstituted polythiophenes substituted and unsubstituted poly-p-phenylene sulfides, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophenes, polyacetylines formed from soluble precursors, combinations thereof and blends thereof with other polymers. The compositions can be a layer of an electrically conductive polymer with an abrasion resistant layer thereover.

    摘要翻译： 描述了导电和耐磨聚合物组合物，其制造方法及其用途。 形成耐磨材料和导电聚合材料的外加剂。 这些混合物中的许多是透光性的并且可以用作耐磨光透射静电放电层。 透光放电层可用作诸如CRT屏幕的视觉显示器的表面涂层，以避免灰尘和划痕的静电积累。 组合物可以是耐磨硅氧烷，聚硅氧烷，丙烯酸酯，环氧树脂，甲基丙烯酸酯，环氧丙烯酸酯，环氧甲基丙烯酸酯，苯乙烯和选自取代和未取代的聚苯胺的聚合物，聚对亚苯基乙烯基，取代和未取代的聚噻吩的取代和未取代的聚对 - 取代和未取代的聚吡咯，取代和未取代的聚硒吩，可溶性前体形成的聚乙酰胺，其组合以及与其它聚合物的共混物。 组合物可以是其上具有耐磨层的导电聚合物层。

    Electrically conductive polymeric materials and uses thereof
    28.
    发明授权
    Electrically conductive polymeric materials and uses thereof 失效
    导电聚合材料及其用途

    公开(公告)号：US5202061A

    公开(公告)日：1993-04-13

    申请号：US717968

    申请日：1991-06-20

    申请人： Marie Angelopoulos ,  Wu-Song Huang ,  Richard D. Kaplan ,  Marie-Annick Le Corre ,  Stanley E. Perreault ,  Jane M. Shaw ,  Michel R. Tissier ,  George F. Walker

    发明人： Marie Angelopoulos ,  Wu-Song Huang ,  Richard D. Kaplan ,  Marie-Annick Le Corre ,  Stanley E. Perreault ,  Jane M. Shaw ,  Michel R. Tissier ,  George F. Walker

    IPC分类号： C08G61/12 ,  H01B1/12 ,  H01J29/86 ,  H01L23/498 ,  H01L23/60 ,  H05K9/00

    CPC分类号： H05K9/0079 ,  C08G61/12 ,  H01B1/125 ,  H01B1/127 ,  H01B1/128 ,  H01J29/868 ,  H01L23/49894 ,  H01L23/60 ,  H05K9/0081 ,  H01L2924/0002

    摘要： Structures containing conducting polymers and methods of fabrication thereof. Electrical conductivity can be induced in polymers selected from the group of substituted and unsubstituted polyanilines, polyparaphenylenvinyles, substituted and unsubstituted polythiophenes substituted and unsubstituted poly-p-phenylene sulfides, substituted polyfuranes, substituted polypyrroles, substituted polyselenophene, polyacetylines formed from soluble precursors, combinations thereof and blends thereof with other polymers. The polymer contains a doping precursor, selected from the group of onium salts, iodonium salts, triflate salts, borate salts and tosylate salts and sulfonoxylimides. Conductivity can be selectively induced in the polymer by selectively doping upon selective exposure to a source of energy such as electromagnetic radiation, an electron beam and heat. The electrically conductive polymers of the present invention are useful as electron discharge layers for electron beam applications, such as, SEM observations, as electromagnetic interference coatings on dielectric surfaces and as electron beam resist which acts as a discharge layer.

    摘要翻译： 含有导电聚合物的结构及其制造方法。 可以在选自取代和未取代的聚苯胺，聚对苯二烯基乙烯基，取代和未取代的聚噻吩，取代和未取代的聚对苯硫醚，取代的聚呋喃，取代的聚吡咯，取代的聚硒酚，由可溶性前体形成的聚乙炔，其组合 及其与其它聚合物的共混物。 聚合物含有选自鎓盐，碘鎓盐，三氟甲磺酸盐，硼酸盐和甲苯磺酸盐和磺酰氧基酰亚胺的掺杂前体。 通过在选择性地暴露于诸如电磁辐射，电子束和热能的能量源上选择性掺杂，可以在聚合物中选择性地诱导电导率。 本发明的导电聚合物可用作用于电子束应用的电子放电层，例如SEM观察，作为电介质表面上的电磁干扰涂层和用作放电层的电子束抗蚀剂。

    Electrostatic RF absorbant circuit carrier assembly and method for making the same
    29.
    发明授权
    Electrostatic RF absorbant circuit carrier assembly and method for making the same 失效
    静电RF吸收电路载体组件及其制造方法

    公开(公告)号：US5185654A

    公开(公告)日：1993-02-09

    申请号：US799235

    申请日：1991-11-27

    申请人： Mark D. Mosher ,  Robert Fraser ,  Ronald D. Fuller

    发明人： Mark D. Mosher ,  Robert Fraser ,  Ronald D. Fuller

    IPC分类号： H01L23/60 ,  H01L23/66 ,  H01Q17/00 ,  H05K9/00

    CPC分类号： H05K9/0079 ,  H01L23/60 ,  H01L23/66 ,  H01Q17/00 ,  H01L2924/0002 ,  H01L2924/1616 ,  H01L2924/3011 ,  Y10T29/49126

    摘要： An electrostatic RF absorbant circuit carrier assembly (200) is described as having a plastic support structure (100) which consists of an integrally fashioned base (180) and surrounding sidewalls (170) which together form an internal cavity (185). A plurality of conductor paths (125,165) are disposed within the cavity (185). The assembly (200) is completed by a polymeric cover (110) having a surface integrally fashioned to comprise wall members (145) for making contact with conductive paths (165) within the cavity (185). In order to facilitate RF isolation and electrostatic dissipation, the cover (110) is layered with a surface material comprising:a thermosetting matrix system;a non-conductive RF absorbing filler comprising 25 to 87 percent by weight loading of the thermosetting matrix system; anda conductive filler comprising 1 to 4 percent by weight loading of the thermosetting matrix system and the RF absorbing filler.

    摘要翻译： 静电RF吸收剂回路载体组件（200）被描述为具有塑料支撑结构（100），该塑料支撑结构由一体形成的基部（180）和围绕的侧壁（170）组成，这些侧壁一起形成内部空腔（185）。 多个导体路径（125,165）设置在空腔（185）内。 组件（200）由聚合物盖（110）完成，聚合物盖（110）具有整体形式的表面，包括用于与空腔（185）内的导电路径（165）接触的壁构件（145）。 为了促进RF隔离和静电耗散，盖（110）用表面材料层压，包括：热固性基体系; 一种非导电RF吸收填料，其包含25-87重量％的热固性基体系的负荷; 以及包含1至4重量％的热固性基体系和RF吸收填料的导电填料。

    Deposition of a conductive and protective coating on a metallic substrate
    30.
    发明授权
    Deposition of a conductive and protective coating on a metallic substrate 失效
    在金属基材上沉积导电和保护涂层

    公开(公告)号：US5043226A

    公开(公告)日：1991-08-27

    申请号：US341995

    申请日：1989-04-24

    申请人： Richard L. Wiedeman ,  Kenneth W. Mamayek ,  Henry B. Gordon ,  Mohan L. Sanduja ,  Kenneth K. Sugathan ,  Felicia Dragnea ,  Carl Horowitz

    发明人： Richard L. Wiedeman ,  Kenneth W. Mamayek ,  Henry B. Gordon ,  Mohan L. Sanduja ,  Kenneth K. Sugathan ,  Felicia Dragnea ,  Carl Horowitz

    IPC分类号： B05D7/16 ,  H05K9/00

    CPC分类号： H05K9/0079 ,  B05D7/16 ,  H05K9/0088 ,  Y10T428/31692

    摘要： A method of grafting a conductive, tenacious, and protective coating on a metallic substrate. The metallic substrate, such as steel, aluminum, iron, platinum, silver, nickel, gold, cobalt, copper, copper alloys, or combinations thereof, is contacted with a composition having: (i) one or more polymerizable monomers having at least two functionalities; (ii) one or more graft initiators containing nickel ion in an amount effective to initiate the graft polymerization of the monomers; and (iii) a reducing agent capable of reducing nickel ion to nickel metal. The composition and substrate are heated for a time and at a temperature effective to graft polymerize the monomers and nickel metal onto the substrate and form a conductive, tenacious, and protective coating bonded to the substrate. The coating can also contain elemental phosphorous. Preferably, the coated substrate has a surface resistivity of less than 0.1 ohm per square. The method, coated substrate, and composition are useful for improving the electro-magnetic compatibility (EMC) and electro-static discharge (ESD) protection of electrical enclosures.

    摘要翻译： 在金属基底上接枝导电，韧性和保护性涂层的方法。 金属基材如钢，铝，铁，铂，银，镍，金，钴，铜，铜合金或其组合与具有以下成分的组合物接触：（i）一种或多种可聚合单体，其具有至少两个 功能; （ii）一种或多种含有有效引发单体的接枝聚合的量的镍离子的接枝引发剂; 和（iii）能够将镍离子还原成镍金属的还原剂。 将组合物和基材加热一段时间并且在有效地将单体和镍金属接枝聚合到基材上并形成结合到基材上的导电，韧性和保护性涂层的温度。 涂层还可以含有元素磷。 优选地，涂覆的基底具有小于0.1欧姆/平方的表面电阻率。 该方法，涂覆的基材和组合物可用于改善电气外壳的电磁兼容性（EMC）和静电放电（ESD）保护。