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1.发明授权Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive 有权导热材料的自定向微板作为热糊或粘合剂中的组分公开(公告)号：US08604623B2
公开(公告)日：2013-12-10
申请号：US13553887
申请日：2012-07-20
IPC分类号： H01L23/04
CPC分类号： H01L23/3733 , B82Y30/00 , H01L23/373 , H01L23/3736 , H01L23/40 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , Y10S977/788 , Y10T156/10 , Y10T428/24994 , H01L2224/0401
摘要： The present invention relates generally to thermally-conductive pastes for use with integrated circuits, and particularly, but not by way of limitation, to self-orienting microplates of graphite.
摘要翻译： 本发明一般涉及用于集成电路的导热膏，特别是但不限于石墨的自取向微孔板。
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2.发明授权Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive 有权导热材料的自定向微板作为热糊或粘合剂中的组分公开(公告)号：US08268282B2
公开(公告)日：2012-09-18
申请号：US11758457
申请日：2007-06-05
IPC分类号： H01B1/04
CPC分类号： H01L23/3733 , B82Y30/00 , H01L23/373 , H01L23/3736 , H01L23/40 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , Y10S977/788 , Y10T156/10 , Y10T428/24994 , H01L2224/0401
摘要： The present invention relates generally to thermally-conductive pastes for use with integrated circuits, and particularly, but not by way of limitation, to self-orienting microplates of graphite.
摘要翻译： 本发明一般涉及用于集成电路的导热膏，特别是但不限于石墨的自取向微孔板。
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3.发明授权Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation 有权离心方法，用于提供具有电路形成的粉末材料的高纵横比盲孔公开(公告)号：US07452568B2
公开(公告)日：2008-11-18
申请号：US11049846
申请日：2005-02-04
申请人： Gareth Hougham , Leena Paivikki Buchwalter , Stephen L. Buchwalter , Jon Casey , Claudius Feger , Matteo Flotta , Jeffrey D. Gelorme , Kathleen C. Hinge , Anurag Jain , Sung K. Kang , John U. Knickerbocker
发明人： Gareth Hougham , Leena Paivikki Buchwalter , Stephen L. Buchwalter , Jon Casey , Claudius Feger , Matteo Flotta , Jeffrey D. Gelorme , Kathleen C. Hinge , Anurag Jain , Sung K. Kang , John U. Knickerbocker
CPC分类号： H05K3/4053 , B05D1/002 , H01L21/486 , H01L21/76898 , H05K2201/09509 , H05K2203/1554
摘要： The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.
摘要翻译： 本公开总体上涉及半导体，集成电路，特别是但不限于，用于填充高纵横比通孔和沟槽的离心方法，其具有粉末，浆料，材料的悬浮液，以充当导电的结构 支撑或电子部件的保护构件。
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公开(公告)号：US07063127B2
公开(公告)日：2006-06-20
申请号：US10665798
申请日：2003-09-18
申请人： Jeffrey D. Gelorme , Hendrik F. Hamann , Nancy C. LaBianca , Yves C. Martin , Theodore G. Van Kessel
发明人： Jeffrey D. Gelorme , Hendrik F. Hamann , Nancy C. LaBianca , Yves C. Martin , Theodore G. Van Kessel
IPC分类号： F28F7/00
CPC分类号： H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A thermal interface for IC chip cooling is provided. One embodiment of the thermal interface includes a thermally conductive liquid or paste-like metal(s) disposed within a flexible, thermally conductive enclosure. The enclosure is adapted to be placed between an IC chip and a heat sink to enhance heat transfer from the chip to the heat sink, thereby enabling quicker and more efficient cooling of the chip than can be achieved by conventional techniques. In several embodiments, the thermal interface is held in place by mechanical pressure rather than by bonding, which further facilitates inspection and repair of the IC device.
摘要翻译： 提供了用于IC芯片冷却的热接口。 热界面的一个实施例包括设置在柔性导热外壳内的导热液体或糊状金属。 壳体适于放置在IC芯片和散热器之间，以增强从芯片到散热片的热传递，从而比通过常规技术可以实现的更快和更有效地冷却芯片。 在几个实施例中，热界面通过机械压力而不是通过粘合保持在适当位置，这进一步便于IC器件的检查和修理。
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5.发明授权公开(公告)号：US06383415B1
公开(公告)日：2002-05-07
申请号：US09444985
申请日：1999-11-22
IPC分类号： H01B112
摘要： Cross-linked electrically conductive polymers, in particular electrically conductive, polyaniline are described. Dopants and substituents having pendant cross-linkable functionality are used which form a cross-linked conducting polymer network. The cross-linking functionality can be hydrogen-bonding as well as chemically polymerizable or cross-linkable. A conjugated path between chains can also be incorporated. The resulting cross-linked conducting polymers have enhanced thermal and environmental stability. The dopant cannot readily be washed out with solvents or diffuse out upon exposure to heat. In addition, the cross-linked polymers have enhanced electrical conductivity.
摘要翻译： 描述了交联的导电聚合物，特别是导电的聚苯胺。 使用具有侧链可交联官能团的掺杂剂和取代基，其形成交联的导电聚合物网络。 交联官能团可以是氢键合以及化学上可聚合的或可交联的。 还可以并入链之间的共轭路径。 所得的交联导电聚合物具有增强的热和环境稳定性。 掺杂剂不容易用溶剂洗涤或在暴露于热量时扩散出来。 此外，交联聚合物具有增强的导电性。
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公开(公告)号：US5560934A
公开(公告)日：1996-10-01
申请号：US480403
申请日：1995-06-07
申请人： Ali Afzali-Ardakani , Stephen L. Buchwalter , Jeffrey D. Gelorme , Laura L. Kosbar , Bert H. Newman , Frank L. Pompeo
发明人： Ali Afzali-Ardakani , Stephen L. Buchwalter , Jeffrey D. Gelorme , Laura L. Kosbar , Bert H. Newman , Frank L. Pompeo
IPC分类号： C08G59/02 , C07D303/24 , C08G59/00 , C08G59/18 , C08G59/22 , C08G59/24 , C08G59/42 , C08G59/50 , C08L63/00 , H01L23/29 , H01L23/31 , C08G63/00
CPC分类号： C08G59/24 , C07D303/24 , C08G59/18 , C08G59/22 , H01L23/293 , H01L2924/0002 , Y10S428/901 , Y10T428/12528 , Y10T428/12569 , Y10T428/2985 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31525
摘要： A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent and an amine promoter.
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公开(公告)号：US5457005A
公开(公告)日：1995-10-10
申请号：US85041
申请日：1993-07-02
申请人： Edward D. Babich , Jeffrey D. Gelorme , Ronald W. Nunes , Sharon L. Nunes , Jurij R. Paraszczak , Russell J. Serino
发明人： Edward D. Babich , Jeffrey D. Gelorme , Ronald W. Nunes , Sharon L. Nunes , Jurij R. Paraszczak , Russell J. Serino
CPC分类号： G03F7/0755 , Y10S430/122 , Y10S430/143
摘要： A dry developable photoresist composition that contains in admixture a polymeric epoxide; a di- or polyfunctional organosilicon material; and an onium salt; and use thereof to produce an image.
摘要翻译： 一种干燥可显影光致抗蚀剂组合物，其包含聚合物环氧化物; 二官能或多功能有机硅材料; 和盐盐; 并使用它来产生图像。
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公开(公告)号：US5391464A
公开(公告)日：1995-02-21
申请号：US174650
申请日：1993-12-28
CPC分类号： G03F7/0387 , G03F7/031
摘要： The present invention relates to thioxanthone sensitizers for radiation sensitive polyimide compositions for use in manufacturing integrated circuits such as chips, thin film packaging and printed circuit boards.
摘要翻译： 本发明涉及用于制造芯片，薄膜封装和印刷电路板等集成电路的辐射敏感性聚酰亚胺组合物的噻吨酮敏化剂。
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公开(公告)号：US5241040A
公开(公告)日：1993-08-31
申请号：US551716
申请日：1990-07-11
申请人： Jerome J. Cuomo , Jeffrey D. Gelorme , Michael Hatzakis, Jr. , David A. Lewis , Jane M. Shaw , Stanley J. Whitehair
发明人： Jerome J. Cuomo , Jeffrey D. Gelorme , Michael Hatzakis, Jr. , David A. Lewis , Jane M. Shaw , Stanley J. Whitehair
CPC分类号： H05B6/705 , B01J19/126 , C08G73/1025 , G01N22/00 , H05B6/68 , B01J2219/00191 , B01J2219/1215 , H05K1/0346 , H05K3/4644 , Y02B40/143 , Y10T428/31681 , Y10T428/31721
摘要： A method and apparatus are disclosed for conducting a physical process and a chemical reaction by exposing a material containing a volatile substance to microwave radiation where the morphology of said material will change when exposed to such radiation. The power of said radiation is adjusted over time as the morphology of the material changes to maximize the effect of the radiation in order to produce a product in a minimum amount of time that is substantially free of said volatile substance.The method and apparatus can also be used to conduct such a process or reaction with materials that do not contain a volatile material.In one embodiment a method and apparatus are disclosed for manufacturing a polyimide from a precursor in a solvent by exposing the precursor to microwave radiation in a tuneable microwave resonant cavity that is tuned during imidization to achieve critical coupling of the system. Microwave power is controlled to remove the solvent and obtain the desired level of reaction. Processing time has been reduced thirty fold as compared to conventional thermal methods.
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公开(公告)号：US5041470A
公开(公告)日：1991-08-20
申请号：US318208
申请日：1989-03-03
IPC分类号： C08F299/00 , C08F2/44 , C08F2/48 , C08F2/50 , C08F290/00 , C08F299/02 , C08G59/08 , C09J4/00 , C09J4/06 , C09J163/00 , C09J163/10 , C09J171/00 , H01L23/14 , H05K3/10 , H05K3/28 , H05K3/38
CPC分类号： H05K3/386 , C08G59/08 , C09J163/10 , C09J171/00 , C09J4/06 , H05K2201/10287 , H05K3/103 , H05K3/287
摘要： A photocurable adhesive composition comprising a phenoxy resin; a reaction product of an unsaturated carboxylic acid and epoxidized non-linear novolak; reaction product of an unsaturated carboxylic acid and a tetrabrominated diglycidyl ether of a phenol; monohydroxy dipentaerythritol acrylate and/or pentaerythritol tetraacrylate; polyethylenically unsaturated compound; and photoinitiator, and optionally, hexamethylol melamine-formaldehyde; and/or a thixotropic agent; and use thereof.
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