Abstract:
A method and apparatus for controlling an intensity distribution of a radiation beam directed to a microlithographic substrate. The method can include directing a radiation beam from a radiation source along the radiation path, with the radiation beam having a first distribution of intensity as the function of location in a plane generally transverse to the radiation path. The radiation beam impinges on an adaptive structure positioned in the radiation path and an intensity distribution of the radiation beam is changed from the first distribution to a second distribution by changing a state of the first portion of the adaptive structure relative to a second portion of the adaptive structure. For example, the transmissivity of the first portion, or inclination of the first portion can be changed relative to the second portion. The radiation is then directed away from the adaptive structure to impinge on the microlithographic substrate.
Abstract:
Asymmetrical structures and methods are used to adjust the orientation of a microlens for a pixel array. The asymmetrical structures affect volume and surface force parameters during microlens formation. Exemplary microlens structures include an asymmetrical microlens frame, base, material or a combination thereof to affect the focal characteristics of the microlens. The asymmetrical frame alters the microlens flow resulting from the heating of the microlens during fabrication such that orientation of the microlens relative to an axis of the imager can be controlled.
Abstract:
A microlens array having first and second sets of spherically-shaped microlenses. The second set of spherically-shaped microlenses are located in the areas between individual microlenses of the first set in such a way that there is minimized gapping over the entire microlens array. A semiconductor-based imager includes a pixel array having embedded pixel cells, each with a photosensor, and a microlens array having spherically-shaped microlenses as just described.
Abstract:
A microlens structure includes lower lens layers on a substrate. A sputtered layer of glass, such as silicon oxide, is applied over the lower lens layers at an angle away from normal to form upper lens layers that increase the effective focal length of the microlens structure. The upper lens layers can be deposited in an aspherical shape with radii of curvature longer than the lower lens layers. As a result, small microlenses can be provided with longer focal lengths. The microlenses are arranged in arrays for use in imaging devices.
Abstract:
A micro-lens array with reduced or no empty space between individual micro-lenses and a method for forming same. The micro-lens array is formed by patterning a first set of micro-lens material in a checkerboard pattern on a substrate. The first set of micro-lens material is reflowed and cured into first micro-lenses impervious to subsequent reflows. Then, a second set of micro-lens material is patterned in spaces among the first micro-lenses, reflowed and cured into second micro-lenses. The reflows and cures can be conducted under different conditions, and the micro-lenses may be differently sized. The conditions of the reflows can be chosen to ensure that the focal lengths of micro-lenses are optimized for maximum sensor signal.
Abstract:
An imaging system may include an array of lenses, each of which is aligned over a respective one of a plurality of imaging pixels. The array of lenses may be formed in two layers. The first layer may include a first set of non-adjacent lenses and centering structures between the first lenses. The centering structures may be aligned with the first set of lenses as part of a mask design with a high level of accuracy. The second layer may include a second set of lenses, each of which is formed on a respective one of the centering structures. Forming the second set of lenses may include a reflow process in which surface tension forces center the second set of lenses on their respective centering structures, thereby aligning the second set of lenses with the first set of lenses with a high level of accuracy.
Abstract:
Pixel arrays are provided for image sensors that have barriers between color filters in an array of color filters. Color filter barriers may be formed from a transparent or semi-transparent material. Color filter barriers may be formed from a low refractive index material. Color filters may be etched and color filter barrier material may be formed in the etched regions of the color filters. If desired, a layer of color filter barrier material may be etched to form open regions and color filter material may be formed in the open regions of the color filter barrier material. An image sensor may be a front-side illuminated image sensor or a back-side illuminated image sensor.
Abstract:
An image sensor integrated circuit may contain image sensor pixels. A channel containing a fluid with particles such as cells may be formed on top of the image sensor. Some of the image sensor pixels may form a calibration sensor and some of the image sensor pixels may form an imager. As the fluid and particles flow through the channel at a flow rate, the calibration sensor may measures the flow rate and illumination intensity in the channel. Based on calibration data such as measured flow rate and measured illumination intensity, adjustments may be made to ensure that the imager acquires satisfactory image data. The adjustments may include flow rate adjustments, image acquisition data rate adjustments, and illumination adjustments. A processing unit in the channel may contain a laser or other component to destroy selected cells. A flared region in the channel may be used as a chromatograph.
Abstract:
An integrated circuit may contain image sensor pixels. Channels containing a fluid with samples such as cells may be formed on top of the image sensor. Control circuitry may be formed on the integrated circuit. The image sensor pixels may form light sensors and imagers. Portions of the channel may have multiple chambers such as fluorescence detection chambers. Gating structures and other fluid control structures may control the flow of fluid through the channels and chambers. Portions of the channel may be used to form chambers. The chambers may each be provided with one or more light sensors, light sources, and color filters to alter the color of illumination form a light source, one or more reactants such as dyes, antigens, and antibodies, and heaters. The control circuitry may be configured to control the imagers, the gating structures, the fluid control structures, the light source, the heaters, etc.
Abstract:
Micro-electrical-mechanical (MEMS) wafers in which a lens is formed on a micro-electrical-mechanical structure. The micro-electrical-mechanical wafers can comprise a substrate, MEMS structures, and a lens array. A method of forming a micro-electrical-mechanical wafer comprises providing a substrate, forming a micro-electrical-mechanical structure on the substrate, forming a carrier, forming a lens array on the carrier, and transferring the lens array from the carrier onto the micro-electrical-mechanical structure. The lens array is placed above the micro-electrical-mechanical structure.