公开(公告)号：US08178420B2

公开(公告)日：2012-05-15

申请号：US12636869

申请日：2009-12-14

申请人： Takeshi Matsumura ,  Masaki Mizutani

发明人： Takeshi Matsumura ,  Masaki Mizutani

IPC分类号： H01L21/00

CPC分类号： H01L24/29 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/3025 ,  Y10T428/218 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/3512

摘要： A dicing/die-bonding film including a pressure-sensitive adhesive layer (2) on a supporting base material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein a releasability in an interface between the pressure-sensitive adhesive layer (2) and the die-bonding adhesive layer (3) is different between an interface (A) corresponding to a work-attaching region (3a) in the die-bonding adhesive layer (3) and an interface (B) corresponding to a part or a whole of the other region (3b), and the releasability of the interface (A) is higher than the releasability of the interface (B). The dicing/die-bonding film is excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.

摘要翻译： 一种在支撑基材（1）上具有压敏粘合剂层（2）和压敏粘合剂层（2）上的芯片粘合层（3）的切割/芯片接合膜，其中， 粘合剂层（2）与芯片粘合层（3）之间的界面在与芯片粘合层（3）中的工件附着区域（3a）相对应的界面（A）之间是不同的， 以及对应于另一区域（3b）的一部分或全部的界面（B），并且界面（A）的释放性高于界面（B）的剥离性。 切割/芯片接合膜在切割工件的保持性和脱模性之间的平衡优异，并且与芯片粘合层一起释放切割的切片工作。

公开(公告)号：US20120117192A1

公开(公告)日：2012-05-10

申请号：US13380260

申请日：2009-06-30

申请人： Martin Gerdes ,  Takeshi Matsumura ,  Toshikane Oda ,  Kenta Yasukawa

发明人： Martin Gerdes ,  Takeshi Matsumura ,  Toshikane Oda ,  Kenta Yasukawa

IPC分类号： G06F15/16

CPC分类号： H04L61/2528 ,  G06F9/54 ,  H04L65/1016 ,  H04L67/2895

摘要： An information processing system for offering a remote access from a device to a virtual service provided in a local network is provided. The virtual service invokes native services provisioned by a service provider. The system comprising: a management unit managing service information specifying a shortcut component of the service: an obtaining unit obtaining a request for the virtual service from the device; a receiving unit receiving the service information from the management unit; a specification unit specifying a shortcut component for the requested virtual service based on the received service information; an invoking unit executing the specified shortcut component by invoking native services to the service provider, and transferring the other component of the requested virtual service to the local network; a combination unit combining results; and a response unit responding the combined result to the device.

摘要翻译： 提供一种用于提供从设备到本地网络中提供的虚拟服务的远程访问的信息处理系统。 虚拟服务调用由服务提供商提供的本机服务。 所述系统包括：管理单元，管理指定所述虚拟服务的快捷部件的服务信息;获取单元，从所述设备获取对所述虚拟服务的请求; 接收单元，从所述管理单元接收所述服务信息; 指定单元，基于所接收的服务信息指定所请求的虚拟服务的快捷组件; 调用单元通过向服务提供者调用本地服务来执行指定的快捷方式组件，并将所请求的虚拟服务的其他组件传送到本地网络; 结合组合单位; 以及响应单元将组合的结果响应到设备。

公开(公告)号：US20120115776A1

公开(公告)日：2012-05-10

申请号：US13146575

申请日：2010-01-18

申请人： Takeshi Matsumura ,  Rie Yasuno ,  Chihiro Sugimoto ,  Noriko Tabayashi ,  Uiko Kagaya ,  Hiroko Miyashiro

发明人： Takeshi Matsumura ,  Rie Yasuno ,  Chihiro Sugimoto ,  Noriko Tabayashi ,  Uiko Kagaya ,  Hiroko Miyashiro

IPC分类号： A61K38/22 ,  A61P3/00 ,  C07K14/575

CPC分类号： C12N15/8257 ,  A23L33/17 ,  A23L33/18 ,  A61K38/22 ,  C07K14/5759

摘要： Disclosed is a technique that facilitates the oral ingestion of adiponectin in a large quantity and enables the expansion of the range of use applications of adiponectin. Specifically disclosed is an appetite control agent for oral administration, which comprises adiponectin as an active ingredient. Particularly, the appetite control agent comprises a transformant capable of expressing adiponectin. Also specifically disclosed is a food composition for controlling appetite, which comprises the appetite control agent.

摘要翻译： 公开了一种能够大量口服摄取脂联素的技术，能够扩大脂连蛋白的使用范围。 具体公开了口服给药的食欲调节剂，其包含脂联素作为活性成分。 特别地，食欲控制剂包括能够表达脂联素的转化体。 还具体公开了用于控制食欲的食物组合物，其包含食欲控制剂。

公开(公告)号：US20110243113A1

公开(公告)日：2011-10-06

申请号：US13139374

申请日：2009-01-16

申请人： Johan Hjelm ,  Takeshi Matsumura ,  Shingo Murakami ,  Toshikane Oda ,  Kenta Yasukawa

发明人： Johan Hjelm ,  Takeshi Matsumura ,  Shingo Murakami ,  Toshikane Oda ,  Kenta Yasukawa

IPC分类号： H04W84/02

CPC分类号： H04L65/1016 ,  H04L65/1006 ,  H04L65/1036 ,  H04L67/24 ,  H04W8/06 ,  H04W84/20

摘要： One aspect of the present invention will provide a first gateway apparatus configured to be connectable to a local network and an external network, to obtain presence information of a device apparatus on the local network and to provide the obtained presence information to a presence management apparatus on the external network, the first gateway apparatus comprising, an obtaining unit configured to obtain the presence information of the device apparatus, a transmitter configured to transmit the presence information to the presence management apparatus via the external network, and a receiver configured to receive, from the presence management apparatus, a suppression instruction of the presence information transmission, wherein the transmitte further configured to suppress the transmission of the presence information to the presence management apparatus after the reception of the suppression instruction.

摘要翻译： 本发明的一个方面将提供一种被配置为可连接到本地网络和外部网络的第一网关装置，以获得本地网络上的设备装置的存在信息，并将所获得的存在信息提供给存在管理装置 所述外部网络，所述第一网关装置包括被配置为获得所述设备装置的存在信息的获取单元，被配置为经由所述外部网络将所述存在信息发送到所述存在管理装置的发射机，以及被配置为从所述外部网络接收 存在管理装置，存在信息发送的抑制指令，其中，所述发送器还被配置为在接收到所述抑制指令之后抑制所述存在信息到所述存在管理装置的发送。

公开(公告)号：US20110189835A1

公开(公告)日：2011-08-04

申请号：US13017218

申请日：2011-01-31

申请人： Yuki Sugo ,  Shumpei Tanaka ,  Takeshi Matsumura ,  Yasushi Inoue

发明人： Yuki Sugo ,  Shumpei Tanaka ,  Takeshi Matsumura ,  Yasushi Inoue

IPC分类号： H01L21/78 ,  B32B7/12

CPC分类号： B32B7/12 ,  H01L21/6836 ,  H01L21/78 ,  Y10T428/263 ,  Y10T428/2809

摘要： There is provided a new film for manufacturing a semiconductor device that is superior to prevent contamination of a semiconductor chip having an excellent balance of holding power during dicing a semiconductor wafer even where the semiconductor wafer is thin, peeling property when peeling the semiconductor chip that is obtained by dicing together with its adhesive layer, and low contamination property in which there is no attachment of cutting debris to the semiconductor chip. A film for manufacturing a semiconductor device that is used when manufacturing a semiconductor device has a base layer, a first pressure-sensitive adhesive layer that is provided on the base layer, a radiation curing-type second pressure-sensitive adhesive layer that is provided on the first pressure-sensitive adhesive layer and cured by radiation irradiation in advance, and an adhesive layer that is provided on the second pressure-sensitive adhesive layer.

摘要翻译： 提供了一种用于制造半导体器件的新膜，即使在半导体晶片较薄时也能够防止在半导体晶片切割期间具有优异的保持平衡的半导体芯片的污染，并且剥离半导体芯片时的剥离性 通过与其粘合剂层一起切割获得的低污染特性，其中没有将切屑附着到半导体芯片。 制造半导体器件时使用的半导体器件用薄膜，具有基底层，设置在基底层上的第一粘合剂层，设置在基底层上的辐射固化型第二压敏粘合剂层 预先通过辐射照射固化的第一粘合剂层和设置在第二压敏粘合剂层上的粘合剂层。

公开(公告)号：US20110001634A1

公开(公告)日：2011-01-06

申请号：US12922343

申请日：2009-03-12

申请人： Akihisa Yokoyama ,  Takeshi Matsumura ,  Mitsuhisa Shida

发明人： Akihisa Yokoyama ,  Takeshi Matsumura ,  Mitsuhisa Shida

IPC分类号： G08G1/096

CPC分类号： G08G1/096 ,  G08G1/096783 ,  G08G1/096791

摘要： A traveling support device includes: a road-vehicle communication portion that receives first current-signal information relating to a signal displayed by a traffic signal at a first clock time, from a road side transmitter installed on a road; an inter-vehicle communication portion that receives second current-signal information relating to a signal displayed by the traffic signal at a second clock time, from another vehicle that receives the second current-signal information from the road side transmitter; and a signal cycle estimating portion that estimates signal cycle information relating to transition of the signal on the traffic signal on the basis of the first current-signal information received by the road-vehicle communication portion and the second current-signal information received by the inter-vehicle communication portion.

摘要翻译： 行驶辅助装置包括：道路车辆通信部，其从安装在道路上的道路侧变送器接收与第一时钟时间的交通信号所显示的信号有关的第一当前信号信息; 车辆间通信部，从接收来自所述道路侧发送机的所述第二电流信号信息的另一车辆接收与所述交通信号在第二时刻所显示的信号有关的第二电流信号信息; 以及信号周期估计部分，其基于由道路车辆通信部分接收的第一当前信号信息和由相互之间接收的第二当前信号信息来估计与交通信号上的信号的转变相关的信号周期信息 车体通信部。

公开(公告)号：US20100273313A1

公开(公告)日：2010-10-28

申请号：US12820375

申请日：2010-06-22

申请人： Masakatsu Urairi ,  Atsushi Hino ,  Naoyuki Matsuo ,  Tomokazu Takahashi ,  Takeshi Matsumura ,  Syouji Yamamoto

发明人： Masakatsu Urairi ,  Atsushi Hino ,  Naoyuki Matsuo ,  Tomokazu Takahashi ,  Takeshi Matsumura ,  Syouji Yamamoto

IPC分类号： B32B38/04 ,  B32B27/32 ,  H01L21/26

CPC分类号： H05K3/0029 ,  B23K26/18 ,  H05K2203/0214 ,  Y10T156/1052 ,  Y10T428/28 ,  Y10T428/2809

摘要： A manufacturing method of laser processed parts in which at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet for laser processing, using a material having specified physical properties. This method comprises adhering the pressure-sensitive adhesive sheet for laser processing to the laser beam exit side of the work by way of the pressure-sensitive adhesive layer, processing the work by irradiating the work with a laser beam of within 2 times of the irradiation intensity for forming a through-hole in the work, at higher than the irradiation intensity of threshold for inducing ablation of the work, and peeling the pressure-sensitive adhesive sheet for laser processing from the work after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.

摘要翻译： 一种激光加工部件的制造方法，其中，使用具有规定的物理特性的材料，在基材上至少设置有作为激光加工用的粘合片的压敏粘合剂层。 该方法包括通过压敏粘合剂层将激光加工用粘合片粘合到工件的激光射出侧，通过用照射2倍以下的激光束照射工件进行加工 在作业中形成通孔的强度高于用于引起作业烧蚀的阈值的照射强度，以及在加工后的工作中剥离用于激光加工的压敏粘合片。 因此，可以有效地抑制由于分解物的工作表面的污染，能够容易且高生产率地制造激光加工部件。

公开(公告)号：US20100093154A1

公开(公告)日：2010-04-15

申请号：US12529070

申请日：2008-01-28

申请人： Yasuhiro Amano ,  Sadahito Misumi ,  Takeshi Matsumura

发明人： Yasuhiro Amano ,  Sadahito Misumi ,  Takeshi Matsumura

IPC分类号： H01L21/301 ,  B32B7/10 ,  H01L21/52 ,  H01L21/683

CPC分类号： H01L23/3121 ,  C08G18/4045 ,  C08G18/6254 ,  C08L33/08 ,  C09J175/04 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29371 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T428/24355 ,  H01L2924/00014 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/0532 ,  H01L2924/04642 ,  H01L2924/05042 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A dicing die-bonding film in which the adhesive properties during the dicing step and the peeling properties during the pickup step are controlled so that both become good, and a production method thereof, are provided. The dicing die-bonding film in the present invention is a dicing die-bonding film having a pressure-sensitive adhesive layer on a base material and a die bond layer on the pressure-sensitive adhesive layer, in which the arithmetic mean roughness X (μm) on the pressure-sensitive adhesive layer side in the die bond layer is 0.015 μm to 1 μm, the arithmetic mean roughness Y (μm) on the die bond layer side in the pressure-sensitive adhesive layer is 0.03 μm to 1 μm, and the absolute value of the difference of the X and Y is 0.015 or more.

摘要翻译： 控制在切割步骤期间的粘合性能和拾取步骤期间的剥离性能使其都变得良好的切割芯片接合薄膜及其制备方法。 本发明的切割/芯片接合薄膜是在基材上具有压敏粘合剂层和压敏粘合剂层上的芯片接合层的切割芯片接合薄膜，其中算术平均粗糙度X（μm ）为0.015μm〜1μm，压敏粘合剂层的芯片接合层侧的算术平均粗糙度Y（μm）为0.03μm〜1μm， X和Y的差的绝对值为0.015以上。

公开(公告)号：US20100055842A1

公开(公告)日：2010-03-04

申请号：US12549739

申请日：2009-08-28

申请人： Yuki Sugo ,  Sedahito Misumi ,  Takeshi Matsumura

发明人： Yuki Sugo ,  Sedahito Misumi ,  Takeshi Matsumura

IPC分类号： H01L21/60 ,  C08L63/00 ,  B32B27/38

CPC分类号： H01L21/6836 ,  C08G59/621 ,  C08L33/06 ,  C08L2666/04 ,  C09J163/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29084 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/3025 ,  Y10T428/31511 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The thermosetting die-bonding film of the present invention is used in manufacturing a semiconductor device, has at least an epoxy resin, a phenol resin, and an acrylic copolymer, and the ratio X/Y is 0.7 to 5 when X represents a total weight of the epoxy resin and the phenol resin and Y represents a weight of the acrylic copolymer.

摘要翻译： 本发明的热固性芯片接合薄膜用于制造半导体器件，至少具有环氧树脂，酚醛树脂和丙烯酸共聚物，当X表示总重量时，X / Y的比率为0.7〜5 的环氧树脂和酚醛树脂，Y表示丙烯酸共聚物的重量。

公开(公告)号：US20100004839A1

公开(公告)日：2010-01-07

申请号：US12443616

申请日：2008-10-02

申请人： Akihisa Yokoyama ,  Takeshi Matsumura

发明人： Akihisa Yokoyama ,  Takeshi Matsumura

IPC分类号： G08G1/00

CPC分类号： G08G1/096783 ,  B60W30/16 ,  G08G1/052 ,  G08G1/096758 ,  G08G1/166

摘要： The present invention aims at providing a driving assisting apparatus and driving assisting method which can predict with a high accuracy a state of a traffic light when a vehicle enters an intersection. The driving assisting apparatus for predicting the state of the traffic light when the vehicle enters the intersection comprises vehicle speed change predicting means for predicting a vehicle speed change of the vehicle in front of the intersection, and traffic light state predicting means for predicting the state of the traffic light when the vehicle enters the intersection according to the vehicle speed change predicted by the vehicle speed change predicting means, while the vehicle speed change predicting means predicts the vehicle speed change according to information stored in storage means in association with a characteristic of a driver concerning the past vehicle speed change in front of the intersection with running environments or changes a predicting method depending on whether or not the vehicle is positioned in front of a predetermined area set in front of the intersection.

摘要翻译： 本发明旨在提供一种驾驶辅助装置和驾驶辅助方法，其可以在车辆进入交叉口时以高精度预测交通信号灯的状态。 用于在车辆进入交叉点时预测交通信号灯的状态的驾驶辅助装置包括车辆速度变化预测装置，用于预测交叉路口前方的车辆的车速变化;以及交通灯状态预测装置， 当车辆速度变化预测装置根据由车速变化预测装置预测的车速改变车辆进入交叉路口时的交通灯，而车速变化预测装置根据存储装置中存储的信息来预测车速变化， 驾驶员关于在与行驶环境的交叉点前方的过去的车辆速度变化，或者根据车辆是否位于设置在交叉路口前面的预定区域的前方来改变预测方法。