MIMCAP architecture
    22.
    发明授权

    公开(公告)号:US11476186B2

    公开(公告)日:2022-10-18

    申请号:US17081720

    申请日:2020-10-27

    Abstract: A cell on an IC includes a first set of Mx layer interconnects coupled to a first voltage, a second set of Mx layer interconnects coupled to a second voltage different than the first voltage, and a MIM capacitor structure below the Mx layer. The MIM capacitor structure includes a CTM, a CBM, and an insulator between portions of the CTM and the CBM. The first set of Mx layer interconnects is coupled to the CTM. The second set of Mx layer interconnects is coupled to the CBM. The MIM capacitor structure is between the Mx layer and an Mx-1 layer. The MIM capacitor structure includes a plurality of openings. The MIM capacitor structure is continuous within the cell and extends to at least two edges of the cell. In one configuration, the MIM capacitor structure extends to each edge of the cell.

    DYNAMICALLY CONTROLLING VOLTAGE FOR ACCESS OPERATIONS TO MAGNETO-RESISTIVE RANDOM ACCESS MEMORY (MRAM) BIT CELLS TO ACCOUNT FOR AMBIENT TEMPERATURE

    公开(公告)号:US20190051341A1

    公开(公告)日:2019-02-14

    申请号:US15676957

    申请日:2017-08-14

    Abstract: Dynamically controlling voltage for access operations to magneto-resistive random access memory (MRAM) bit cells to account for ambient temperature is disclosed. An MRAM bit cell process variation measurement circuit (PVMC) is configured to measure process variations and ambient temperature in magnetic tunnel junctions (MTJs) that affect MTJ resistance, which can change the write current at a given fixed supply voltage applied to an MRAM bit cell. These measured process variations and ambient temperature are used to dynamically control a supply voltage for access operations to the MRAM to reduce the likelihood of bit errors and reduce power consumption. The MRAM bit cell PVMC may also be configured to measure process variations and/or ambient temperatures in logic circuits that represent the process variations and ambient temperatures in access transistors employed in MRAM bit cells in the MRAM to determine variations in the switching speed (i.e., drive strength) of the access transistors.

    Magnetoresistive (MR) sensors employing dual MR devices for differential MR sensing

    公开(公告)号:US10060880B2

    公开(公告)日:2018-08-28

    申请号:US15266342

    申请日:2016-09-15

    CPC classification number: G01N27/745 B82Y25/00 G01R33/09 G01R33/093 G01R33/098

    Abstract: Magnetoresistive (MR) sensors employing dual MR devices for differential MR sensing are provided. These MR sensors may be used as biosensors to detect the presence of biological materials as an example. An MR sensor includes dual MR sensor devices that may be tunnel magnetoresistive (TMR) devices or giant magnetoresistive (GMR) devices as examples. The MR devices are arranged such that a channel is formed between the MR devices for receiving magnetic nanoparticles. A magnetic stray field generated by the magnetic nanoparticles causes free layers in the MR devices to rotate in opposite directions, thus causing differential resistances between the MR devices for greater sensing sensitivity. Further, as another aspect, by providing the channel between the MR devices, the magnetic stray field generated by the magnetic nanoparticles can more easily rotate the magnetic moment orientation of the free layers in the MR devices, thus further increasing sensitivity.

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