公开(公告)号：US20190287785A1

公开(公告)日：2019-09-19

申请号：US16283379

申请日：2019-02-22

Applicant: KLA-Tencor Corporation

Inventor： Ilya Bezel ,  Anatoly Shchemelinin ,  Eugene Shifrin ,  Matthew Derstine

IPC: H01J61/02 ,  G02B27/14 ,  G01N23/04 ,  H01J65/04 ,  G01N21/55

Abstract: A system for pumping laser sustained plasma and enhancing one or more selected wavelengths of output illumination generated by the laser sustained plasma is disclosed. In embodiments, the system includes one or more pump modules configured to generate pump illumination for the laser sustained plasma and one or more enhancing illumination sources configured to generate enhancing illumination at one or more selected wavelengths. The pump illumination may be directed along one or more pump illumination paths that are non-collinear to an output illumination path of the output illumination. The enhancing illumination may be directed along an illumination path that is collinear to the output illumination path of the output illumination so that the enhancing illumination is combined with the output illumination, thereby enhancing the output illumination at the one or more selected wavelengths.

公开(公告)号：US10163620B2

公开(公告)日：2018-12-25

申请号：US15064294

申请日：2016-03-08

Applicant: KLA-Tencor Corporation

Inventor： Ilya Bezel ,  Anatoly Shchemelinin ,  Eugene Shifrin ,  Matthew Panzer

IPC: H01J65/04 ,  H05G2/00

Abstract: An optical system for generating broadband light via light-sustained plasma formation includes a chamber, an illumination source, a set of focusing optics, and a set of collection optics. The chamber is configured to contain a buffer material in a first phase and a plasma-forming material in a second phase. The illumination source generates continuous-wave pump illumination. The set of focusing optics focuses the continuous-wave pump illumination through the buffer material to an interface between the buffer material and the plasma-forming material in order to generate a plasma by excitation of at least the plasma-forming material. The set of collection optics receives broadband radiation emanated from the plasma.

公开(公告)号：US20170315369A1

公开(公告)日：2017-11-02

申请号：US15651968

申请日：2017-07-17

Applicant: KLA-Tencor Corporation

Inventor： Anatoly Shchemelinin ,  Ilya Bezel ,  Matthew Panzer ,  Eugene Shifrin

IPC: G02B27/10

CPC classification number: G02B27/1006

Abstract: A system for separating plasma pumping light and collected broadband light includes a pump source configured to generate pumping illumination including at least a first wavelength, a gas containment element for containing a volume of gas, a collector configured to focus the pumping illumination from the pumping source into the volume of gas to generate a plasma within the volume of gas, wherein the plasma emits broadband radiation including at least a second wavelength and an illumination separation prism element positioned between a reflective surface of the collector and the pump source and arranged to spatially separate the pumping illumination including the first wavelength and the emitted broadband radiation including at least a second wavelength emitted from the plasma.

公开(公告)号：US09766187B2

公开(公告)日：2017-09-19

申请号：US14838091

申请日：2015-08-27

Applicant: KLA-Tencor Corporation

Inventor： Hong Chen ,  Kenong Wu ,  Eugene Shifrin ,  Masatoshi Yamaoka ,  Gangadharan Sivaraman ,  Raghav Babulnath ,  Satya Kurada ,  Shuo Sun

IPC: G01N21/95 ,  G01N21/956 ,  G01N21/00

CPC classification number: G01N21/9501 ,  G01N21/00 ,  G01N21/95 ,  G01N21/95607

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).

公开(公告)号：US09766186B2

公开(公告)日：2017-09-19

申请号：US14674856

申请日：2015-03-31

Applicant: KLA-Tencor Corporation

Inventor： Hong Chen ,  Kenong Wu ,  Eugene Shifrin ,  Masatoshi Yamaoka

IPC: G01N21/95 ,  G01N21/00 ,  G01N21/94

CPC classification number: G01N21/9501 ,  G01N21/00 ,  G01N21/94 ,  G01N21/95 ,  G01N2201/061 ,  G01N2201/10

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).

公开(公告)号：US20160061745A1

公开(公告)日：2016-03-03

申请号：US14838091

申请日：2015-08-27

Applicant: KLA-Tencor Corporation

Inventor： Hong Chen ,  Kenong Wu ,  Eugene Shifrin ,  Masatoshi Yamaoka ,  Gangadharan Sivaraman ,  Raghav Babulnath ,  Satya Kurada ,  Shuo Sun

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/00 ,  G01N21/95 ,  G01N21/95607

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system.The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).

Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括从通过用检查系统扫描晶片产生的帧图像为晶片上的晶片中的晶片的阵列区域的至少一部分生成测试图像。 该方法还包括从通过晶片扫描生成的帧图像生成阵列区域中的单元的参考图像。 此外，该方法包括通过从测试图像的一部分中减去参考图像来确定模具中的阵列区域的至少一部分中的至少一个单元的差分图像， 对应于至少一个小区。 该方法还包括基于差分图像来检测至少一个单元中的晶片上的缺陷。

公开(公告)号：US09171364B2

公开(公告)日：2015-10-27

申请号：US14168011

申请日：2014-01-30

Applicant: KLA-Tencor Corporation

Inventor： Kenong Wu ,  Tao Luo ,  Lisheng Gao ,  Eugene Shifrin ,  Aravindh Balaji

IPC: G06K9/00 ,  G06T7/00

CPC classification number: G06T7/0004 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes determining characteristics of care areas for a wafer based on wafer patterns. Determining the characteristics includes determining locations of care areas, identifying at least one pattern of interest (POI) in the wafer patterns for each of the care areas, allowing any of the care areas to have a free-form shape, allowing the care areas to be larger than frame images and selecting two or more POIs for at least one of the care areas. The method also includes searching for POIs in images generated for the wafer using an inspection system. In addition, the method includes detecting defects on the wafer by determining positions of the care areas in the images and applying one or more defect detection methods to the images based on the positions of the care areas in the images.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括基于晶片图案确定晶片护理区域的特征。 确定特征包括确定护理区域的位置，为每个护理区域确定晶片图案中的至少一个感兴趣模式（POI），允许任何护理区域具有自由形状，允许护理区域 大于框架图像并且为至少一个护理区域选择两个或更多个POI。 该方法还包括使用检查系统搜索为晶片生成的图像中的POI。 此外，该方法包括通过确定图像中的护理区域的位置并基于图像中的护理区域的位置将一个或多个缺陷检测方法应用于图像来检测晶片上的缺陷。

公开(公告)号：US20150012900A1

公开(公告)日：2015-01-08

申请号：US14321565

申请日：2014-07-01

Applicant: KLA-Tencor Corporation

Inventor： Eugene Shifrin ,  Ashok Kulkarni ,  Kris Bhaskar ,  Graham Michael Lynch ,  John Raymond Jordan, III ,  Chwen-Jiann Fang

IPC: H01L27/02 ,  G06F17/50 ,  G01N21/95

CPC classification number: G06F17/5081 ,  G01N21/9501 ,  G06F17/5045 ,  H01L22/12

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes determining locations of all instances of a weak geometry in a design for a wafer. The locations include random, aperiodic locations. The weak geometry includes one or more features that are more prone to defects than other features in the design. The method also includes scanning the wafer with a wafer inspection system to thereby generate output for the wafer with one or more detectors of the wafer inspection system. In addition, the method includes detecting detects in at least one instance of the weak geometry based on the output generated at two or more instances of the weak geometry in a single die on the wafer.

Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括在晶片的设计中确定弱几何的所有实例的位置。 这些位置包括随机，不定期的位置。 弱几何包括与设计中的其他特征相比更容易出现缺陷的一个或多个特征。 该方法还包括用晶片检查系统扫描晶片，从而通过晶片检查系统的一个或多个检测器产生用于晶片的输出。 此外，该方法包括基于在晶片上的单个管芯中的弱几何形状的两个或多个实例处产生的输出来检测至少一个弱几何形状的检测。

公开(公告)号：US11204332B2

公开(公告)日：2021-12-21

申请号：US16845681

申请日：2020-04-10

Applicant: KLA-Tencor Corporation

Inventor： Eugene Shifrin ,  Bjorn Brauer ,  Sumit Sen ,  Ashok Mathew ,  Sreeram Chandrasekaran ,  Lisheng Gao

IPC: G06K9/00 ,  G01N21/95 ,  G01N21/956 ,  H01L21/66 ,  G06T7/00

Abstract: Defects from a hot scan can be saved, such as on persistent storage, random access memory, or a split database. The persistent storage can be patch-based virtual inspector virtual analyzer (VIVA) or local storage. Repeater defect detection jobs can determined and the wafer can be inspected based on the repeater defect detection jobs. Repeater defects can be analyzed and corresponding defect records to the repeater defects can be read from the persistent storage. These results may be returned to the high level defect detection controller.

公开(公告)号：US10976025B2

公开(公告)日：2021-04-13

申请号：US15895868

申请日：2018-02-13

Applicant: KLA-Tencor Corporation

Inventor： Ilya Bezel ,  Anatoly Shchemelinin ,  Eugene Shifrin ,  Matthew Panzer ,  Matthew Derstine ,  Jincheng Wang ,  Anant Chimmalgi ,  Rajeev Patil ,  Rudolf Brunner

IPC: H01J61/52 ,  H01J61/40 ,  F21V9/06 ,  H01J61/12 ,  H01J61/14 ,  H01J61/16 ,  H01J61/20 ,  H01J61/34 ,  H01J61/35 ,  H01J65/04

Abstract: A plasma cell for use in a laser-sustained plasma light source includes a plasma bulb configured to contain a gas suitable for generating a plasma. The plasma bulb is transparent to light from a pump laser, wherein the plasma bulb is transparent to at least a portion of a collectable spectral region of illumination emitted by the plasma. The plasma bulb of the plasma cell is configured to filter short wavelength radiation, such as VUV radiation, emitted by the plasma sustained within the bulb in order to keep the short wavelength radiation from impinging on the interior surface of the bulb.