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公开(公告)号:US09996942B2
公开(公告)日:2018-06-12
申请号:US15073617
申请日:2016-03-17
Applicant: KLA-Tencor Corporation
Inventor: Santosh Bhattacharyya , Pavan Kumar , Lisheng Gao , Thirupurasundari Jayaraman , Raghav Babulnath , Srikanth Kandukuri , Gangadharan Sivaraman , Karthikeyan Subramanian , Raghavan Konuru , Rahul Lakhawat
CPC classification number: G06T7/33 , G06T2207/10061 , G06T2207/30148
Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. In general, some embodiments described herein are configured for substantially accurately aligning inspection subsystem output generated for a specimen to a design for the specimen despite deformation of the design in the inspection subsystem output. In addition, some embodiments are configured for generating and/or using alignment targets that can be shared across multiple specimens of the same layer and design rule for alignment of inspection subsystem output generated for a specimen to a design for the specimen.
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公开(公告)号:US20160275672A1
公开(公告)日:2016-09-22
申请号:US15073617
申请日:2016-03-17
Applicant: KLA-Tencor Corporation
Inventor: Santosh Bhattacharyya , Pavan Kumar , Lisheng Gao , Thirupurasundari Jayaraman , Raghav Babulnath , Srikanth Kandukuri , Gangadharan Sivaraman , Karthikeyan Subramanian , Raghavan Konuru , Rahul Lakhawat
IPC: G06T7/00
CPC classification number: G06T7/33 , G06T2207/10061 , G06T2207/30148
Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. In general, some embodiments described herein are configured for substantially accurately aligning inspection subsystem output generated for a specimen to a design for the specimen despite deformation of the design in the inspection subsystem output. In addition, some embodiments are configured for generating and/or using alignment targets that can be shared across multiple specimens of the same layer and design rule for alignment of inspection subsystem output generated for a specimen to a design for the specimen.
Abstract translation: 提供了用于确定由检查子系统在设计数据空间中产生的输出位置的方法和系统。 通常,这里描述的一些实施例被配置成用于将检测子系统产生的样品基本上精确地对准于试样的设计,尽管检查子系统输出中的设计变形。 此外,一些实施例被配置用于生成和/或使用可以在同一层的多个样本上共享的对准目标和用于将为样本生成的检查子系统输出对准样本的设计规则的设计规则。
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公开(公告)号:US09766187B2
公开(公告)日:2017-09-19
申请号:US14838091
申请日:2015-08-27
Applicant: KLA-Tencor Corporation
Inventor: Hong Chen , Kenong Wu , Eugene Shifrin , Masatoshi Yamaoka , Gangadharan Sivaraman , Raghav Babulnath , Satya Kurada , Shuo Sun
IPC: G01N21/95 , G01N21/956 , G01N21/00
CPC classification number: G01N21/9501 , G01N21/00 , G01N21/95 , G01N21/95607
Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).
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公开(公告)号:US20160061745A1
公开(公告)日:2016-03-03
申请号:US14838091
申请日:2015-08-27
Applicant: KLA-Tencor Corporation
Inventor: Hong Chen , Kenong Wu , Eugene Shifrin , Masatoshi Yamaoka , Gangadharan Sivaraman , Raghav Babulnath , Satya Kurada , Shuo Sun
CPC classification number: G01N21/9501 , G01N21/00 , G01N21/95 , G01N21/95607
Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system.The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).
Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括从通过用检查系统扫描晶片产生的帧图像为晶片上的晶片中的晶片的阵列区域的至少一部分生成测试图像。 该方法还包括从通过晶片扫描生成的帧图像生成阵列区域中的单元的参考图像。 此外,该方法包括通过从测试图像的一部分中减去参考图像来确定模具中的阵列区域的至少一部分中的至少一个单元的差分图像, 对应于至少一个小区。 该方法还包括基于差分图像来检测至少一个单元中的晶片上的缺陷。
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