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    METHOD FOR MANUFACTURING WAVEGUIDE STRUCTURES ON WAFER-LEVEL AND CORRESPONDING WAVEGUIDE STRUCTURES
    23.
    发明申请
    METHOD FOR MANUFACTURING WAVEGUIDE STRUCTURES ON WAFER-LEVEL AND CORRESPONDING WAVEGUIDE STRUCTURES 有权
    水平波及波导结构波导结构的制造方法

    公开(公告)号：US20160223746A1

    公开(公告)日：2016-08-04

    申请号：US15014244

    申请日：2016-02-03

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Simon Gubser ,  Frank Sobel ,  Alexander Bietsch ,  Jens Geiger

    IPC: G02B6/122 ,  G02B6/34 ,  G02B6/32

    CPC classification number: G02B6/0065 ,  B29D11/00663

    Abstract: The waveguide structure can be manufactured on wafer-scale and comprises a holding structure and a first and a second waveguides each having a core and two end faces. The holding structure comprises a separation structure being arranged between the first and the second waveguide and provides an optical separation between the first and the second waveguide in a region between the end faces of the first and second waveguides. A method for manufacturing such a waveguide structure with at least one waveguide comprises shaping replication material by means of tool structures to obtain the end faces, hardening the replication material and removing the tool structures from a waveguide structures wafer comprising a plurality of so-obtained waveguides.

    Abstract translation: 波导结构可以在晶片级制造，并且包括保持结构和每个具有芯和两个端面的第一和第二波导。 保持结构包括布置在第一和第二波导之间的分离结构，并且在第一和第二波导的端面之间的区域中提供第一和第二波导之间的光学隔离。 用于制造具有至少一个波导的这种波导结构的方法包括通过工具结构对复制材料进行成形以获得端面，硬化复制材料并从包括多个如此获得的波导的波导结构晶片中去除工具结构 。

    Opto-Electronic Module
    24.
    发明申请
    Opto-Electronic Module 有权
    光电模块

    公开(公告)号：US20140291703A1

    公开(公告)日：2014-10-02

    申请号：US14303968

    申请日：2014-06-13

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Alexander Bietsch ,  Susanne Westenhöfer ,  Simon Gubser

    IPC: H01L31/167 ,  H01L31/0232

    CPC classification number: H01L31/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/173

    Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.

    Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，所述发光器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如碳黑等含有颜料的不透明聚合物材料构成。

    SPACER ELEMENT AND METHOD FOR MANUFACTURING A SPACER ELEMENT
    25.
    发明申请
    SPACER ELEMENT AND METHOD FOR MANUFACTURING A SPACER ELEMENT 审中-公开
    间隔元件和制造间隔元件的方法

    公开(公告)号：US20130280492A1

    公开(公告)日：2013-10-24

    申请号：US13923861

    申请日：2013-06-21

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Markus Rossi ,  Hartmut Rudmann ,  Nicola Spring ,  Alexander Bietsch

    IPC: B32B41/00 ,  B32B37/02

    CPC classification number: B32B41/00 ,  B32B37/02 ,  G02B2006/12166 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L2924/0002 ,  H04N5/2257 ,  Y10T156/10 ,  Y10T428/15 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/2457 ,  H01L2924/00

    Abstract: A spacer wafer for a wafer stack includes a spacer body with a first surface and a second surface, and is intended to be sandwiched between a first wafer and a second wafer. That is, the spacer is to keep a first wafer placed against the first surface and a second wafer placed against the second surface at a constant distance from each other. The spacer provides openings arranged such that functional elements of the first wafer and of the second wafer can be aligned with the openings. The spacer is formed from a forming tool by means of a shape replication process and is preferably made of a material hardened by curing. At least one of the first and second surface includes edges separating the surface from the openings, and the thickness of the spacer wafer at the edges exceeds the thickness of the spacer wafer at surface locations around the edges.

    Abstract translation: 用于晶片堆叠的间隔晶片包括具有第一表面和第二表面的间隔体，并且旨在夹在第一晶片和第二晶片之间。 也就是说，间隔件是保持第一晶片放置在第一表面上，并且第二晶片以彼此保持恒定的距离放置在第二表面上。 间隔件提供开口布置成使得第一晶片和第二晶片的功能元件可与开口对准。 间隔件通过形状复制工艺由成形工具形成，并且优选由通过固化硬化的材料制成。 第一和第二表面中的至少一个包括将表面与开口分开的边缘，并且边缘处的间隔晶片的厚度在边缘周围的表面位置超过间隔晶片的厚度。

    Reflowable opto-electronic module
    29.
    发明授权
    Reflowable opto-electronic module 有权
    可回流光电模块

    公开(公告)号：US09063005B2

    公开(公告)日：2015-06-23

    申请号：US13804303

    申请日：2013-03-14

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Alexander Bietsch

    IPC: H01J3/14 ,  G01J1/04 ,  B32B38/00 ,  G01V8/12 ,  H01L25/16 ,  H01L31/12 ,  G01J1/02

    CPC classification number: H04M1/72527 ,  B32B38/0004 ,  G01J1/0271 ,  G01J1/0407 ,  G01S7/4813 ,  G01S17/026 ,  G01V8/12 ,  H01L25/167 ,  H01L25/50 ,  H01L27/14643 ,  H01L27/14649 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/12 ,  H01L2924/0002 ,  H03K17/941 ,  H03K2017/9455 ,  H03K2217/94108 ,  Y10T156/1052 ,  H01L2924/00

    Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member, wherein the separation member is disposed between the substrate and the optics member. Multiple modules can be fabricated in a wafer-level process and can be composed of reflowable materials so that the modules can be incorporated more easily into devices whose manufacture occurs, at least in part, at elevated temperatures when the module is integrated into the device or during subsequent manufacturing processes.

    Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，所述发光器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件和分离部件，其中分离部件设置在基板和光学部件之间。 可以在晶片级工艺中制造多个模块，并且可以由可回流材料组成，使得模块可以更容易地结合到其制造发生的装置中，至少部分地在升高的温度下将模块集成到装置中或者 在后续制造过程中。

    Optical Devices and Opto-electronic Modules and Methods for Manufacturing The Same
    30.
    发明申请
    Optical Devices and Opto-electronic Modules and Methods for Manufacturing The Same 有权
    光器件和光电模块及其制造方法

    公开(公告)号：US20140339664A1

    公开(公告)日：2014-11-20

    申请号：US14366770

    申请日：2012-12-18

    Applicant: Heptagon Micro Optics Pte. Ltd. ,  Heptagon Oy

    Inventor： Markus Rossi ,  Hartmut Rudmann ,  Stephan Heimgartner ,  Alexander Bietsch ,  Robert Lenart

    IPC: H01L27/146

    CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L27/14818 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The optical device comprises a first substrate (SI) comprising at least one optical structure (1) comprising a main portion (2) and a surrounding portion (3) at least partially surrounding said main portion. The device furthermore comprises non-transparent material (5, 5a, 5b) applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.

    Abstract translation: 光学装置包括包括至少一个光学结构（1）的第一基板（S1），该至少一个光学结构（1）包括主要部分（2）和至少部分地围绕所述主要部分的环绕部分（3）。 该装置还包括施加到所述周围部分上的不透明材料（5,5a，5b）。 所述光电模块包括包含在所述第一衬底中的多个这些光学器件。 制造光学器件的方法包括以下步骤：a）提供包括至少一个光学结构的第一衬底，该至少一个光学结构包括至少部分地围绕所述主要部分的主要部分和环绕部分; 以及b）将不透明材料施加到至少所述周围部分上。 所述不透明材料存在于仍在最终光学装置中的至少所述周围部分上。

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