Abstract:
A portable computing device includes at least a base portion of a lightweight material that includes at least a wedge shaped top case having a trough formed at an interfacing edge thereof. The trough includes a raised portion having a first contact surface and a receiving area, and a bottom case coupled to the top case to form a complete housing for at least a portion of the portable computing device for enclosing at least a plurality of operational components and a plurality of structural components. The portable computing device also includes at least a lid portion pivotally connected to the base portion by a hinge assembly. In the described embodiments, the lid portion has a display in communication with one or more of the plurality of components in the base portion by way of or more electrical conductors that electrically connect the base portion to the lid portion.
Abstract:
An electronic device may be provided having an organic light-emitting diode display and control circuitry for operating the display. The display may include one or more display layers interposed between the control circuitry and a display layer having thin-film transistors. The electronic device may include a coupling structure interposed between the layer of thin-film transistors and the control circuitry that electrically couples the layer of thin-film transistors to the control circuitry. The coupling structure may include a dielectric member having a conductive via, a flexible printed circuit having a bent portion, or a conductive via formed in an encapsulation layer of the display. The display may include a layer of opaque masking material. The layer of opaque masking material may be formed on an encapsulation layer, an organic emissive layer, a thin-film transistor layer, or a glass layer of the organic light-emitting diode display.
Abstract:
A hinge assembly having a hollow and partially annular clutch is arranged to pivotally couple a portable computer base portion to a portable computer lid portion. The hinge assembly includes at least an elongated, hollow and partially open cylindrical portion that includes a partially annular outer region and a central bore region, the central bore region suitably arranged to provide support for electrical conductors between the base and lid portions. The hinge assembly also includes a plurality of fastening components that couple the hollow clutch to the base portion and the lid portion of the portable computer, with at least one of the fastening regions being integrally formed with the hollow and partially open cylindrical portion such that space, size and part count are minimized.
Abstract:
The described embodiments relate generally to optimizing airflow in a computer system. By modifying the external surface of centrifugal cooling fan enclosures the pressure drop associated with airflow moving around the enclosures can be reduced. This is generally accomplished by rounding off hard edges from the outside of the cooling fan enclosure as well as forming cover surfaces rather than simply using flat cover surfaces. In some cases this can also involve modifying the shape of the fan inlet, or even contouring the shape of the cooling fan blades to allow air to flow more easily through the computer enclosure.
Abstract:
The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a backlight assembly to a cover glass layer while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to the backlight assembly. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In another embodiment, a series of rigid plates can be bonded to the cover glass layer and attached to the backlight assembly. Point loads applied from the backlight assembly can be distributed over a larger area due to the resilience of the rigid plates.
Abstract:
A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
Abstract:
A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
Abstract:
Magnetic elements and attractors may be employed to secure a top case and a bottom case of a housing of a personal computing device. The magnetic elements may include a magnet that produces a magnetic field and a shunt. The shunt may direct the magnetic field through an opening to a pocket in which the magnet is received. Accordingly, flux leakage may be reduced and the bottom case may be secured to the top case. Magnetic elements and attractors may also be employed to secure a lid portion of the portable computing device to the housing thereof. These magnetic elements and attractors may be centered with respect to proximal and distal edges thereof.
Abstract:
An electronic device housing may have upper and lower portions that are attached with a hinge. At least one portion of the housing may have a rear planar surface and peripheral sidewalls having edges. A display module may be mounted in the housing. The display module may have glass layers such as a color filter glass layer and a thin-film transistor substrate. The color filter glass layer may serve as the outermost glass layer in the display module. The edges of the display module may be aligned with the edges of the peripheral housing sidewalls to create the appearance of a borderless display for the electronic device. The display module may be provided with an opening that allows a camera or other electronic components to receive light. Traces may be provided on the underside of the thin-film transistor substrate to serve as signal paths for the electrical components.
Abstract:
A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.