公开(公告)号：US10991656B2

公开(公告)日：2021-04-27

申请号：US16446368

申请日：2019-06-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh ,  Jen-Chieh Kao

IPC: H01L23/48 ,  H01L23/538 ,  H01L25/16 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor device package includes a first substrate, a second substrate disposed over the first substrate, and a surface mount device (SMD) component disposed between the first substrate and the second substrate. The SMD component includes a plurality of connection electrodes electrically connecting the first substrate to the second substrate, and the plurality of connection electrodes are electrically disconnected from each other.

公开(公告)号：US11948852B2

公开(公告)日：2024-04-02

申请号：US17239483

申请日：2021-04-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh

IPC: H01L23/367 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538

CPC classification number: H01L23/367 ,  H01L21/4846 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/16237

Abstract: The present disclosure provides a semiconductor device package including a first substrate, a second substrate disposed over the first substrate, an electronic component disposed between the first substrate and the second substrate, a spacer disposed between the first substrate and the electronic component, and a supporting element disposed on the first substrate and configured to support the second substrate. The spacer is configured to control a distance between the first substrate and the second substrate through the electronic component. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US11710689B2

公开(公告)日：2023-07-25

申请号：US17115629

申请日：2020-12-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh ,  Yu-Chang Chen

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49866 ,  H01L25/16

Abstract: A semiconductor device package includes a substrate, a first solder paste, an electrical contact and a first encapsulant. The substrate includes a conductive pad. The first solder paste is disposed on the pad. The electrical contact is disposed on the first solder paste. The first encapsulant encapsulates a portion of the electrical contact and exposes the surface of the electrical contact. The electrical contact has a surface facing away from the substrate. A melting point of the electrical contact is greater than that of the first solder paste. The first encapsulant includes a first surface facing toward the substrate and a second surface opposite to the first surface. The second surface of the first encapsulant is exposed to air.

公开(公告)号：US11575995B2

公开(公告)日：2023-02-07

申请号：US17244885

申请日：2021-04-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh

IPC: H04R19/00 ,  H04R19/02 ,  B81B7/00 ,  B81C1/00 ,  H04R1/02 ,  H04R31/00 ,  H04R7/04

Abstract: A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, and an encapsulation layer. The substrate has a first surface, a second surface opposite to the first surface, and a first opening extending from the first surface to the second surface. The first electronic component is disposed on the first surface of the substrate. The encapsulation layer is formed on the second surface of the substrate. The encapsulation layer includes a chamber connected to the first opening, and a width of the first opening is smaller than a width of the chamber.

公开(公告)号：US11410899B2

公开(公告)日：2022-08-09

申请号：US16751139

申请日：2020-01-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Chen ,  Chang-Lin Yeh ,  Jen-Chieh Kao

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/00 ,  H01Q19/10 ,  H01Q13/10 ,  H01L23/10 ,  H01Q21/06

Abstract: A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.

公开(公告)号：US11222792B2

公开(公告)日：2022-01-11

申请号：US16838682

申请日：2020-04-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L25/00

Abstract: In one or more embodiments, a semiconductor package device includes a substrate, a trace, a structure, a barrier element and an underfill. The substrate has a first surface including a filling region surrounded by the trace. The structure is disposed over the filling region and electrically connected to the substrate. The barrier element is disposed on the trace. The underfill is disposed on the filling region.

公开(公告)号：US11201200B2

公开(公告)日：2021-12-14

申请号：US16550110

申请日：2019-08-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Sheng-Yu Chen ,  Chang-Lin Yeh ,  Yung-I Yeh

IPC: H01L27/32 ,  H01L25/16 ,  H01L29/786 ,  H01L51/52 ,  H01L27/11 ,  H01L27/15

Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.

公开(公告)号：US10861779B2

公开(公告)日：2020-12-08

申请号：US16268385

申请日：2019-02-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh ,  Yu-Chang Chen

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L25/16

Abstract: A semiconductor device package includes a substrate, a first solder paste, an electrical contact and a first encapsulant. The substrate includes a conductive pad. The first solder paste is disposed on the pad. The electrical contact is disposed on the first solder paste. The first encapsulant encapsulates a portion of the electrical contact and exposes the surface of the electrical contact. The electrical contact has a surface facing away from the substrate. A melting point of the electrical contact is greater than that of the first solder paste. The first encapsulant includes a first surface facing toward the substrate and a second surface opposite to the first surface. The second surface of the first encapsulant is exposed to air.

公开(公告)号：US10483254B2

公开(公告)日：2019-11-19

申请号：US15408158

申请日：2017-01-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh

IPC: H01L25/10 ,  H01L23/04 ,  H01L21/56 ,  H01L25/00 ,  H01L23/31 ,  H01L25/11 ,  H01L25/16

Abstract: An electronic module includes a first sub-module and a second sub-module. The first sub-module includes a first substrate, a first electronic component disposed on the first substrate and a first electrode. The second sub-module includes a second substrate, a second electronic component disposed on the second substrate and a second electrode spaced from the first electrode. The second electrode faces the first electrode to form a capacitor for transmitting an alternating current (AC) signal between the first sub-module and the second sub-module.

公开(公告)号：US10438889B2

公开(公告)日：2019-10-08

申请号：US15390225

申请日：2016-12-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh

IPC: H01L23/522 ,  H01L23/532 ,  H01L23/528 ,  H01L23/52 ,  G06K19/077 ,  H01L23/66 ,  H01L25/065 ,  H01L23/498 ,  H01L23/538

Abstract: The disclosure relates to an electronic module and a manufacturing method of the same. The electronic module includes a substrate, an electronic component, a first package body, a magnetic layer, a coil and a second package body. The electronic component is on the substrate. The first package body is on the substrate and covers the electronic component. The magnetic layer is on the first package body. The coil is on the magnetic layer. The coil includes a first section and a second section spaced from the first section. The first section and the second section are connected by a conductive material. The second package body is on the magnetic layer and covers the coil.