公开(公告)号：US11862544B2

公开(公告)日：2024-01-02

申请号：US17239482

申请日：2021-04-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh ,  Jen-Chieh Kao

IPC: H01L23/498 ,  H01L25/00 ,  H01L23/31 ,  H01L25/10

CPC classification number: H01L23/49805 ,  H01L23/3121 ,  H01L25/105 ,  H01L25/50

Abstract: The present disclosure provides an electronic assembly including a semiconductor device package. The semiconductor device package includes a first package and a conductive element. The first package includes an electronic component and a protection layer covering the electronic component. The conductive element is supported by the protection layer and electrically connected with the electronic component through an electrical contact. A method for manufacturing a semiconductor device package is also provided in the present disclosure.

公开(公告)号：US11462455B2

公开(公告)日：2022-10-04

申请号：US16262762

申请日：2019-01-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shiu-Fang Yen ,  Chang-Lin Yeh ,  Jen-Chieh Kao

IPC: H01L21/00 ,  H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L23/498 ,  H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/38 ,  H01L25/065

Abstract: A semiconductor package device includes a substrate, an electronic component, and a thermal conductive layer. The electronic component is disposed on the substrate and includes a first surface facing away from the substrate. The thermal conductive layer is disposed above the first surface of the electronic component. The thermal conductive layer includes a plurality of portions spaced apart from each other.

公开(公告)号：US10580713B2

公开(公告)日：2020-03-03

申请号：US15884313

申请日：2018-01-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Chen ,  Chang-Lin Yeh ,  Jen-Chieh Kao

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/00 ,  H01Q19/10 ,  H01Q13/10

Abstract: A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.

公开(公告)号：US12087652B2

公开(公告)日：2024-09-10

申请号：US17884515

申请日：2022-08-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Chen ,  Chang-Lin Yeh ,  Jen-Chieh Kao

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/10 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01Q13/10 ,  H01Q19/10 ,  H01Q21/06

CPC classification number: H01L23/3114 ,  H01L23/10 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/66 ,  H01L24/13 ,  H01L24/73 ,  H01L24/85 ,  H01Q1/2283 ,  H01Q1/2291 ,  H01Q13/10 ,  H01Q19/10 ,  H01Q21/061 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15321 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.

公开(公告)号：US11037891B2

公开(公告)日：2021-06-15

申请号：US16453780

申请日：2019-06-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Nan Lin ,  Wei-Tung Chang ,  Jen-Chieh Kao ,  Huei-Shyong Cho

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01Q1/22 ,  H01L23/00 ,  H01Q1/24

Abstract: An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

公开(公告)号：US10950530B2

公开(公告)日：2021-03-16

申请号：US16416043

申请日：2019-05-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Nan Lin ,  Jen-Chieh Kao

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22

Abstract: A semiconductor device package includes a first substrate, a second substrate, a first support element, a second support element and an electronic component. The first substrate has a first surface and a second surface opposite to the first surface. The first substrate has a conductive pad adjacent to the first surface of the first substrate. The second substrate is disposed over the first surface of the first substrate. The first support element is disposed between the first substrate and the second substrate. The first support element is disposed adjacent to an edge of the first surface of the first substrate. The second support element is disposed between the first substrate and the second substrate. The second support element is disposed far away from the edge of the first surface of the first substrate. The electronic component is disposed on the second surface of the first substrate. A projection line of a contact point between the second support element and the conductive pad on the second surface of the first substrate is physically spaced apart from a projection line of a lateral surface of the electronic component on the second surface of the first substrate.

公开(公告)号：US10332849B2

公开(公告)日：2019-06-25

申请号：US16121467

申请日：2018-09-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh ,  Jen-Chieh Kao ,  Chih-Yi Huang ,  Fu-Chen Chu

IPC: H01L43/02 ,  H01L23/66 ,  H01L23/498 ,  H01L23/552 ,  H01L25/065 ,  H01L25/16

Abstract: A semiconductor package device includes: (1) a substrate having a first surface; (2) a permeable element including a first portion disposed on the first surface of the substrate, a second portion protruding from the first portion, and a third portion disposed on the second portion and contacting the second portion of the permeable element; (3) a first electrical element disposed on the substrate and surrounded by the second portion of the permeable element; and (4) a coil disposed on the substrate and surrounding the second portion of the permeable element.

公开(公告)号：US12119312B2

公开(公告)日：2024-10-15

申请号：US18223525

申请日：2023-07-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Nan Lin ,  Wei-Tung Chang ,  Jen-Chieh Kao ,  Huei-Shyong Cho

IPC: H01L23/66 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01Q1/22 ,  H01Q1/24

CPC classification number: H01L23/66 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01Q1/2283 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/1421 ,  H01Q1/243

Abstract: An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

公开(公告)号：US11705412B2

公开(公告)日：2023-07-18

申请号：US17347220

申请日：2021-06-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Nan Lin ,  Wei-Tung Chang ,  Jen-Chieh Kao ,  Huei-Shyong Cho

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01Q1/22 ,  H01L23/00 ,  H01Q1/24

CPC classification number: H01L23/66 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01Q1/2283 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/1421 ,  H01Q1/243

Abstract: An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

公开(公告)号：US10991656B2

公开(公告)日：2021-04-27

申请号：US16446368

申请日：2019-06-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh ,  Jen-Chieh Kao

IPC: H01L23/48 ,  H01L23/538 ,  H01L25/16 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor device package includes a first substrate, a second substrate disposed over the first substrate, and a surface mount device (SMD) component disposed between the first substrate and the second substrate. The SMD component includes a plurality of connection electrodes electrically connecting the first substrate to the second substrate, and the plurality of connection electrodes are electrically disconnected from each other.