- Patent Title: Semiconductor package device and method of manufacturing the same
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Application No.: US17884515Application Date: 2022-08-09
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Publication No.: US12087652B2Publication Date: 2024-09-10
- Inventor: Yi Chen , Chang-Lin Yeh , Jen-Chieh Kao
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/00 ; H01L23/10 ; H01L23/498 ; H01L23/66 ; H01Q1/22 ; H01Q13/10 ; H01Q19/10 ; H01Q21/06
Abstract:
A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.
Public/Granted literature
- US20220384289A1 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-12-01
Information query
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