公开(公告)号：US12089349B2

公开(公告)日：2024-09-10

申请号：US18239723

申请日：2023-08-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Yung I Yeh ,  Chang-Lin Yeh ,  Sheng-Yu Chen

IPC: H01L23/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/28 ,  H05K5/00 ,  H05K5/06 ,  H05K9/00

CPC classification number: H05K5/0017 ,  H05K1/142 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K5/065 ,  H05K9/0022 ,  H05K2201/041 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US12087652B2

公开(公告)日：2024-09-10

申请号：US17884515

申请日：2022-08-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Chen ,  Chang-Lin Yeh ,  Jen-Chieh Kao

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/10 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01Q13/10 ,  H01Q19/10 ,  H01Q21/06

CPC classification number: H01L23/3114 ,  H01L23/10 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/66 ,  H01L24/13 ,  H01L24/73 ,  H01L24/85 ,  H01Q1/2283 ,  H01Q1/2291 ,  H01Q13/10 ,  H01Q19/10 ,  H01Q21/061 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15321 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.

公开(公告)号：US11997888B2

公开(公告)日：2024-05-28

申请号：US17549784

申请日：2021-12-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Sheng-Yu Chen ,  Chang-Lin Yeh ,  Yung-I Yeh

IPC: H10K59/129 ,  H01L25/16 ,  H01L27/15 ,  H01L29/786 ,  H10B10/00 ,  H10K50/30 ,  H10K59/125

CPC classification number: H10K59/129 ,  H01L25/16 ,  H01L25/167 ,  H01L27/156 ,  H01L29/786 ,  H10B10/125 ,  H10K50/30 ,  H10K59/125

Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.

公开(公告)号：US10332849B2

公开(公告)日：2019-06-25

申请号：US16121467

申请日：2018-09-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh ,  Jen-Chieh Kao ,  Chih-Yi Huang ,  Fu-Chen Chu

IPC: H01L43/02 ,  H01L23/66 ,  H01L23/498 ,  H01L23/552 ,  H01L25/065 ,  H01L25/16

Abstract: A semiconductor package device includes: (1) a substrate having a first surface; (2) a permeable element including a first portion disposed on the first surface of the substrate, a second portion protruding from the first portion, and a third portion disposed on the second portion and contacting the second portion of the permeable element; (3) a first electrical element disposed on the substrate and surrounded by the second portion of the permeable element; and (4) a coil disposed on the substrate and surrounding the second portion of the permeable element.

公开(公告)号：US12176276B2

公开(公告)日：2024-12-24

申请号：US18133463

申请日：2023-04-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh

IPC: H01L23/498 ,  H01L21/48 ,  H01L25/16

Abstract: A semiconductor device package includes a first substrate, a second substrate, a conductive structure, a first solder and a second solder. The second substrate is disposed over the first substrate. The conductive structure is disposed between the first substrate and the second substrate. The conductive structure includes a first wetting portion, a second wetting portion, and a non-wetting portion disposed between the first wetting portion and the second wetting portion. The first solder covers the first wetting portion and connects the conductive structure to the first substrate. The second solder covers the second wetting portion and connects the conductive structure to the second substrate. The first solder is spaced apart from the second solder by the non-wetting portion.

公开(公告)号：US11289394B2

公开(公告)日：2022-03-29

申请号：US16725307

申请日：2019-12-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Sheng-Yu Chen ,  Chang-Lin Yeh ,  Ming-Hung Chen

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/29 ,  H01L23/538 ,  H01L25/065 ,  H01L21/56

Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.

公开(公告)号：US10411766B2

公开(公告)日：2019-09-10

申请号：US15458742

申请日：2017-03-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh

IPC: H04B5/00 ,  H01L23/31 ,  H01L23/64 ,  H01L23/538 ,  H01L23/48 ,  H01L21/56 ,  H01F27/28 ,  H01F38/14 ,  H01F5/00 ,  H01F27/02 ,  H01F27/40 ,  H02J50/10 ,  H01G4/228 ,  H01G4/40 ,  H01L23/66

Abstract: A semiconductor device package includes a substrate, a package body, a conductive layer, a dielectric layer, a magnetic layer, a first insulating layer and a coil. The package body is disposed on the substrate. The package body has a first part and a second part disposed above the first part. The conductive layer is disposed on the first part of the package body and is electrically connected to the substrate. The dielectric layer is disposed on the conductive layer. The magnetic layer is disposed on the dielectric layer. The first insulating layer is disposed on the magnetic layer. The coil is disposed on the first insulating layer. The coil has a first terminal electrically connected with the magnetic layer.

公开(公告)号：US10096578B1

公开(公告)日：2018-10-09

申请号：US15643470

申请日：2017-07-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh ,  Yu-Chang Chen

IPC: H01L23/053 ,  H01L23/34 ,  H01L25/065 ,  H01L23/498 ,  H01L23/00

Abstract: A semiconductor package device includes a substrate, an electronic component disposed on the substrate, and a package body. The electronic component has a first surface adjacent to the substrate and a second surface opposite to the first surface. The second surface has at least five edges, and the package body encapsulates the electronic component and exposes the second surface of the electronic component.

公开(公告)号：US12186094B2

公开(公告)日：2025-01-07

申请号：US17396605

申请日：2021-08-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh

IPC: A61B5/00 ,  H05K5/00 ,  H05K5/06

Abstract: A wearable device is provided. The wearable device includes an electronic component and an encapsulant. The encapsulant includes a low-penetrability region encapsulating the electronic component and a high-penetrability region physically separated from the electronic component.

公开(公告)号：US11862544B2

公开(公告)日：2024-01-02

申请号：US17239482

申请日：2021-04-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh ,  Jen-Chieh Kao

IPC: H01L23/498 ,  H01L25/00 ,  H01L23/31 ,  H01L25/10

CPC classification number: H01L23/49805 ,  H01L23/3121 ,  H01L25/105 ,  H01L25/50

Abstract: The present disclosure provides an electronic assembly including a semiconductor device package. The semiconductor device package includes a first package and a conductive element. The first package includes an electronic component and a protection layer covering the electronic component. The conductive element is supported by the protection layer and electrically connected with the electronic component through an electrical contact. A method for manufacturing a semiconductor device package is also provided in the present disclosure.