公开(公告)号：US11997888B2

公开(公告)日：2024-05-28

申请号：US17549784

申请日：2021-12-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Sheng-Yu Chen ,  Chang-Lin Yeh ,  Yung-I Yeh

IPC: H10K59/129 ,  H01L25/16 ,  H01L27/15 ,  H01L29/786 ,  H10B10/00 ,  H10K50/30 ,  H10K59/125

CPC classification number: H10K59/129 ,  H01L25/16 ,  H01L25/167 ,  H01L27/156 ,  H01L29/786 ,  H10B10/125 ,  H10K50/30 ,  H10K59/125

Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.

公开(公告)号：US12055827B2

公开(公告)日：2024-08-06

申请号：US18134509

申请日：2023-04-13

Applicant: Samsung Display Co., Ltd.

Inventor： Sujeong Kim ,  Hanho Park ,  Sangwon Yeo ,  Daegeun Lee ,  Joonsam Kim

IPC: G02F1/1345 ,  H01L23/00 ,  H10K59/129 ,  H10K59/131 ,  H10K59/40 ,  H10K77/10 ,  G06F3/044 ,  H05K1/11 ,  H10K102/00

CPC classification number: G02F1/13458 ,  H01L24/06 ,  H10K59/129 ,  H10K59/131 ,  H10K59/40 ,  H10K77/111 ,  G06F3/044 ,  H01L2224/0217 ,  H01L2224/0603 ,  H01L2224/0605 ,  H01L2224/06132 ,  H01L2924/12044 ,  H05K1/111 ,  H05K2201/09409 ,  H05K2201/10128 ,  H10K2102/311

Abstract: A display device including a display panel including a base layer, a circuit layer disposed on the base layer, and a pad part having a plurality of pads disposed on the base layer; and a driving chip disposed on the pad part and including a plurality of chip pads. The plurality of pads include a first pad having a smaller area than a corresponding chip pad among the plurality of chip pads and a second pad electrically connected to the circuit layer.

公开(公告)号：US11955080B2

公开(公告)日：2024-04-09

申请号：US18007259

申请日：2021-07-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Haohui Long ,  Xuan Cao ,  Runqing Ye ,  Jianping Fang ,  Xiaochen Chen

IPC: G09G3/3233 ,  G06V40/13 ,  G09G3/00 ,  H10K59/129

CPC classification number: G09G3/3233 ,  G06V40/1318 ,  G09G3/035 ,  H10K59/129 ,  G09G2300/0408 ,  G09G2300/0452 ,  G09G2330/02 ,  G09G2354/00

Abstract: A display module includes a circuit board, an integrated chip, and a pixel chipset. The integrated chip is electrically connected to the circuit board, and the integrated chip includes a first chiplet and a plurality of display pixel drive circuits integrated into the first chiplet. The pixel chipset includes a plurality of light-emitting chips. In addition, at least one pixel chipset is disposed on a surface of a side that is of an integrated chip and that is away from the circuit board, a light-emitting chip disposed on the integrated chip is electrically connected to a display pixel drive circuit in the integrated chip, and the display pixel drive circuit is configured to drive the light-emitting chip to emit light.

公开(公告)号：US12198581B2

公开(公告)日：2025-01-14

申请号：US18084708

申请日：2022-12-20

Applicant: General Interface Solution Limited

Inventor： Po-Ching Lin ,  Po-Lun Chen ,  Chun-Ta Chen ,  Ya-Chu Hsu ,  Chia-Ming Fan

IPC: H05K1/02 ,  G06F1/16 ,  G09F9/30 ,  G09F9/33 ,  H10K50/81 ,  H10K50/82 ,  H10K50/84 ,  H10K50/856 ,  H10K50/86 ,  H10K59/00 ,  H10K59/12 ,  H10K59/121 ,  H10K59/122 ,  H10K59/124 ,  H10K59/127 ,  H10K59/129 ,  H10K59/131 ,  H10K59/18 ,  H10K59/35 ,  H10K71/00

Abstract: A light emitting diode display device includes: a substrate, a plurality of signal lines, and a plurality of transparent apertures. A plurality of element packages arranged in matrix on one side of the substrate, the two element packages are connected by the signal lines, and the transparent aperture is surrounded by the signal lines. The signal line is a multi-layer structure for transmitting signal, which can reduce the risk of breaking the signal transmission line during stretching. The transparent aperture is stacked with organic materials, and the inorganic material is removed, which reduces the problem of the cracking and extension of the inorganic material layer when the product is stretched. It also has the effect of reducing the penetration loss caused by the refraction of light through multiple layers, so that the transparent aperture forms a high light-transmitting effect.

公开(公告)号：US20240361650A1

公开(公告)日：2024-10-31

申请号：US18765292

申请日：2024-07-07

Applicant: Samsung Display Co., Ltd.

Inventor： Sujeong KIM ,  Hanho PARK ,  Sangwon YEO ,  Daegeun LEE ,  Joonsam KIM

IPC: G02F1/1345 ,  G06F3/044 ,  H01L23/00 ,  H05K1/11 ,  H10K59/129 ,  H10K59/131 ,  H10K59/40 ,  H10K77/10 ,  H10K102/00

CPC classification number: G02F1/13458 ,  H01L24/06 ,  H10K59/129 ,  H10K59/131 ,  H10K59/40 ,  H10K77/111 ,  G06F3/044 ,  H01L2224/0217 ,  H01L2224/0603 ,  H01L2224/0605 ,  H01L2224/06132 ,  H01L2924/12044 ,  H05K1/111 ,  H05K2201/09409 ,  H05K2201/10128 ,  H10K2102/311

Abstract: A display device including a display panel including a base layer, a circuit layer disposed on the base layer, and a pad part having a plurality of pads disposed on the base layer; and a driving chip disposed on the pad part and including a plurality of chip pads. The plurality of pads include a first pad having a smaller area than a corresponding chip pad among the plurality of chip pads and a second pad electrically connected to the circuit layer.

公开(公告)号：US20230251535A1

公开(公告)日：2023-08-10

申请号：US18134509

申请日：2023-04-13

Applicant: Samsung Display Co., Ltd.

Inventor： Sujeong KIM ,  Hanho Park ,  Sangwon Yeo ,  Daegeun Lee ,  Joonsam Kim

IPC: G02F1/1345 ,  H10K59/40 ,  H10K59/129 ,  H10K59/131 ,  H10K77/10 ,  H01L23/00

CPC classification number: G02F1/13458 ,  H10K59/40 ,  H10K59/129 ,  H10K59/131 ,  H10K77/111 ,  H01L24/06 ,  H05K1/111

Abstract: A display device including a display panel including a base layer, a circuit layer disposed on the base layer, and a pad part having a plurality of pads disposed on the base layer; and a driving chip disposed on the pad part and including a plurality of chip pads. The plurality of pads include a first pad having a smaller area than a corresponding chip pad among the plurality of chip pads and a second pad electrically connected to the circuit layer.