公开(公告)号：US12198581B2

公开(公告)日：2025-01-14

申请号：US18084708

申请日：2022-12-20

Applicant: General Interface Solution Limited

Inventor： Po-Ching Lin ,  Po-Lun Chen ,  Chun-Ta Chen ,  Ya-Chu Hsu ,  Chia-Ming Fan

IPC: H05K1/02 ,  G06F1/16 ,  G09F9/30 ,  G09F9/33 ,  H10K50/81 ,  H10K50/82 ,  H10K50/84 ,  H10K50/856 ,  H10K50/86 ,  H10K59/00 ,  H10K59/12 ,  H10K59/121 ,  H10K59/122 ,  H10K59/124 ,  H10K59/127 ,  H10K59/129 ,  H10K59/131 ,  H10K59/18 ,  H10K59/35 ,  H10K71/00

Abstract: A light emitting diode display device includes: a substrate, a plurality of signal lines, and a plurality of transparent apertures. A plurality of element packages arranged in matrix on one side of the substrate, the two element packages are connected by the signal lines, and the transparent aperture is surrounded by the signal lines. The signal line is a multi-layer structure for transmitting signal, which can reduce the risk of breaking the signal transmission line during stretching. The transparent aperture is stacked with organic materials, and the inorganic material is removed, which reduces the problem of the cracking and extension of the inorganic material layer when the product is stretched. It also has the effect of reducing the penetration loss caused by the refraction of light through multiple layers, so that the transparent aperture forms a high light-transmitting effect.

公开(公告)号：US11827974B2

公开(公告)日：2023-11-28

申请号：US17117396

申请日：2020-12-10

Applicant: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD. ,  INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. ,  GENERAL INTERFACE SOLUTION LIMITED

Inventor： Po-Lun Chen ,  Chun-Ta Chen ,  Tsung-Chen Chou ,  Chin-Yang Wu ,  Nai-Hau Shiue

IPC: C23C14/54 ,  C23C14/04 ,  C23C14/34

CPC classification number: C23C14/54 ,  C23C14/042 ,  C23C14/3464

Abstract: A sputtering system is suitable for sputtering a surface to be sputtered having sections. Each section has a projection height. The sputtering system includes a supporting plate, a sputtering array, and a controller. The sputtering array is arranged on the supporting plate. The sputtering array includes sputtering units. Each section corresponds to at least one of the sputtering units. Each sputtering unit has a driving shaft and a target. The target faces the surface to be sputtered. The controller is electrically connected the driving shaft. The driving shaft drives the target to move relative to the surface to be sputtered. The controller controls a distance between each sputtering unit and the corresponding section of the sections in the direction of the projection height to satisfy a given condition.

公开(公告)号：US11625078B2

公开(公告)日：2023-04-11

申请号：US17538093

申请日：2021-11-30

Applicant: Interface Technology (ChengDu) Co., Ltd. ,  INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. ,  INTERFACE OPTOELECTRONICS (WUXI) CO., LTD. ,  GENERAL INTERFACE SOLUTION LIMITED

Inventor： Chia-Ming Fan ,  Po-Lun Chen ,  Chun-Ta Chen ,  Po-Ching Lin ,  Ya-Chu Hsu ,  Chin-I Tu ,  Kuo-Fung Huang

IPC: G02F1/1362 ,  G06F1/18 ,  G06F3/041 ,  H01L25/075 ,  H01L33/62

Abstract: A conductive module includes spaced conductive layers and connecting lines. Adjacent conductive layers are electrically connected by one connecting line. Each connecting line includes a contact portion and an extending portion, the contact portion is electrically connected to one conductive layer and the extending portion. The extending portion is very stretchable in effective length to render the conductive module stretchable and deformable. A projection of the contact portion on a plane where the extending portion extends is a square, a width of the extending portion is equal to a side length of the contact portion.

公开(公告)号：US10928674B1

公开(公告)日：2021-02-23

申请号：US16819253

申请日：2020-03-16

Applicant: Interface Technology (ChengDu) Co., Ltd. ,  Interface Optoelectronics (ShenZhen) Co., Ltd. ,  General Interface Solution Limited

Inventor： Hsien-Ying Chou ,  Po-Lun Chen ,  Nai-Hau Shiue ,  Chun-Ta Chen ,  Ta-Jen Huang ,  Yi-Lin Sun

IPC: G02F1/13357 ,  H01L25/075 ,  H01L33/56 ,  H01L33/54

Abstract: A manufacturing method using a micro-miniature LED as a light source for backlight thickness reduction and light efficiency improvement comprising a plurality of spaced apart light emitting diode chips on a substrate. Colloid with uniformly distributed diffusion particles is coated to fill gaps between LED chips. A roller is applied to the surface of the colloid and a continuous geometric structure is formed with a cone structure in the horizontal-vertical (XY axis) direction. An ultraviolet curing device is used for optical UV curing of the continuous geometric structure to create a brightness enhancement layer.

公开(公告)号：US12125435B2

公开(公告)日：2024-10-22

申请号：US18063659

申请日：2022-12-08

Applicant: Interface Technology (ChengDu) Co., Ltd. ,  Interface Optoelectronics (ShenZhen) Co., Ltd. ,  General Interface Solution Limited

Inventor： De-Fu Chen ,  Po Lun Chen ,  Chun-Ta Chen ,  Ta-Jen Huang ,  Po-Tsun Liu ,  Guang-Ting Zheng ,  Ting-Yi Yi

IPC: G09G3/3208

CPC classification number: G09G3/3208 ,  G09G2300/0852 ,  G09G2310/061 ,  G09G2310/08 ,  G09G2320/045 ,  G09G2320/0633 ,  G09G2330/023

Abstract: The present disclosure provides a pixel circuit with pulse width compensation, and the pixel circuit includes a pulse width modulation circuit and a pulse amplitude modulation circuit, and the pulse amplitude modulation circuit is electrically connected to the pulse width modulation circuit. The pulse width modulation circuit includes a P-type pulse width compensation transistor and a first P-type control transistor, and the first P-type control transistor is electrically connected to the P-type pulse width compensation transistor. The pulse amplitude modulation circuit includes a second P-type control transistor, a first capacitor, a P-type driving transistor and a light-emitting element. The second P-type control transistor is electrically connected to the first P-type control transistor. The first capacitor is electrically connected to the second P-type control transistor. The P-type driving transistor is electrically connected to the first capacitor, and the light-emitting element is electrically connected to the P-type driving transistor.

公开(公告)号：US11963385B2

公开(公告)日：2024-04-16

申请号：US17452233

申请日：2021-10-25

Applicant: Interface Technology (ChengDu) Co., Ltd. ,  Interface Optoelectronics (ShenZhen) Co., Ltd. ,  General Interface Solution Limited

Inventor： Wen-You Lai ,  Ping-Hsiang Kao ,  Po-Lun Chen ,  Chun-Ta Chen ,  Po-Ching Lin ,  Ya-Chu Hsu

IPC: H10K50/844 ,  H01L25/075 ,  H01L27/15 ,  H01L33/52 ,  H10K59/90 ,  H10K71/00 ,  H10K77/10 ,  H10K102/00

CPC classification number: H10K50/844 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/52 ,  H10K59/90 ,  H10K71/00 ,  H01L2933/005 ,  H10K77/111 ,  H10K2102/311

Abstract: The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.

公开(公告)号：US11895811B2

公开(公告)日：2024-02-06

申请号：US17519153

申请日：2021-11-04

Applicant: Interface Technology (ChengDu) Co., Ltd. ,  Interface Optoelectronics (ShenZhen) Co., Ltd. ,  Interface Optoelectronics (Wuxi) Co., Ltd. ,  General Interface Solution Limited

Inventor： Ping-Hsiang Kao ,  Wen-You Lai ,  Po-Lun Chen ,  Chun-Ta Chen ,  Po-Ching Lin ,  Ya-Chu Hsu

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20 ,  G09F9/30 ,  G06F3/041

CPC classification number: H05K7/20963 ,  G09F9/301 ,  G06F3/0412 ,  G06F3/04164 ,  G06F2203/04102

Abstract: A curved electronic device and a method for manufacturing the same are disclosed. The curved electronic device includes a substrate, a component layer, and a modulation layer. The component layer is disposed on the substrate. The component layer is composed of a plurality of electronic components and their connecting wiring arranged on the substrate. The modulation layer is disposed on the component layer, and includes at least one pattern area and at least one blank area that are formed on the component layer. The blank area allows one part of the electronic components to be exposed out of the modulation layer. The modulation layer and the substrate have different heat absorption rates, so that the positions of the substrate corresponding to the blank area and the pattern area have different degrees of softening, so as to prevent the component layer from being damaged in the process of stretching the substrate.

公开(公告)号：US11669046B2

公开(公告)日：2023-06-06

申请号：US17326351

申请日：2021-05-21

Applicant: Interface Technology (ChengDu) Co., Ltd. ,  Interface Optoelectronics (ShenZhen) Co., Ltd. ,  Interface Optoelectronics (Wuxi) Co., Ltd. ,  General Interface Solution Limited

Inventor： Shih-Yu Wang ,  Chun-Ta Chen ,  Shiuan-Huei Lin ,  Zih-Fan Chen ,  Wan-Lin Li ,  Yi-Hsin Lin ,  Yu-Jen Wang ,  Wei-Cheng Cheng ,  Chang-Nien Mao

IPC: G02B27/01 ,  G03H1/22 ,  G02F1/29 ,  G09G3/34 ,  G09G3/36

CPC classification number: G03H1/2202 ,  G02B27/0172 ,  G02F1/29 ,  G09G3/3413 ,  G09G3/36 ,  G02B2027/0123 ,  G02B2027/0174 ,  G03H2223/16 ,  G03H2223/18 ,  G03H2223/23

Abstract: A display device includes a light source, a waveguide element, a liquid crystal coupler, a first holographic optical element and a second holographic optical element. The light source is configured to emit light. The waveguide element is located above the light source. The liquid crystal coupler is located between the waveguide element and the light source. The first holographic optical element is located on a top surface of the waveguide element, in which the liquid crystal coupler is configured to change an incident angle that the light emits to the first holographic optical element. The second holographic optical element is located on the top surface of the waveguide element, and there is a first distance in a horizontal direction between the first holographic optical element and the second holographic optical element, in which the second holographic optical element is configured to diffract the light to the waveguide element below.

公开(公告)号：US11600242B2

公开(公告)日：2023-03-07

申请号：US17204965

申请日：2021-03-18

Applicant: Interface Technology (ChengDu) Co., Ltd. ,  Interface Optoelectronics (ShenZhen) Co., Ltd. ,  Interface Optoelectronics (Wuxi) Co., Ltd. ,  General Interface Solution Limited

Inventor： Po-Lun Chen ,  Chun-Ta Chen ,  Chih-Lin Liao ,  Fu-Cheng Wei ,  Po-Tsun Liu ,  Guang-Ting Zheng ,  Ting-Yu Wei

IPC: G09G3/36

Abstract: A single-stage gate driving circuit with multiple outputs includes a first bootstrapping circuit, a first pre-charge circuit, a first output control circuit, a second bootstrapping circuit, a second pre-charge circuit, and a second output control circuit. During a first duration, the first pre-charge circuit precharges a first node to a first voltage. During a second duration, the first bootstrapping circuit boosts the first node from the first voltage to a second voltage, and the second pre-charge circuit precharges a second node to a fourth voltage. During a third duration, the first output control circuit boosts the first node from the second voltage to a third voltage, and the second bootstrapping circuit boosts the second node from the fourth voltage to a fifth voltage. During a fourth duration, the second output control circuit boosts the second node from the fifth voltage to a sixth voltage.

公开(公告)号：US11552064B2

公开(公告)日：2023-01-10

申请号：US17147729

申请日：2021-01-13

Applicant: Interface Technology (ChengDu) Co., Ltd. ,  Interface Optoelectronics (ShenZhen) Co., Ltd. ,  General Interface Solution Limited

Inventor： Po-Lun Chen ,  Chun-Ta Chen ,  Po-Ching Lin

IPC: H01L25/16 ,  H01L27/12 ,  H01L27/32 ,  H01L51/00 ,  H01L51/56

Abstract: The present invention is a display and manufacturing method thereof, including a thin film substrate, a plurality of packaging layers, and a stretch-resistant unit, wherein one side of the thin film substrate has a plurality of pixel areas, each pixel area contains at least one light-emitting element, and each packaging layer respectively covers one of the pixel areas to form an island-shape structure, and there is a spacing between any two adjacent island-shape structures, and each stretch-resistant unit deposed at the spacing and connects the adjacent island-shape structures.