- Patent Title: Semiconductor package device and method of manufacturing the same
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Application No.: US16121467Application Date: 2018-09-04
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Publication No.: US10332849B2Publication Date: 2019-06-25
- Inventor: Chang-Lin Yeh , Jen-Chieh Kao , Chih-Yi Huang , Fu-Chen Chu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L43/02
- IPC: H01L43/02 ; H01L23/66 ; H01L23/498 ; H01L23/552 ; H01L25/065 ; H01L25/16
Abstract:
A semiconductor package device includes: (1) a substrate having a first surface; (2) a permeable element including a first portion disposed on the first surface of the substrate, a second portion protruding from the first portion, and a third portion disposed on the second portion and contacting the second portion of the permeable element; (3) a first electrical element disposed on the substrate and surrounded by the second portion of the permeable element; and (4) a coil disposed on the substrate and surrounding the second portion of the permeable element.
Public/Granted literature
- US20180374805A1 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-12-27
Information query
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