INSPECTION APPARATUS AND METHOD
    22.
    发明申请

    公开(公告)号:US20240369356A1

    公开(公告)日:2024-11-07

    申请号:US18776207

    申请日:2024-07-17

    Abstract: An inspection apparatus for adjusting a working height for a substrate for multiple target heights is disclosed. The inspection apparatus includes a radiation source configured to provide a radiation beam and a beam splitter configured to split the radiation beam into multiple beamlets that each reflect off a substrate. Each beamlet contains light of multiple wavelengths. The inspection apparatus includes multiple light reflecting components, wherein each light reflecting component is associated with one of the beamlets reflecting off the substrate and is configured to support a different target height for the substrate by detecting a height or a levelness of the substrate based on the beamlet reflecting off the substrate.

    SYSTEM FOR INSPECTING AND GROUNDING A MASK IN A CHARGED PARTICLE SYSTEM

    公开(公告)号:US20230005698A1

    公开(公告)日:2023-01-05

    申请号:US17778579

    申请日:2020-10-21

    Abstract: A system for grounding a mask using a grounding component are provided. Some embodiments of the system include a grounding component comprising a base and an extension protruding from the base and comprising a conductive prong configured to contact a conductive layer of the mask. Some embodiments of the system include a plurality of conductive prongs configured to contact multiple positions of a conductive layer of the mask. Some other embodiments of the system include an extension comprising various shapes.

    METHOD, APPARATUS, AND SYSTEM FOR WAFER GROUNDING

    公开(公告)号:US20220277926A1

    公开(公告)日:2022-09-01

    申请号:US17753298

    申请日:2020-08-25

    Abstract: Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.

    INSPECTION APPARATUS AND METHOD
    27.
    发明申请

    公开(公告)号:US20220107176A1

    公开(公告)日:2022-04-07

    申请号:US17487896

    申请日:2021-09-28

    Abstract: An inspection apparatus for adjusting a working height for a substrate for multiple target heights is disclosed. The inspection apparatus includes a radiation source configured to provide a radiation beam and a beam splitter configured to split the radiation beam into multiple beamlets that each reflect off a substrate. Each beamlet contains light of multiple wavelengths. The inspection apparatus includes multiple light reflecting components, wherein each light reflecting component is associated with one of the beamlets reflecting off the substrate and is configured to support a different target height for the substrate by detecting a height or a levelness of the substrate based on the beamlet reflecting off the substrate.

    MULTI-SOURCE ILLUMINATION UNIT AND METHOD OF OPERATING THE SAME

    公开(公告)号:US20210396683A1

    公开(公告)日:2021-12-23

    申请号:US17283930

    申请日:2019-09-20

    Abstract: An illumination unit comprising a first electromagnetic wave source including circuitry for outputting a first electromagnetic wave in a first direction to illuminate a first region of a sample; a second electromagnetic wave source including circuitry for outputting a second electromagnetic wave in a second direction substantially opposite to the first direction; and a reflector configured to reflect the second electromagnetic wave substantially in the first direction to illuminate a second region of the sample.

    OPTICAL HEIGHT DETECTION SYSTEM
    29.
    发明申请

    公开(公告)号:US20200279715A1

    公开(公告)日:2020-09-03

    申请号:US16650840

    申请日:2018-09-21

    Abstract: An optical height detection system in a charged particle beam inspection system. The optical height detection system includes a projection unit including a modulated illumination source, a projection grating mask including a projection grating pattern, and a projection optical unit for projecting the projection grating pattern to a sample; and a detection unit including a first detection grating mask including a first detection grating pattern, a second detection grating mask including a second detection grating pattern, and a detection optical system for forming a first grating image from the projection grating pattern onto the first detection grating mask and forming a second grating image from the projection grating pattern onto the second detection grating masks. The first and second detection grating patterns at least partially overlap the first and second grating images, respectively.

    METHODS OF INSPECTING SAMPLES WITH MULTIPLE BEAMS OF CHARGED PARTICLES

    公开(公告)号:US20200271598A1

    公开(公告)日:2020-08-27

    申请号:US16812109

    申请日:2020-03-06

    Abstract: Disclosed herein is an apparatus comprising: a source configured to emit charged particles, an optical system and a stage; wherein the stage is configured to support a sample thereon and configured to move the sample by a first distance in a first direction; wherein the optical system is configured to form probe spots on the sample with the charged particles; wherein the optical system is configured to move the probe spots by the first distance in the first direction and by a second distance in a second direction, simultaneously, while the stage moves the sample by the first distance in the first direction; wherein the optical system is configured to move the probe spots by the first distance less a width of one of the probe spots in an opposite direction of the first direction, after the stage moves the sample by the first distance in the first direction.

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