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公开(公告)号：US20160062213A1
公开(公告)日：2016-03-03
申请号：US14604657
申请日：2015-01-23
Applicant: Apple Inc.
Inventor： Marwan Rammah , Eric N. Nyland , Matthew D. Hill , Sawyer I. Cohen , Scott A. Myers , David A. Pakula , Michael Benjamin Wittenberg , Ashutosh Y. Shukla
CPC classification number: G03B17/12 , G02B7/003 , G03B17/02 , G03B43/00 , H04M1/0264 , H04N5/2257
Abstract: An electronic device having a securing member for a camera module is disclosed. The securing member may include several flexible spring elements extending around the camera module to maintain the position of the camera module during an assembly process of the electronic device. The securing member and the housing may be made from an electrically conductive material or materials. In this manner, the securing member may further provide the camera module with an electrical ground to prevent excessive electric charge within the camera module. In some embodiments, an alignment member is positioned on the housing and aligns the camera module and/or securing member with an aperture of the housing.
Abstract translation: 公开了一种具有相机模块固定部件的电子装置。 固定构件可以包括围绕照相机模块延伸的多个柔性弹簧元件，以在电子设备的组装过程期间保持相机模块的位置。 固定构件和壳体可以由导电材料或材料制成。 以这种方式，固定构件还可以向相机模块提供电接地，以防止相机模块内的过度电荷。 在一些实施例中，对准构件定位在壳体上并且使相机模块和/或固定构件与壳体的孔对准。
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公开(公告)号：US11070655B2
公开(公告)日：2021-07-20
申请号：US16740668
申请日：2020-01-13
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Derek C. Krass , Benjamin Shane Bustle , Lucy Elizabeth Browning , Michael Benjamin Wittenberg , James B. Smith , Ashutosh Y. Shukla , Scott A. Myers
Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
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公开(公告)号：US20200153950A1
公开(公告)日：2020-05-14
申请号：US16740668
申请日：2020-01-13
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Derek C. Krass , Benjamin Shane Bustle , Lucy Elizabeth Browning , Michael Benjamin Wittenberg , James B. Smith , Ashutosh Y. Shukla , Scott A. Myers
IPC: H04M1/02
Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
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公开(公告)号：USD854000S1
公开(公告)日：2019-07-16
申请号：US29576417
申请日：2016-09-02
Applicant: Apple Inc.
Designer： Jody Akana , Bartley K. Andre , Jeremy Bataillou , Sawyer Isaac Cohen , Daniel J. Coster , Daniele De Iuliis , M. Evans Hankey , Julian Hoenig , Richard P. Howarth , Jonathan P. Ive , Duncan Robert Kerr , Shin Nishibori , David A. Pakula , Matthew Dean Rohrbach , Peter Russell-Clarke , Ashutosh Y. Shukla , Christopher J. Stringer , Eugene Antony Whang , Michael Benjamin Wittenberg , Rico Zörkendörfer
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公开(公告)号：US10218827B2
公开(公告)日：2019-02-26
申请号：US15449797
申请日：2017-03-03
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Derek C. Krass , Benjamin Shane Bustle , Lucy Elizabeth Browning , Michael Benjamin Wittenberg , James B. Smith , Ashutosh Y. Shukla , Scott A. Myers
Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
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Patent Agency Ranking
公开(公告)号：US09808829B2
公开(公告)日：2017-11-07
申请号：US14846269
申请日：2015-09-04
Applicant: Apple Inc.
Inventor： Jared M. Kole , Ashutosh Y. Shukla , Yi Zhang , Vincent Yan , Wai Man Raymund Kwok
CPC classification number: B05D5/005 , B05B3/00 , B05B7/24 , B05D1/02 , B05D5/083 , B05D7/14 , B05D2202/25 , C25D11/24
Abstract: Coatings for filling cracks within anodic films formed from, for example, a laser marking process are described. The cracks generally have widths of nanometers in scale and can extend from an external surface of an anodic film to an underlying metal substrate. The coatings fill the cracks to prevent liquid and contaminants from entering the cracks and reaching the metal substrate, thereby preventing corrosion of the underlying metal substrate. The coatings can be hydrophobic such that water is wicked away from the cracks. In some cases, the coatings are fluoropolymer coatings. Methods include spray-on techniques that provide a thin and uniform layer of the coating. The spray-on technique can be configured to spray on a fluoropolymer precursor onto the anodic film such that the fluoropolymer precursor diffuses into and polymerizes into the fluoropolymer coating within the cracks.
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公开(公告)号：US20170279943A1
公开(公告)日：2017-09-28
申请号：US15449797
申请日：2017-03-03
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Derek C. Krass , Benjamin Shane Bustle , Lucy Elizabeth Browning , Michael Benjamin Wittenberg , James B. Smith , Ashutosh Y. Shukla , Scott A. Myers
IPC: H04M1/02
CPC classification number: H04M1/0249
Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
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28.发明授权Metal electromagnetic interference (EMI) shielding coating along an edge of a ceramic substrate 有权沿陶瓷基片边缘的金属电磁干扰（EMI）屏蔽涂层公开(公告)号：US09583445B2
公开(公告)日：2017-02-28
申请号：US14218384
申请日：2014-03-18
Applicant: Apple Inc.
Inventor： Richard H. Dinh , Ashutosh Y. Shukla , Scott A. Myers
IPC: H01L23/552 , H01L27/146 , H01L23/498 , H05K1/02 , H05K1/18 , H01L23/13 , H01L23/15 , H01L23/00 , H05K3/00 , H05K3/36
CPC classification number: H01L23/552 , H01L23/13 , H01L23/15 , H01L23/49805 , H01L23/49827 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/81 , H01L27/14618 , H01L2224/0401 , H01L2224/131 , H01L2224/16225 , H01L2224/16235 , H01L2224/16238 , H01L2224/81801 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15151 , H01L2924/15159 , H01L2924/15162 , H01L2924/15311 , H01L2924/15787 , H05K1/0218 , H05K1/189 , H05K3/0052 , H05K3/363 , H05K2201/053 , H05K2201/056 , H05K2201/09145 , H05K2201/09354 , H05K2201/09509 , H05K2201/09618 , H05K2201/10378 , H05K2201/2018 , H01L2924/014 , H01L2924/00
Abstract: An electrical component may be mounted on a substrate such as a ceramic substrate. Contacts may be formed on upper and lower surfaces of the substrate. The electrical component may be soldered to the contacts on the upper surface. The contacts on the lower surface may be used to solder the substrate to a printed circuit. During manufacturing, it may be desirable to use metal traces on a ceramic panel to make connections to contacts on the substrate. Following singulation of the ceramic panel to form the ceramic substrate, some of the metal traces may run to the edge of the ceramic substrate. A folded tab of the printed circuit may form a shield that covers these exposed traces. A divided metal-coated groove or a row of divided metal-coated vias running along each edge of the substrate may also provide shielding.
Abstract translation: 电气部件可以安装在诸如陶瓷基板的基板上。 可以在基板的上表面和下表面上形成接触。 电气部件可以焊接到上表面上的触点。 下表面上的触点可用于将基板焊接到印刷电路。 在制造过程中，可能需要在陶瓷板上使用金属迹线来连接到基板上的触点。 在陶瓷面板分层以形成陶瓷衬底之后，一些金属迹线可以流到陶瓷衬底的边缘。 印刷电路的折叠片可以形成覆盖这些暴露痕迹的屏蔽。 沿着衬底的每个边缘延伸的划分的金属涂覆的凹槽或一排划分的金属涂覆的通孔也可以提供屏蔽。
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公开(公告)号：US09445528B2
公开(公告)日：2016-09-13
申请号：US14323874
申请日：2014-07-03
Applicant: Apple Inc.
Inventor： Sawyer I. Cohen , David A. Pakula , Tseng-Mau Yang , Tyler B. Cater , Ashutosh Y. Shukla
CPC classification number: H05K7/20454 , F28F21/02 , F28F2013/006 , F28F2255/02 , G06F1/20 , H05K7/20481
Abstract: This application relates to efficiently distributing heat within a portable computing device. More specifically an apparatus for conducting heat between internal components of the portable computing device is disclosed. The apparatus, referred to as a thermal gap pad, is configured to bridge a variably sized gap between internal components. This is accomplished by wrapping a resilient core in a layer of highly thermally conductive material. The resilient core allows a shape of the thermal gap pad to vary in accordance with a size of the gap. A resilience of the thermal gap pad can be adjusted to account for an amount of variance in the gap. In some embodiments, an electrically conductive layer can be added to facilitate the passage of electrical current through the thermal gap pad.
Abstract translation: 本申请涉及在便携式计算设备内有效地分配热量。 更具体地，公开了一种用于在便携式计算设备的内部部件之间传导热量的装置。 被称为热间隙垫的装置构造成在内部部件之间桥接可变尺寸的间隙。 这通过将弹性芯包裹在高导热材料层中来实现。 弹性芯允许热间隙垫的形状根据间隙的大小而变化。 可以调节热间隙垫的弹性以考虑间隙中的变化量。 在一些实施例中，可以添加导电层以促进电流通过热间隙垫。
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公开(公告)号：US20160073194A1
公开(公告)日：2016-03-10
申请号：US14659319
申请日：2015-03-16
Applicant: APPLE INC.
Inventor： Martin J. Auclair , Jared M. Kole , Ashutosh Y. Shukla , Scott A. Myers , David A. Pakula , Marwan Rammah
CPC classification number: H04R1/023 , G06F1/1626 , G06F1/1656 , G06F1/1688 , G10K11/18 , H04R1/086 , H04R25/654 , H04R2499/11
Abstract: An acoustically permeable material is disposed within an aperture of an electronic device to provide aesthetic appeal for the electronic device and protection for an acoustic device mounted within the electronic device. A stiffener is used in conjunction with the acoustically permeable material to improve its ability to resist permanent mechanical deformation from external forces. In some embodiments the stiffener may have multiple cavities enabling improved isolation between multiple acoustic devices within the same aperture. Other methods of employing acoustically permeable materials are disclosed that improve the aesthetic appeal, acoustic performance and/or manufacturability of the electronic device.
Abstract translation: 声透性材料设置在电子设备的孔内，以为电子设备提供美观的吸引力，并且保护安装在电子设备内的声学设备。 加强筋与声透射材料结合使用，以提高其抗外力的永久性机械变形的能力。 在一些实施例中，加强件可以具有多个空腔，从而能够改善在同一孔内的多个声学装置之间的隔离。 公开了采用声透射材料的其它方法，其提高了电子设备的美学吸引力，声学性能和/或可制造性。
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