Abstract:
The disclosure described a substrate bias generating circuit in which an internal RAS (Row Address Strobe) signal and an internal CAS (Column Address Strobe) signal, both of which are synchronized with an external RAS signal and external CAS supplied from outside in addition to self-oscillator, activate circuits .[.comprising.]. .Iadd.including .Iaddend.capacitors and rectifying elements respectively so as to reduce wattage dissipation thereof during holding time of RAM and be obtained increased charge pump current during operation thereof.
Abstract:
A semiconductor memory device comprises a DRAM memory cell array comprising a plurality of dynamic type memory cells arranged in a plurality of rows and columns, and an SRAM memory cell array comprising static type memory cells arranged in a plurality of rows and columns. The DRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns. The SRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns, corresponding to the plurality of blocks in the DRAM memory cell array. The SRAM memory cell array is used as a cache memory. At the time of cache hit, data is accessed to the SRAM memory cell array. At the time of cache miss, data is accessed to the DRAM memory cell array. On this occasion, data corresponding to one row in each of the blocks in the DRAM memory cell array is transferred to one row in the corresponding block in the SRAM memory cell array.
Abstract:
A semiconductor memory device comprises two memory cell arrays (1a, 1b) in which a block divisional operation is performed. Two spare rows (2a, 2b) are provided corresponding to the two memory cell arrays (1a, 1b). Spare row decoders (5a, 5b) are provided for selecting the spare rows (2a, 2b), respectively. One spare row decoder selecting signal generation circuit (18) used in common by the spare row decoders (5a, 5b) is provided. The spare row decoder selecting signal generation circuit (18) can be previously set so as to generate a spare row decoder selecting signal (SRE) when a defective row exists in either of the memory cell arrays (1a, 1b) and the defective row is selected by row decoder groups (4a, 4b). Each of the spare row decoders (5a, 5b) is activated in response to the spare row decoder selecting signal (SRE) and a block control signal.
Abstract:
A semiconductor memory device comprises a plurality of memory array blocks (B1 to B4). In each of the plurality of memory array blocks (B1 to B4), a line mode test is performed. Results of the line mode tests performed in the memory array blocks (B1 to B4) are outputted to corresponding match lines (ML1 to ML4). A flag compress (30) performs a logic operation on the test results outputted to the plurality of match lines (ML1 to ML4) and outputs the operation results as test results for the plurality of memory array blocks (B1 to B4) to the outside.
Abstract:
In a memory cell array of a semiconductor memory device, a plurality of detection circuits (14, 15, 20) are provided in correspondence with a plurality of columns. An output line (L) is provided in common to the detection circuits (14, 15 20). The output line (L) is provided with plural junction points (n1 to nn) to which detection results from the detection circuits (14, 15 20) are separately applied. Dividing transistors (T1 to Tn) are provided between the junction points (n1 to nn). During testing, the word lines (WL1 to WLn) are selected sequentially. Test results for the memory cells (MC1 to MC4) connected to the selected word line are outputted at the corresponding junction points (n1 to nn), respectively. Simultaneously, a dividing transistor corresponding to the selected word line is rendered non-conductive, the remaining dividing transistors being rendered conductive. As a result, the output line (L) is divided into two parts at a portion of the non-conductive transistor. Detection results outputted to the respective divided parts of the output line (L) are monitored and a portion at which a detection result is changed in each divided part is found out.
Abstract:
In a memory cell array of a semiconductor memory device, a plurality of detection circuits (14, 15, 20) are provided in correspondence with a plurality of columns. An output line (L) is provided in common to the detection circuits (14, 15, 20). The output line (L) is provided with plural junction points (nl to nn) to which detection results from the detection circuits (14, 15, 20) are separately applied. Dividing transistors (Tl to Tn) are provided between the junction points (nl to nn). During testing, the work lines (WLl to WLn) are selected sequentially. Test results for the memory cells (MC1 to MC4 ) connected to the selected word line are outputted at the corresponding junction points (nl to nn), respectively. Simultaneously, a dividing transistor corresponding to the selected word line is rendered non-conductive, the remaining dividing transistors being rendered conductive. As a result, the output line (L) is divided into two parts at a portion of the non-conductive transistor. Detection results outputted to the respective divided parts of the output line (L) are monitored and a portion at which a detection result is changed in each divided part is found out.
Abstract:
An apparatus for parallel testing of a semiconductor memory with arbitrary data patterns and capable of being integrated on the memory chip. The semiconductor memory test device in a preferred embodiment is compatible with hierarchical data bus lines including an input/output line pair (I/O, I/O), a plurality of sub-input/output line pairs (SIO1SIO1; SIO2, SIO2) and a plurality of bit line pairs (BL1, BL1; BL6, BL6). A plurality of comparators (50) and a plurality of registers (60) are provided corresponding to a plurality of sub-input/output line pairs (SIO1, SIO2; SIO2, SIO2). The plurality of registers (50) which also functions as intermediated output amplifiers can hold random data applied through the input/output line pair (I/O, I/O). The plurality of comparators (60) is provided to determine whether or not data read out onto a plurality of sub-input/output line pairs (SIO1, SIO1; SIO2, SIO2) from a row of memory cells (MC1, MC2) corresponding to a single word line (WL) match respective data held in the plurality of registers (60).
Abstract:
A dynamic semiconductor memory device comprising a substrate having one trench including two capacitors for memory cell capacitances of two bits, and two elements such as transistors for reading, writing, and storing information represented by charge, arranged symmetrically at the central portion of the trench so as to correspond to the memory cells for two bits, and a field oxide film formed at the center of the trench on the bottom and on the side walls for separating the capacitors and elements.
Abstract:
An address decoding circuit for a functional block comprises branch portions serially connected with each other, in which a selecting signal is outputted on one of two output portions in accordance with the first bit information of an address signal when a selecting signal is applied to the first stage branch portion. The second stage output portion, to which the selecting signal is applied, outputs a selecting signal on one of two output portions in response to the second bit information of the address signal, in accordance with the selecting signal. Thereafter, each branch portion of the third to last stages outputs a selecting signal on one of two output portions in response to respective contents of the third bit to last bit of the address signal in accordance with the selecting signal applied from the preceding stage. By this selecting signal, a memory cell as a functional block portion is selected and is activated.
Abstract:
A word length variable circuit of a semiconductor memory comprises a shift register provided corresponding to rows or columns of a memory cell array. The input of the first stage of the shift register is connected to the output of the last stage and regions of the shift register is grouped to form a fixed recirculation path. The word length can be varied by modifying stored data in the shift register without changing its recirculation path.