公开(公告)号：US20050233548A1

公开(公告)日：2005-10-20

申请号：US10525007

申请日：2003-07-23

申请人： Kazuhisa Arai

发明人： Kazuhisa Arai

IPC分类号： H01L21/30 ,  H01L21/302 ,  H01L21/304 ,  H01L21/687

CPC分类号： H01L21/304 ,  H01L21/68714

摘要： A supporting substrate (10) having a flat supporting face is integrated with a semiconductor wafer W while supporting the surface thereof on the supporting face of the supporting substrate (10). The semiconductor wafer W integrated with the supporting substrate (10) is polished or etched on the back thereof using a thinning device and a film is formed on the back of the semiconductor wafer W integrated with the supporting substrate (10) using a film forming device (40). Since the semiconductor wafer W is integrated with the supporting substrate, even a semiconductor wafer as thin as 100 μm or less is not warped and thereby the film can be formed uniformly.

摘要翻译： 具有平坦支撑面的支撑基板（10）与半导体晶片W一体化，同时将支撑基板的表面支撑在支撑基板（10）的支撑面上。 与支撑基板（10）一体化的半导体晶片W使用变薄装置在其背面被抛光或蚀刻，并且使用成膜装置在与支撑基板（10）一体化的半导体晶片W的背面上形成膜 （40）。 由于半导体晶片W与支撑基板一体化，所以即使半导体晶片薄至100μm以下也不会发生翘曲，因此能够均匀地形成膜。

公开(公告)号：US20050221584A1

公开(公告)日：2005-10-06

申请号：US11092756

申请日：2005-03-30

申请人： Kazuhisa Arai

发明人： Kazuhisa Arai

IPC分类号： B24B7/22 ,  H01L21/02 ,  H01L21/301 ,  H01L21/304 ,  H01L21/306 ,  H01L21/46 ,  H01L21/58 ,  H01L21/68 ,  H01L21/78

CPC分类号： H01L21/02043 ,  B24B7/228 ,  B24B41/068 ,  H01L21/304 ,  H01L21/78

摘要： A wafer processing method capable of easily handling even a thinly formed wafer during the processing thereof is provided. An annular protective member is bonded to an outer circumferential excess region out of an outer surface of the wafer, on which devices are not formed, and a rear surface is ground with the outer surface left in the mentioned condition. Since the outer circumference of the wafer is reinforced with the annular protective member, the handling of the wafer becomes easy even after the wafer becomes thinner due to a grinding operation.

摘要翻译： 提供了在处理期间能够容易地处理薄的晶片的晶片处理方法。 环状的保护部件从外部未超过的晶片的外表面与外周的多余区域接合，并且在上述状态下，外表面被磨削而外表面残留。 由于晶片的外圆周被环形保护构件加固，所以即使在由于研磨操作使晶片变薄之后，晶片的处理变得容易。

公开(公告)号：US06594890B2

公开(公告)日：2003-07-22

申请号：US09928985

申请日：2001-08-15

申请人： Kazuhisa Arai ,  Toshiaki Takahashi ,  Kouichi Yajima

发明人： Kazuhisa Arai ,  Toshiaki Takahashi ,  Kouichi Yajima

IPC分类号： H05K336

CPC分类号： H01L21/67103 ,  B24B7/228 ,  B24B41/061 ,  H01L21/6838 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49815

摘要： A method of separating a plate-like workpiece held by adhesion on an elastic adhesive pad from the pad. The elastic adhesive pad has innumerable pores in its surface and generates adhesive force when negative pressure is produced by the pores, after being crushed, by restoration force generated by elasticity and adhesion. The method includes the step of heating the elastic adhesive pad at a predetermined temperature to separate the plate-like workpiece from the elastic adhesive pad by air expanding in the pores.

摘要翻译： 一种将由粘合剂保持的板状工件分离到弹性粘合剂垫上的方法。 弹性粘合垫在其表面上具有无数的孔，并且在通过弹性和粘合产生的恢复力被压碎后，由孔产生负压时产生粘附力。 该方法包括在预定温度下加热弹性粘合剂垫的步骤，以通过孔中的空气膨胀将板状工件与弹性粘合剂垫分离。

公开(公告)号：US06500047B2

公开(公告)日：2002-12-31

申请号：US09825892

申请日：2001-04-05

申请人： Kazuhisa Arai ,  Masaya Takeuchi ,  Hideyuki Sando

发明人： Kazuhisa Arai ,  Masaya Takeuchi ,  Hideyuki Sando

IPC分类号： B24B4900

CPC分类号： B28D5/0094 ,  B23D59/002 ,  B28D5/023

摘要： A cutting machine comprises a chucking means for holding the semiconductor wafer that is to be cut, a cutting means for cutting the semiconductor wafer held on the chucking means, a first moving means for moving the chucking means relative to the cutting means in a moving direction perpendicular to the center axis of the chucking means, and a second moving means for moving the cutting means relative to the chucking means in a direction of depth of cutting which is the direction of center axis of the chucking means. The cutting machine further comprises a thickness detecting means for detecting the thickness of the workpiece held on the chucking means, and a control means for controlling the motion of the second moving means depending upon the thickness of the workpiece detected by the thickness detecting means and for setting the position of the cutting means in the direction of depth of cutting relative to the chucking means thereby to set the depth of cutting the workpiece by the cutting means. The thickness detecting means includes a non-contact back-pressure sensor having a nozzle for flowing out a gas toward the surface of the workpiece held on the chucking means.

摘要翻译： 切割机包括用于保持要切割的半导体晶片的夹持装置，用于切割保持在夹持装置上的半导体晶片的切割装置，用于沿着移动方向相对于切割装置移动夹持装置的第一移动装置 垂直于夹紧装置的中心轴线的第二移动装置;以及用于相对于夹紧装置沿切割深度方向（即夹紧装置的中心轴线方向）移动切割装置的第二移动装置。 切割机还包括用于检测保持在夹持装置上的工件的厚度的厚度检测装置，以及用于根据由厚度检测装置检测到的工件的厚度来控制第二移动装置的运动的控制装置， 设定切割装置相对于夹紧装置的切割深度方向的位置，由此设定通过切割装置切割工件的深度。 厚度检测装置包括非接触式背压传感器，其具有用于将气体朝向保持在夹持装置上的工件的表面流出的喷嘴。

公开(公告)号：US06358132B1

公开(公告)日：2002-03-19

申请号：US09551203

申请日：2000-04-17

申请人： Kazuhisa Arai ,  Toru Takazawa

发明人： Kazuhisa Arai ,  Toru Takazawa

IPC分类号： B24B2116

CPC分类号： B24B11/02 ,  B23Q7/035 ,  B23Q7/08 ,  B23Q7/106 ,  B23Q7/16 ,  B24B21/02 ,  B24B41/005 ,  H01L21/67092

摘要： Disclosed is an apparatus for grinding spherical objects into an exact spherical shape. The sphere-reshaping apparatus comprises a grinding section equipped with means for grinding spherical objects, an inlet section equipped with means for feeding spherical objects to the grinding section and an outlet section equipped with means for taking out reshaped spherical objects from the grinding section. The inlet section, grinding section and outlet section communicate by transporting means. The transporting means comprises an endless carrier belt having a series of apertures made for accepting spherical objects and a drive for driving the endless carrier belt. In the grinding section an endless grinding belt runs parallel with the endless carrier belt in same or counter direction relative to the endless carrier belt at such a speed that causes spherical objects to rub on the grinding belt. A randomizer moves back and forth across the carrier and grinding belts to sandwich spherical objects between the randomizer and the grinding belt, thereby assuring deviation-free grinding of spherical objects.

摘要翻译： 公开了一种用于将球形物体研磨成精确球形的装置。 球形整形装置包括配备有用于研磨球形物体的装置的研磨部分，具有用于将球形物体馈送到研磨部分的装置的入口部分和装备有用于从研磨部分取出重新定形的球形物体的装置的出口部分。 入口部分，研磨部分和出口部分通过输送装置进行连通。 传送装置包括具有一系列用于接收球形物体的孔的环形传送带和用于驱动环形传送带的驱动器。 在研磨部分中，环形研磨带以相对于环形传送带的相同或相反方向平行于环形传送带延伸，使得球形物体在研磨带上摩擦。 随机化器在载体和研磨带之间来回移动以将球形物体夹在随机化器和研磨带之间，从而确保球形物体的无偏磨削。

公开(公告)号：US07727810B2

公开(公告)日：2010-06-01

申请号：US11490243

申请日：2006-07-21

申请人： Kazuhisa Arai ,  Masatoshi Nanjo

发明人： Kazuhisa Arai ,  Masatoshi Nanjo

IPC分类号： H01L21/00

CPC分类号： H01L21/67092

摘要： A method of dividing a wafer having a plurality of areas, which are sectioned by the streets formed on the front surface in a lattice pattern and a plurality of devices, which are formed in the sectioned areas, along streets, the method comprising a first cutting step for holding the front surface of the wafer on a chuck table of a cutting machine and forming a first groove having a depth that is about half of the thickness of the wafer, along the streets from the rear surface of the wafer; a second cutting step for holding the rear surface of the wafer on a chuck table and forming a second groove which does not reach the first groove, along the streets from the front surface of the wafer; and a dividing step for breaking an uncut portion between the first groove and the second groove by exerting external force along the streets of the wafer, on which the first grooves and the second grooves have been formed.

摘要翻译： 一种分割具有多个区域的方法，所述方法包括以街道形式形成在所述分割区域中的格栅图案和形成在所述前表面上的所述街道划分的多个区域，所述方法包括：第一切割 用于将晶片的前表面保持在切割机的卡盘台上，并沿着街道从晶片的后表面形成深度为晶片厚度的大约一半的第一凹槽; 第二切割步骤，用于将所述晶片的后表面保持在卡盘台上，并且从所述晶片的前表面沿着所述街道形成不到达所述第一凹槽的第二凹槽; 以及分割步骤，通过沿着已经形成有第一凹槽和第二凹槽的晶片的街道施加外力来破坏第一凹槽和第二凹槽之间的未切割部分。

公开(公告)号：US20090280722A1

公开(公告)日：2009-11-12

申请号：US12422674

申请日：2009-04-13

申请人： Kazuhisa Arai

发明人： Kazuhisa Arai

IPC分类号： B24B1/00 ,  B24B7/00

CPC分类号： B24B1/00 ,  B24B7/228 ,  B24B37/04

摘要： A grinding machine is provided which includes a holding table adapted to hold a workpiece; a grinding unit operative to grind the workpiece held on the holding piece; and a grinding unit transfer mechanism operative to shift the grinding unit in a direction coming close to or moving away from the workpiece. The grinding unit includes a porous pad having a large number of fine pores opposed to the workpiece held on the holding table, a gel-like slurry storing portion provided on the porous pad so as to store gel-like slurry therein, and a water supply unit operative to supply water between the porous pad and the workpiece. The porous pad contains superabrasives at least at an outer circumferential portion, and the fine pores of the porous pad each have a diameter greater than that of each of the superabrasives contained in the gel-like slurry.

摘要翻译： 提供一种研磨机，其包括适于保持工件的保持台; 磨削单元，其可操作以研磨保持在所述保持件上的所述工件; 以及磨削单元传送机构，其可操作以在接近或远离工件的方向上移动研磨单元。 研磨单元包括具有与保持在保持台上的工件相对的大量细孔的多孔垫，设置在多孔垫上以便在其中储存凝胶状浆料的凝胶状浆料储存部分，以及供水 单元可操作以在多孔垫和工件之间供水。 多孔垫至少在外周部分包含超级磨料，多孔垫的细孔的直径大于凝胶状浆料中所含的每种超级磨料的直径。

公开(公告)号：US20090233419A1

公开(公告)日：2009-09-17

申请号：US12396995

申请日：2009-03-03

申请人： Kazuhisa Arai

发明人： Kazuhisa Arai

IPC分类号： H01L21/302

CPC分类号： H01L33/0079 ,  H01L33/0095 ,  H01L33/64 ,  H01L2933/0075 ,  H01S5/0201

摘要： An optical device manufacturing method including the steps of: forming a groove with a depth corresponding to a finish thickness of the heat sink in a heat sink material at a position corresponding to an associated one of the streets sectioning the plurality of optical devices; joining the optical device layer of the optical device wafer to the heat sink material via a joining metal layer; cutting and dividing the optical device wafer along the streets into individual optical devices; sticking a protection member to the rear surface of the substrate of the optical device wafer; and grinding the rear surface of the heat sink material to expose the grooves to the rear surface to thereby divide the heat sink material into heat sinks corresponding to associated individual optical devices.

摘要翻译： 一种光学器件制造方法，包括以下步骤：在对应于划分多个光学器件的相关联的一个街道的位置处，在散热材料中形成具有与散热器的精加工厚度相对应的深度的凹槽; 通过接合金属层将光学器件晶片的光学器件层连接到散热材料; 沿着街道将光学器件晶片切割并分割成单独的光学器件; 将保护构件粘附到光学器件晶片的衬底的后表面; 并且研磨散热材料的后表面以将凹槽暴露于后表面，从而将散热材料划分成对应于相关联的单个光学器件的散热器。

公开(公告)号：US07278206B2

公开(公告)日：2007-10-09

申请号：US10529146

申请日：2003-08-20

申请人： Kazuhisa Arai ,  Hideyuki Sando

发明人： Kazuhisa Arai ,  Hideyuki Sando

IPC分类号： H01R9/00

CPC分类号： H01L23/49816 ,  H01L2224/16 ,  H01L2924/15311 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T82/10

摘要： A terminal board having a plurality of terminals on which ball electrodes are formed can be prepared efficiently and economically without having any short-circuiting between terminals when its terminals formed in very close proximity to one another, as on an interposer (1), have their heads made uniform in height by causing the terminals (4) to project from a surface of a board (2) coated with a resist film, and applying a cutting tool (19) to the surface of the board (2) having the terminals project therefrom to carry out lathe turning for the heads of the terminals (4), while having the terminal board held by a rotatable chuck table (17) and rotating the chuck table (17).

摘要翻译： 具有多个终端的端子板，其上形成有球形电极的多个端子可以有效地和经济地准备，而不会在端子彼此非常接近地形成在端子之间的任何短路的情况下，如在插入件（1）上， 通过使端子（4）从涂覆有抗蚀剂膜的板（2）的表面突出而将高度均匀的头部，并将切割工具（19）施加到具有端子工程的板（2）的表面 同时使端子板由可旋转卡盘台（17）保持并旋转卡盘台（17），从而为端子（4）的头部进行车床车削。

公开(公告)号：US20070057378A1

公开(公告)日：2007-03-15

申请号：US11519321

申请日：2006-09-12

申请人： Kazuhisa Arai ,  Masaru Nakamura

发明人： Kazuhisa Arai ,  Masaru Nakamura

IPC分类号： H01L23/52

CPC分类号： H01L21/6835 ,  B23K26/40 ,  B23K26/50 ,  B23K26/53 ,  B23K2103/50 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512

摘要： On the back surface of the chip of which a front surface is formed with an electronic circuit, an adhesive film of a shape and dimensions corresponding to at least the back surface of the chip is adhered to obtain the semiconductor chip with the entire back surface covered with the adhesive film. Such a semiconductor chip is obtained by forming a division groove in the front surface of a semiconductor wafer to be divided into plural chips, grinding a back surface of the wafer until the division groove appears to divide the wafer into plural chips, adhering the adhesive film and a dicing tape on the entire back surface of the wafer, and stretching the dicing tape to cut the adhesive film along the division groove.

摘要翻译： 在其表面形成有电子电路的芯片的背面上，粘附至少​​与芯片的背面对应的形状和尺寸的粘合剂膜，以获得整个背面覆盖的半导体芯片 与粘合膜。 这样的半导体芯片通过在半导体晶片的前表面形成分割槽而形成分割槽，从而分割成多个芯片，研磨晶片的背面，直到划分凹槽出现将晶片分成多个芯片， 以及在晶片的整个后表面上的切割胶带，并且拉伸切割带以沿着分割槽切割粘合剂膜。