公开(公告)号：US07278206B2

公开(公告)日：2007-10-09

申请号：US10529146

申请日：2003-08-20

申请人： Kazuhisa Arai ,  Hideyuki Sando

发明人： Kazuhisa Arai ,  Hideyuki Sando

IPC分类号： H01R9/00

CPC分类号： H01L23/49816 ,  H01L2224/16 ,  H01L2924/15311 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T82/10

摘要： A terminal board having a plurality of terminals on which ball electrodes are formed can be prepared efficiently and economically without having any short-circuiting between terminals when its terminals formed in very close proximity to one another, as on an interposer (1), have their heads made uniform in height by causing the terminals (4) to project from a surface of a board (2) coated with a resist film, and applying a cutting tool (19) to the surface of the board (2) having the terminals project therefrom to carry out lathe turning for the heads of the terminals (4), while having the terminal board held by a rotatable chuck table (17) and rotating the chuck table (17).

摘要翻译： 具有多个终端的端子板，其上形成有球形电极的多个端子可以有效地和经济地准备，而不会在端子彼此非常接近地形成在端子之间的任何短路的情况下，如在插入件（1）上， 通过使端子（4）从涂覆有抗蚀剂膜的板（2）的表面突出而将高度均匀的头部，并将切割工具（19）施加到具有端子工程的板（2）的表面 同时使端子板由可旋转卡盘台（17）保持并旋转卡盘台（17），从而为端子（4）的头部进行车床车削。

公开(公告)号：US06676491B2

公开(公告)日：2004-01-13

申请号：US10177111

申请日：2002-06-24

申请人： Kazuhisa Arai ,  Masaya Takeuchi ,  Hiromi Hayashi ,  Hideyuki Sando

发明人： Kazuhisa Arai ,  Masaya Takeuchi ,  Hiromi Hayashi ,  Hideyuki Sando

IPC分类号： B24B4900

CPC分类号： H01L21/3043 ,  B24B7/228 ,  B24B49/12 ,  H01L21/78

摘要： A semiconductor wafer dividing method for dividing a semiconductor wafer, in which a plurality of rectangular regions are demarcated by streets arranged in a lattice pattern on the face of the semiconductor wafer, and a semiconductor circuit is disposed in each of the rectangular regions, into the individual rectangular regions. This method includes a groove cutting step of cutting the face of the semiconductor wafer along the streets to form grooves along the streets on the face of the semiconductor wafer, and a back grinding step of grinding the back of the semiconductor wafer to reduce the thickness of the semiconductor wafer to not more than the depth of the grooves, thereby dividing the semiconductor wafer along the streets. This method further includes, before the back grinding step, a groove depth measuring step of measuring the depth of the grooves. In the back grinding step, rough grinding is performed until the thickness of the semiconductor wafer becomes greater than the depth of the grooves by a predetermined value, and then precision grinding is performed until the thickness of the semiconductor wafer becomes not more than the depth of the grooves.

摘要翻译： 一种半导体晶片分割方法，其中通过在半导体晶片的表面上以格子状布置的街道划分多个矩形区域，并且将半导体电路分布在每个矩形区域中， 单个矩形区域。 该方法包括：切割步骤，沿着街道切割半导体晶片的表面，沿着半导体晶片的表面上的街道形成凹槽;以及后研磨步骤，研磨半导体晶片的背面以减小半导体晶片的厚度 半导体晶片不超过凹槽的深度，从而沿着街道划分半导体晶片。 该方法还包括在后磨削步骤之前，测量槽深度的槽深度测量步骤。 在背面研磨工序中，进行粗磨，直到半导体晶片的厚度大于槽深度预定值，然后进行精密研磨，直到半导体晶片的厚度变得不大于 凹槽。

公开(公告)号：US06500047B2

公开(公告)日：2002-12-31

申请号：US09825892

申请日：2001-04-05

申请人： Kazuhisa Arai ,  Masaya Takeuchi ,  Hideyuki Sando

发明人： Kazuhisa Arai ,  Masaya Takeuchi ,  Hideyuki Sando

IPC分类号： B24B4900

CPC分类号： B28D5/0094 ,  B23D59/002 ,  B28D5/023

摘要： A cutting machine comprises a chucking means for holding the semiconductor wafer that is to be cut, a cutting means for cutting the semiconductor wafer held on the chucking means, a first moving means for moving the chucking means relative to the cutting means in a moving direction perpendicular to the center axis of the chucking means, and a second moving means for moving the cutting means relative to the chucking means in a direction of depth of cutting which is the direction of center axis of the chucking means. The cutting machine further comprises a thickness detecting means for detecting the thickness of the workpiece held on the chucking means, and a control means for controlling the motion of the second moving means depending upon the thickness of the workpiece detected by the thickness detecting means and for setting the position of the cutting means in the direction of depth of cutting relative to the chucking means thereby to set the depth of cutting the workpiece by the cutting means. The thickness detecting means includes a non-contact back-pressure sensor having a nozzle for flowing out a gas toward the surface of the workpiece held on the chucking means.

摘要翻译： 切割机包括用于保持要切割的半导体晶片的夹持装置，用于切割保持在夹持装置上的半导体晶片的切割装置，用于沿着移动方向相对于切割装置移动夹持装置的第一移动装置 垂直于夹紧装置的中心轴线的第二移动装置;以及用于相对于夹紧装置沿切割深度方向（即夹紧装置的中心轴线方向）移动切割装置的第二移动装置。 切割机还包括用于检测保持在夹持装置上的工件的厚度的厚度检测装置，以及用于根据由厚度检测装置检测到的工件的厚度来控制第二移动装置的运动的控制装置， 设定切割装置相对于夹紧装置的切割深度方向的位置，由此设定通过切割装置切割工件的深度。 厚度检测装置包括非接触式背压传感器，其具有用于将气体朝向保持在夹持装置上的工件的表面流出的喷嘴。

公开(公告)号：US20060288826A1

公开(公告)日：2006-12-28

申请号：US10529146

申请日：2003-08-20

申请人： Kazuhisa Arai ,  Hideyuki Sando

发明人： Kazuhisa Arai ,  Hideyuki Sando

IPC分类号： B23B3/00

CPC分类号： H01L23/49816 ,  H01L2224/16 ,  H01L2924/15311 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T82/10

摘要： A terminal board having a plurality of terminals on which ball electrodes are formed can be prepared efficiently and economically without having any short-circuiting between terminals when its terminals formed in very close proximity to one another, as on an interposer (1), are made their heads uniform in height by causing the terminals (4) to project from surface of a board (2) coated with a resist film, and applying a cutting tool (19) to the surface of the board (2) having the terminals project therefrom to carry out lathe turning for heads of the terminals (4), while having the terminal board held by a rotatable chuck table (17) and rotating the chuck table (17).

摘要翻译： 具有形成球形电极的多个端子的端子板可以有效且经济地制备，而不会在端子彼此非常接近地形成端子时在端子之间发生任何短路，如在插入件（1）上那样 它们的头部通过使端子（4）从涂覆有抗蚀剂膜的板（2）的表面突出而高度均匀，并将切割工具（19）施加到具有突出端子的板（2）的表面 在端子板通过可旋转卡盘台（17）保持并旋转卡盘台（17）的同时，对端子（4）的头部进行车床转动。