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241.发明申请公开(公告)号：US20210184050A1
公开(公告)日：2021-06-17
申请号：US16344018
申请日：2018-11-19
Inventor： Lisheng LI , Peng HE , Yuan YAN
IPC: H01L29/786 , H01L29/66 , H01L29/10 , H01L21/02
Abstract: A low temperature polysilicon layer, a thin film transistor, and a method for manufacturing same are provided. The low temperature polysilicon layer includes a substrate, at least one buffer layer, and a polysilicon layer. The polysilicon layer is disposed on the at least one buffer layer. The polysilicon layer includes a channel region, two low doped regions disposed on two sides of the channel region, and two high doped regions disposed on an outer side of the low doped regions. Thicknesses of an edge of the channel region and at least one portion of the low doped regions are less than a thickness of another position of the polysilicon layer.
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公开(公告)号：US20210181556A1
公开(公告)日：2021-06-17
申请号：US16306587
申请日：2018-08-10
Inventor： Juncheng XIAO , Chao TIAN
IPC: G02F1/1333 , G06F3/041 , G02F1/1368 , H01L27/12 , G02F1/1343 , G02F1/1362
Abstract: The invention provides an array substrate, a manufacturing method thereof and a display panel. The array substrate includes a substrate, a buffer layer, an active layer, a first insulating layer, a gate electrode, a second insulating layer, a touch signal line, a source and drain electrode, a touch signal line, a source and drain electrode, a first electrode, a planarization layer, and a second electrode. The first electrode and the second electrode are respectively connected to one of the drain electrode and the touch signal line. Thus, photomask processes can be reduced, and production cycle can be shortened.
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公开(公告)号：US11039539B2
公开(公告)日：2021-06-15
申请号：US16393981
申请日：2019-04-25
Inventor： Juan Chen
Abstract: A manufacturing method for flexible printed circuit board is provided, in which a flexible insulating material and a metal material are liquefied and the liquefied materials are coated and solidified to form a flexible insulating layer and an anti-EMI layer of an anti-EMI structure, respectively. As such, an adhesive layer can be eliminated and the thickness of the flexible insulating layer and the anti-EMI layer can be reduced and an amount of materials consumed is also reduced, resulting in reduction of production cost, reduction of thickness of the flexible printed circuit board with anti-EMI structure, and improved quality.
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公开(公告)号：US11036102B1
公开(公告)日：2021-06-15
申请号：US16649729
申请日：2019-12-30
Inventor： Xing Xiong , Wei Tang
IPC: G02F1/1362 , G02F1/1368 , G02F1/1339 , G02F1/1337
Abstract: A liquid crystal display panel includes a blind hole area, which includes a blind hole light transmission region and a blind hole periphery region surrounding the blind hole light transmission region. A first transparent support is disposed on a color filter substrate in the blind hole light transmission region, and the first transparent support is configured to support the color filter substrate and a thin film transistor array substrate in the blind hole light transmission region. A black matrix is disposed on the color filter substrate in the blind hole periphery region, and a plurality of second transparent supports are disposed corresponding to the black matrix. A problem with optical uniformity of a display panel can be resolved by the first transparent support located in the blind hole light transmission region.
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公开(公告)号：US11018165B2
公开(公告)日：2021-05-25
申请号：US16641663
申请日：2019-11-06
Abstract: A manufacturing method of an array substrate and the array substrate are provided. The method comprises: forming an active layer on a substrate; forming an insulation layer on the active layer; forming a first metal layer on the insulation layer; forming an interlayer dielectric layer and a pixel electrode layer on the first metal layer by a same mask; forming a second metal layer on the interlayer dielectric layer, wherein the second metal layer comprises a source electrode, a drain electrode, and a touch signal line; and forming a patterned protective layer and a patterned common electrode layer on the second metal layer.
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Patent Agency Ranking
公开(公告)号：US11016339B2
公开(公告)日：2021-05-25
申请号：US16753777
申请日：2019-12-20
Inventor： Fubao Jin
IPC: G02F1/13357 , G02F1/1335
Abstract: The present disclosure provides a backlight module and an in-vehicle display device. The backlight module includes a back plate, a light board, a diffusion plate, and a bracket layer. The bracket layer is arranged between the light board and the diffusion plate. The bracket layer is used to support the diffusion plate and spaces the light board apart from the diffusion plate to form a light mixture space. By adjusting a height of the bracket layer, it is convenient to adjust a distance of the light mixture space formed between the diffusion plate and the light board. Accordingly, backlight display performance of the backlight module and the in-vehicle display device is improved.
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公开(公告)号：US11009981B2
公开(公告)日：2021-05-18
申请号：US16301735
申请日：2018-09-22
Inventor： Yaoli Huang , Xinglong He
Abstract: Provided is a driving method of a touch display panel. The driving method of the touch display panel drives the touch display panel with an indentation design. Common voltages are inputted to touch electrodes, and a common voltage inputted to the touch electrode with a larger area is smaller than a common voltage inputted to the touch electrode with a small area. Or, common voltages are inputted to the touch electrodes and data voltages are inputted to pixel electrodes, so that the data voltages of the pixel electrodes corresponding to the touch electrodes with the same area are the same when an area corresponding to pixel electrodes of the touch display panel displays an image with a same gray scale, a common voltage inputted to the touch electrode with a larger area is smaller than a common voltage inputted to the touch electrode with a small area.
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公开(公告)号：US11006518B2
公开(公告)日：2021-05-11
申请号：US16097620
申请日：2018-09-12
Inventor： Zhenzhou Xing
Abstract: A panel driving structure, a flip-chip flexible film for driving a panel, and a reinforcement method for flip-chip flexible film are provided. The panel driving structure includes a flip-chip flexible film, a panel, and a main circuit board; wherein one end of the flip-chip flexible film is connected to the panel, and the other end of the flip-chip flexible film is connected to the main circuit board through a connector; and wherein the flip chip flexible film is provided with a reinforcement structure for increasing a carrying capacity. The present invention can improve the production efficiency and yield, and reducing the cost at the same time. Combining the flip-chip flexible film with the FPC, a reinforcement thickness and a reinforcement area of the flip-chip flexible film can be adjusted during the manufacturing process, which is adapt to the requirement of a variety of products.
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249.发明授权公开(公告)号：US11004957B2
公开(公告)日：2021-05-11
申请号：US15540543
申请日：2017-05-23
Inventor： Bo Liang
IPC: H01L29/66 , H01L27/12 , H01L29/786 , H01L21/308 , H01L29/423 , H01L21/3065 , H01L27/32
Abstract: The present disclosure relates to a manufacturing method of inorganic thin film transistors (TFTs), including: forming a p-type semiconductor layer and a n-type semiconductor layer on a hard substrate in sequence, forming a slot on the p-type semiconductor layer, wherein the slot passes through the n-type semiconductor layer, forming a source and a drain on the n-type semiconductor layer, wherein the source and the drain are respectively configured on two sides of the slot, performing a flip-transferring process to transfer the p-type semiconductor layer, the n-type semiconductor layer, the source, and the drain on a flexible substrate, forming a gate insulation layer and a gate on the p-type semiconductor layer in sequence, forming a flat layer on the gate insulation layer, wherein the flat layer covers the gate. The inorganic TFT is designed to obtain a narrow channel inorganic TFT device, to reduce process requirements, and to reduce costs.
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公开(公告)号：US11003002B1
公开(公告)日：2021-05-11
申请号：US16981936
申请日：2020-06-23
Inventor： Bingkun Yin , Changchih Huang
IPC: G02F1/1333 , G02F1/1335
Abstract: A display substrate, a display panel, and a display device are provided. The display substrate of the present invention can realize an integration of an optical film and optical path system of an original backlight module onto the display substrate by adding a first functional layer, a second functional layer, and a first polarizing layer. The display device uses the display substrate described in the present invention and adds an optical layer on the display substrate, so that the display device or a display apparatus can be thinned and lightened, and a reliability of a light source module can be improved.
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