公开(公告)号：US10356910B2

公开(公告)日：2019-07-16

申请号：US15128105

申请日：2016-06-23

Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.

Inventor： Juan Chen

IPC: H05K3/10 ,  H05K3/00 ,  H05K1/02 ,  H05K1/09 ,  H05K9/00

Abstract: The invention provides a manufacturing method for flexible printed circuit board, by liquefying the flexible insulating material and the metal material, coating the liquefied materials and solidifying the coated layers to form respectively the flexible insulating layer and the anti-EMI layer of the anti-EMI structure. As such, an adhesive layer is eliminated to achieve reducing the thickness of the flexible insulating layer and the anti-EMI layer and the material consumption, resulting in reduced production cost, reduced thickness of the flexible printed circuit board with anti-EMI structure, and improved quality.

公开(公告)号：US20180177056A1

公开(公告)日：2018-06-21

申请号：US15128105

申请日：2016-06-23

Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.

Inventor： Juan Chen

IPC: H05K3/10 ,  H05K3/00 ,  H05K1/02 ,  H05K1/09 ,  H05K9/00

CPC classification number: H05K3/10 ,  H05K1/0218 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/0011 ,  H05K3/28 ,  H05K9/0084 ,  H05K2201/0145 ,  H05K2201/0191 ,  H05K2203/0139 ,  H05K2203/0759 ,  H05K2203/128

Abstract: The invention provides a manufacturing method for flexible printed circuit board, by liquefying the flexible insulating material and the metal material, coating the liquefied materials and solidifying the coated layers to form respectively the flexible insulating layer and the anti-EMI layer of the anti-EMI structure. As such, an adhesive layer is eliminated to achieve reducing the thickness of the flexible insulating layer and the anti-EMI layer and the material consumption, resulting in reduced production cost, reduced thickness of the flexible printed circuit board with anti-EMI structure, and improved quality.

公开(公告)号：US11039539B2

公开(公告)日：2021-06-15

申请号：US16393981

申请日：2019-04-25

Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.

Inventor： Juan Chen

IPC: H05K3/10 ,  H05K3/00 ,  H05K3/28 ,  H05K1/02 ,  H05K1/09 ,  H05K9/00 ,  H05K1/03

Abstract: A manufacturing method for flexible printed circuit board is provided, in which a flexible insulating material and a metal material are liquefied and the liquefied materials are coated and solidified to form a flexible insulating layer and an anti-EMI layer of an anti-EMI structure, respectively. As such, an adhesive layer can be eliminated and the thickness of the flexible insulating layer and the anti-EMI layer can be reduced and an amount of materials consumed is also reduced, resulting in reduction of production cost, reduction of thickness of the flexible printed circuit board with anti-EMI structure, and improved quality.

公开(公告)号：US20190254170A1

公开(公告)日：2019-08-15

申请号：US16393981

申请日：2019-04-25

Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.

Inventor： Juan Chen

IPC: H05K3/10 ,  H05K3/00 ,  H05K9/00 ,  H05K1/02 ,  H05K1/09

CPC classification number: H05K3/10 ,  H05K1/0218 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/00 ,  H05K3/0011 ,  H05K3/28 ,  H05K9/0084 ,  H05K2201/0145 ,  H05K2201/0191 ,  H05K2203/0139 ,  H05K2203/0759 ,  H05K2203/128

Abstract: A manufacturing method for flexible printed circuit board is provided, in which a flexible insulating material and a metal material are liquefied and the liquefied materials are coated and solidified to form a flexible insulating layer and an anti-EMI layer of an anti-EMI structure, respectively. As such, an adhesive layer can be eliminated and the thickness of the flexible insulating layer and the anti-EMI layer can be reduced and an amount of materials consumed is also reduced, resulting in reduction of production cost, reduction of thickness of the flexible printed circuit board with anti-EMI structure, and improved quality.