公开(公告)号：US3602634A

公开(公告)日：1971-08-31

申请号：US3602634D

申请日：1970-03-23

Applicant: FAIRCHILD CAMERA INSTR CO

Inventor： MEULI WILLIAM P

IPC: H01L21/50 ,  H01L23/10 ,  H01L1/02

CPC classification number: H01L23/10 ,  H01L21/50 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

Abstract: A semiconductor package contains a cover with a flange around that portion of the edge in contact with the bottom of the package. The flange makes an acute angle with the package bottom. Bonding material placed between the flange and the package bottom, when melted, is drawn by capillary action along facing surfaces of the flange and package bottom thereby to form a solid bond between the cover and the bottom.

公开(公告)号：US3581163A

公开(公告)日：1971-05-25

申请号：US3581163D

申请日：1968-04-09

Applicant: GEN ELECTRIC

Inventor： ERIKSSON LARS O

IPC: H01L23/051 ,  H01L23/31 ,  H01L1/02 ,  H01L1/14

CPC classification number: H01L23/051 ,  H01L23/3157 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

Abstract: The thermal cycling capability of a high-current semiconductor device is significantly increased by disposed a tungsten strain buffer in compression between a terminal of the device housing and an external pressure applying thrust member.

公开(公告)号：US3499988A

公开(公告)日：1970-03-10

申请号：US3499988D

申请日：1966-09-30

Applicant: SANYO ELECTRIC CO

Inventor： WATANABE KAZUO ,  TANMATSU KATSUO

IPC: H03F3/183 ,  H04R1/06 ,  H01L1/02 ,  H04R9/06

CPC classification number: H04R1/06 ,  H03F3/183

公开(公告)号：US5498079A

公开(公告)日：1996-03-12

申请号：US363249

申请日：1994-12-23

Applicant: Timothy D. Price

Inventor： Timothy D. Price

IPC: G01K7/00 ,  G01K3/00 ,  G01K7/16 ,  G01K1/00 ,  H01L1/02

CPC classification number: G01K7/16 ,  G01K3/005

Abstract: A temperature transmitter includes a temperature probe, such as an RTD or thermocouple, and a transmitter housing. Electrical circuitry in the transmitter housing is adapted for coupling to the temperature probe and providing an output related to a sensed temperature. The temperature housing has a first side for coupling to the temperature probe and a second side which carried a plurality of electrical connections electrically connected to the circuitry carried in the transmitter housing. An elongated recess on an outer surface of the first side of the transmitter housing channels electrical wiring which connects to the temperature probe in a direction away from the temperature probe and toward the electrical connections carried on the second side of the transmitter housing.

Abstract translation: 温度变送器包括温度探头，例如RTD或热电偶，以及变送器外壳。 变送器壳体中的电路适于耦合到温度探头并提供与感测温度相关的输出。 温度壳体具有用于耦合到温度探针的第一侧和承载多个电连接到在变送器壳体中承载的电路的电连接的第二侧。 在变送器壳体的第一侧的外表面上的细长凹槽通过电线，该电线在远离温度探头的方向上连接温度探头，并朝向在变送器外壳的第二侧承载的电气连接。

公开(公告)号：US4419714A

公开(公告)日：1983-12-06

申请号：US364819

申请日：1982-04-02

Applicant: Charles H. Locke

Inventor： Charles H. Locke

IPC: H01G4/232 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H01G4/34 ,  H01G13/00 ,  H01L1/02

CPC classification number: H01G4/385 ,  H01G4/30 ,  Y10T29/435

Abstract: Described is an improved common faced terminated multi-layer ceramic capacitor structure capable of embodying multiple capacitors of various maximum voltage and capacitance rating and method for its making. The structure features a ceramic body including multiple sections having a dielectric element and companion plate of one or more types, the types defined by the number and placement on the plate of plate tabs. The sections are aligned in the body such that the plates are located at displaced intervals in the direction of the body length while the plate tabs are located at displaced intervals in the direction of the body width and exposed at a common body face. Buses interconnect the tabs and plate in groups at common face. By selectively connecting the buses, one or more capacitors may be formed in the body. A structure is improved by providing grooves in the common face to align tabs in groups and to maintain the groups separated with the effect that the maximum voltage the structure can withstand is not reduced to mis-alignment of tabs during formation of the body. The method features steps for grooving the common face and simultaneously aligning tabs in the body.

Abstract translation: 描述了一种改进的共面端接多层陶瓷电容器结构，其能够体现各种最大电压和电容额定值的多个电容器及其制造方法。 该结构具有陶瓷体，该陶瓷体包括具有一个或多个类型的电介质元件和伴随板的多个部分，其类型由板片的板上的数量和位置限定。 这些部分在主体中对准，使得板沿主体长度的方向以移动的间隔定位，同时板突片位于沿着身体宽度的方向上移动的间隔并且暴露在共同的身体表面。 公共汽车将公共面上的标签和板块组合在一起。 通过选择性地连接总线，可以在主体中形成一个或多个电容器。 通过在公共面中设置凹槽来改进结构，并且保持基体分离，使结构能够承受的最大电压不会在形成身体期间减小到突片的不对准。 该方法具有用于切割公共面并同时对准身体中的突片的步骤。

公开(公告)号：US3648121A

公开(公告)日：1972-03-07

申请号：US3648121D

申请日：1968-07-03

Applicant: TOKYO SHIBAURA ELECTRIC CO

Inventor： SUENAGA MASANOBU ,  MACHII TETSUO ,  SAWANO TAKSHIRO ,  KOBAYASHI TAKEHIKO ,  DENGO TADAO ,  NAKAI TETSUZO

IPC: H01L21/56 ,  H01L21/78 ,  H01L23/051 ,  H01L23/31 ,  H01L23/48 ,  H01L25/03 ,  H01L29/00 ,  H02K11/04 ,  H01L1/02

CPC classification number: H02K11/046 ,  H01L21/56 ,  H01L21/78 ,  H01L23/051 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/48 ,  H01L25/03 ,  H01L29/00 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor apparatus comprising a first and a second electrode substrate arranged substantially in parallel to each other, a semiconductor element containing a plurality of electrode members located between and opposite to the first and second electrode substrates, a layer of organic adhesive material inserted between the first and second electrode substrates for their integral bonding, and a means for connecting the first and second electrode substrates with the aforesaid plurality of electrode members mechanically as well as electrically.

Abstract translation: 一种半导体装置，包括基本上彼此平行布置的第一和第二电极基板，包含位于第一和第二电极基板之间并与第一和第二电极基板相对的多个电极部件的半导体元件，插入在第一和第二电极基板之间的有机粘合材料层 以及用于其一体结合的第二电极基板，以及用于机械地以电气方式将第一和第二电极基板与上述多个电极部件连接的装置。

公开(公告)号：US3558348A

公开(公告)日：1971-01-26

申请号：US3558348D

申请日：1968-04-18

Applicant: BELL TELEPHONE LABOR INC

Inventor： RAND MYRON J

IPC: C23C16/30 ,  H01L21/314 ,  H01L1/02

CPC classification number: H01L21/3145 ,  C23C16/308 ,  Y10S148/113 ,  Y10S148/114

Abstract: MIXED SILICON OXIDE-SILICON NITRIDE FILMS OF PARTICULAR COMPOSITIONS ARE VAPOR DEPOSITED CONTROLLABLY ON SEMICONDUCTOR DEVICES BY A REACTION PROCESS IN NITROGEN AT BETWEEN 700-900*C. USING SILANE (SIH4) AND NITRIC OXIDE (NO) AS THE REACTANTS. THE COMPOSITION OF THE DEPOSITED FILM IS A FUNCTION OF THE RATIO OF REACTANT CONCENTRATIONS. PARTICULAR COMPOSITIONS YIELD FILMS WHICH COMBINE MINIMAL STRESS, RESISTANCE TO PENETRATION OF CONTAMINANTS, AND ETCHABILITY.

公开(公告)号：US3555375A

公开(公告)日：1971-01-12

申请号：US3555375D

申请日：1968-11-29

Applicant: PHILIPS CORP

Inventor： HILBERS ANTONIUS HUBERTUS

IPC: H01L21/60 ,  H01L23/488 ,  H01L23/495 ,  H01L23/66 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H01L1/02 ,  H01L1/14

CPC classification number: H01L24/80 ,  H01L23/488 ,  H01L23/49562 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0216 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/0792 ,  H05K2201/09772 ,  H05K2201/10166 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A HIGH FREQUENCY TRANSISTOR IS DESCRIBED HAVING INPUT, OUTPUT AND COMMON LEADS. IN ORDER TO REDUCE THE UNDESIRED FEEDBACK EFFECT OF A STRAY SERIES INDUCTANCE IN THE COMMON LEAD, THE OUTPUT LEADS ARE ARRANGED SO AS TO CROSS ONE ANOTHER IN SUCH CLOSE PROXIMITY AS TO INDUCTIVE-

LY COUPLE THEM TOGETHER PROVIDING A FEEDBACK OPPOSITE TO THAT OF THE STRAY INDUCTANCE IN ORDER TO COMPENSATE THE LATTER.

公开(公告)号：US3510732A

公开(公告)日：1970-05-05

申请号：US3510732D

申请日：1968-04-22

Applicant: GEN ELECTRIC

Inventor： AMANS ROBERT L

IPC: C09K11/06 ,  H01L29/24 ,  H01L33/50 ,  H01L3/00 ,  H01L1/02

CPC classification number: H01L33/502 ,  C09K11/06 ,  H01L29/242 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

公开(公告)号：US3475662A

公开(公告)日：1969-10-28

申请号：US3475662D

申请日：1967-11-22

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： ZIDO JOSEPH E

IPC: H01L23/31 ,  H01L1/02 ,  H01L15/00

CPC classification number: H01L24/01 ,  H01L23/3121 ,  H01L23/3157 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/351 ,  Y10S257/909 ,  H01L2924/00