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1887 条记录 (耗时 0.021 秒)

    GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES
    11.
    发明公开
    GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES 审中-公开

    公开(公告)号：US20230381922A1

    公开(公告)日：2023-11-30

    申请号：US17974280

    申请日：2022-10-26

    申请人： Applied Materials, Inc.

    发明人： Chad Pollard ,  Shou-Sung Chang ,  Haosheng Wu

    IPC分类号： B24B57/02 ,  B24B53/017 ,  F16L11/127

    CPC分类号： B24B57/02 ,  B24B53/017 ,  F16L11/127

    摘要： A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The polishing system has a platen to support a polishing pad, a carrier head to support a substrate and bring the substrate into contact with the polishing pad, and a motor to cause relative motion between platen and the carrier head. The fluid delivery conduit includes a conductive wire extending through an interior of the conduit to flow electrostatic discharge to a ground, and a wire extraction fitting covering and sealing a location where the conductive wire passes through a wall of the fluid delivery conduit.

    Conditioner disk, chemical mechanical polishing device, and method
    14.
    发明授权
    Conditioner disk, chemical mechanical polishing device, and method 有权

    公开(公告)号：US11787012B2

    公开(公告)日：2023-10-17

    申请号：US17038465

    申请日：2020-09-30

    申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

    发明人： Hsien Hua Shen ,  Hsun-Chung Kuang

    IPC分类号： B24B53/017 ,  B24B53/12

    CPC分类号： B24B53/017 ,  B24B53/12

    摘要： A pad conditioner for conditioning a polishing surface of a polishing pad includes a conditioning disk, a disk holder, and a disk arm. The conditioning disk includes a substrate plate and at least two abrasive segments. The conditioning disk includes at least one channel by which debris and spent slurry may be evacuated. The abrasive segments are on a surface of the substrate plate, and form at least one channel segment therebetween. Each channel segment extends from about the center of the surface to substantially the outer rim of the substrate plate. The disk holder to which the conditioning disk is mounted includes a through hole. The disk arm to which the conditioning disk is mounted includes an opening in fluid communication with the at least one channel segment via the through hole for evacuating the debris and spent slurry by a vacuum module.

    Slurry enhancement for polishing system
    16.
    发明授权
    Slurry enhancement for polishing system 有权

    公开(公告)号：US11752592B2

    公开(公告)日：2023-09-12

    申请号：US17377759

    申请日：2021-07-16

    申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

    发明人： Chun-Hung Liao ,  Chen-Hao Wu ,  An-Hsuan Lee ,  Huang-Lin Chao

    IPC分类号： B24B53/017 ,  B24B57/02

    CPC分类号： B24B53/017 ,  B24B57/02

    摘要： The present disclosure describes a method and an apparatus that can enhance the slurry oxidizability for a chemical mechanical polishing (CMP) process. The method can include securing a substrate onto a carrier of a polishing system. The method can further include dispensing, via a feeder of the polishing system, a first slurry towards a polishing pad of the polishing system. The method can further include forming a second slurry by enhancing an oxidizability of the first slurry, and performing a polishing process, with the second slurry, on the substrate.

    Split-window CMP polishing pad and preparation method thereof
    20.
    发明申请
    Split-window CMP polishing pad and preparation method thereof 审中-公开

    公开(公告)号：US20190210184A1

    公开(公告)日：2019-07-11

    申请号：US16358033

    申请日：2019-03-19

    申请人： Chengdu Times Live Science and Technology Co., Ltd

    发明人： Siqi Song

    IPC分类号： B24B53/017 ,  B24B37/20 ,  B24B37/24 ,  B24B37/26 ,  B24D18/00

    CPC分类号： B24B53/017 ,  B24B37/205 ,  B24B37/24 ,  B24B37/26 ,  B24D18/0072

    摘要： A preparation method of a split-window CMP polishing pad includes engraving a groove and a window in a backing, attaching the backing with a substrate through an adhesive, punching a hole in the substrate corresponding to the window through a substrate punching mold, forming window support blocks, punching an original window material through a punching machine and a window punching mold, obtaining a formed window material, coating another adhesive on the window support blocks, placing the formed window material into the window portion, and attaching the formed window material to the window support blocks. Compared with the sliced integrated-window, for the split-window provided by the present invention, the materials do not affect each other during the manufacturing process, so that the problem of uneven density distribution of the backing after curing can be solved, and the fluctuation of the tensile strength caused by uneven temperature is reduced.