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公开(公告)号：US10076041B2
公开(公告)日：2018-09-11
申请号：US15517762
申请日：2015-10-07
Applicant: Senju Metal Industry Co., Ltd.
Inventor： Takashi Sugihara , Hiroshi Taguchi , Tsutomu Hiyama
CPC classification number: H05K3/34 , B23K1/08 , B23K3/06 , B23K3/0676 , B23K3/08 , B23Q1/265 , F16H25/20 , F16H25/24 , F16H25/2418
Abstract: Provided are a nut, an attachment for nut and a screw shaft, which are fitted to a coating material coating device or a soldering device and can change a fixed position of the nut easier than that of a convention example even if any adhered matters generated when each device is used for a long time are fixed, and a soldering device using the same. The nut 10 screws on to the screw shaft 2 having a predetermined length. The nut 10 is provided with a non-meshing part 11 composed of a notch 12 that is formed parallel to a movement direction thereof by cutting off screw threads and a flange portion 13, which has connecting holes 14 for connecting another member. Under such a configuration, by forward and/or backward movement of the nut 10, the notch 12 functions as if it scraps the fixed matters 6.
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公开(公告)号：US09744612B2
公开(公告)日：2017-08-29
申请号：US15033232
申请日：2014-06-13
Applicant: Senju Metal Industry Co., Ltd.
Inventor： Tsutomu Hiyama , Yuta Saito
IPC: B23K3/00 , B23K3/08 , B23K1/00 , B23K1/008 , B23K1/20 , B23K3/06 , B23K35/362 , B01D47/06 , B01D47/16 , B01D53/26 , B23K101/42
CPC classification number: B23K3/08 , B01D47/06 , B01D47/16 , B01D53/265 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K3/0638 , B23K3/0653 , B23K35/362 , B23K2101/42
Abstract: A first water spray unit that sprays water into the gaseous mixture containing the flux component, a separation unit having an introduction port for introducing the gaseous mixture into which water is sprayed from the first water spray unit, and a second water spray unit that forms a precipitation flow inside of the separation unit. The separation unit uses a swirling flow to separate the flow component from the gaseous mixture.
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公开(公告)号：US09511379B2
公开(公告)日：2016-12-06
申请号：US14654939
申请日：2013-12-20
Applicant: Senju Metal Industry Co., Ltd.
Inventor： Tsutomu Hiyama
IPC: B05B1/14 , B05B1/00 , B23K1/012 , B23K1/008 , H05K3/34 , B23K3/04 , B23K1/00 , F27B9/02 , F27B9/06 , F27B9/10
CPC classification number: B05B1/005 , B23K1/0016 , B23K1/008 , B23K1/012 , B23K3/04 , B23K3/085 , F27B9/02 , F27B9/06 , F27B9/10 , F27D5/0037 , H05K3/3494 , H05K2203/081
Abstract: In a gas-intake-port array structure, which enables any temperature fluctuation during conveying time of a printed circuit board, a semiconductor wafer or the like to be reduced and allows the printed circuit board and the like to be very uniformly heated or cooled, a nozzle pattern P2 is arranged to be line symmetry with a nozzle pattern P1 in one upper or lower divided section of a nozzle layout region of the nozzle cover 3 relative to a center portion that is orthogonal to a conveying direction, as shown in FIG. 1. In order for the arrangement patterns diagonally arranged in the nozzle layout region to become identical, the nozzle pattern P1 is arranged to be line symmetry with the nozzle pattern P2 in the other upper or lower divided section. Intake ports 3b, 3c and 3d each having a predetermined opening width are arranged between two blowing nozzles 2 or more and across a first row thereof and plural other rows having different phases, in order to circulate the gas blown from the blowing nozzles 2. Widths of the intake ports 3b, 3c and 3d are set so that they are gradually become narrower with increasing distance from the center portion.
Abstract translation: 在能够减少印刷电路板，半导体晶片等的输送时间内的任何温度波动，允许印刷电路板等非常均匀地加热或冷却的进气口阵列结构中， 喷嘴图案P2被布置为与喷嘴盖3的喷嘴布局区域的一个上部或下部分割部分相对于与传送方向正交的中心部分的喷嘴图案P1线性对称，如图1所示。 为了使喷嘴布局区域中对角布置的布置图案变得相同，喷嘴图案P1被布置为与另一个上部或下部分割部分中的喷嘴图案P2线性对称。 每个具有预定开口宽度的进气端口3b，3c和3d布置在两个吹气喷嘴2之间并且跨越其第一排和具有不同相位的多个其它行，以便使从吹气喷嘴2吹出的气体循环。宽度 进气口3b，3c和3d设置成随着距离中心部分的距离的增加而逐渐变窄。
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公开(公告)号：US09485872B2
公开(公告)日：2016-11-01
申请号：US14654956
申请日：2013-12-20
Applicant: Senju Metal Industry Co., Ltd.
Inventor： Tsutomu Hiyama
CPC classification number: H05K3/3494 , B23K1/0016 , B23K1/008 , B23K1/012 , B23K3/04 , B23K3/082 , B23K2101/42 , H05K2203/04 , H05K2203/081
Abstract: In a gas-blowing-hole array structure, which enables gas to be blown to the whole surface of the conveyed member such as a printed circuit board, a semiconductor wafer or the like almost concentrically and allows the whole surface of conveyed member to be very uniformly heated or cooled, a nozzle pattern P2 of blowing nozzles 2 is arranged to be line symmetry with a nozzle pattern P1 of the blowing nozzles 2 in upper and lower divided sections of one side of the nozzle cover 3 relative to a center portion thereof that is orthogonal to a conveying direction, as shown in FIG. 1. In order for the arrangement patterns diagonally arranged in the nozzle cover 3 to become identical, the nozzle pattern P1 is arranged to be line symmetry with the nozzle pattern P2 of the blowing nozzles 2 in upper and lower divided sections of the other side of the nozzle cover 3.
Abstract translation: 在气体吹出孔阵列结构中，能够将气体吹送到诸如印刷电路板，半导体晶片等的输送部件的整个表面，几乎同心地被吹送，并且允许被输送部件的整个表面非常 均匀地加热或冷却，喷嘴2的喷嘴图案P2被布置成与喷嘴盖3的一侧的上分离部分和下分割部分相对于其中心部分与喷嘴2的喷嘴图案P1线对称， 与输送方向正交，如图1所示。 为了使喷嘴盖3中对角地配置的排列图形变得相同，喷嘴图案P1配置成与喷嘴2的喷嘴图案P2在另一侧的上下分割部分的线对称 喷嘴盖3。
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Patent Agency Ranking
公开(公告)号：US20200094335A1
公开(公告)日：2020-03-26
申请号：US16618903
申请日：2018-05-08
Applicant: Senju Metal Industry Co., Ltd.
Inventor： Koichiro Hosokawa , Tsutomu Hiyama
Abstract: A soldering apparatus includes transfer rails as a first transfer means for transferring a printed circuit board, transfer rails as a second transfer means provided in parallel to a transfer direction of the printed circuit board to be transferred by the transfer rails, a muffle as a first reflow furnace main body for heating the printed circuit board transferred by the transfer rails, a muffle as a second reflow furnace main body for heating a printed circuit board transferred by the transfer rails, and a main frame as a frame for housing the muffle and the muffle. The main frame includes an opening/closing part as a first opening/closing means for opening/closing the muffle, and an opening/closing part as a second opening/closing means for opening/closing the muffle.
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公开(公告)号：US20170311453A1
公开(公告)日：2017-10-26
申请号：US15517762
申请日：2015-10-07
Applicant: Senju Metal Industry Co., Ltd.
Inventor： Takashi Sugihara , Hiroshi Taguchi , Tsutomu Hiyama
CPC classification number: H05K3/34 , B23K1/08 , B23K3/06 , B23K3/0676 , B23K3/08 , B23Q1/265 , F16H25/20 , F16H25/24 , F16H25/2418
Abstract: Provided are a nut, an attachment for nut and a screw shaft, which are fitted to a coating material coating device or a soldering device and can change a fixed position of the nut easier than that of a convention example even if any adhered matters generated when each device is used for a long time are fixed, and a soldering device using the same. The nut 10 screws on to the screw shaft 2 having a predetermined length. The nut 10 is provided with a non-meshing part 11 composed of a notch 12 that is formed parallel to a movement direction thereof by cutting off screw threads and a flange portion 13, which has connecting holes 14 for connecting another member. Under such a configuration, by forward and/or backward movement of the nut 10, the notch 12 functions as if it scraps the fixed matters 6.
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公开(公告)号：US09676048B2
公开(公告)日：2017-06-13
申请号：US15108039
申请日：2013-12-25
Applicant: Senju Metal Industry Co., Ltd.
Inventor： Tsutomu Hiyama , Hiroyuki Inoue , Shunsuke Kimoto , Tomotake Kagaya
IPC: B23K37/00 , B23K3/08 , B23K1/00 , B23K1/008 , B23K1/20 , H05K3/34 , F04D27/02 , F04D19/04 , B23K101/42
CPC classification number: B23K3/08 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K2101/42 , F04D19/04 , F04D27/0261 , H05K3/3494 , H05K2203/043 , H05K2203/085 , H05K2203/1178
Abstract: In a vacuum soldering apparatus and a control method thereof, in order to prevent flux scattering or solder scattering when voids are defoamed and/or deaerated from molten solder by evacuating a chamber to a target degree of vacuum as well as in order to be able to perform brief evacuation, an evaluation control of a pump is performed. The evaluation control of the pump is performed in which the plural evacuation control properties (#1 through #4) with the gradients θ plotting the degrees of vacuum (pressure P) in relation to evacuation time (time t) when a chamber is evacuated by a predetermined pump output, are previously prepared; and the control are changed from evacuation control property of small pump output to evacuation control property of large pump output based on the initially set gradient θ in the evacuation control property.
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公开(公告)号：US20160339531A1
公开(公告)日：2016-11-24
申请号：US15108039
申请日：2013-12-25
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor： Tsutomu Hiyama , Hiroyuki Inoue , Shunsuke Kimoto , Tomotake Kagaya
CPC classification number: B23K3/08 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K2101/42 , F04D19/04 , F04D27/0261 , H05K3/3494 , H05K2203/043 , H05K2203/085 , H05K2203/1178
Abstract: In a vacuum soldering apparatus and a control method thereof, in order to prevent flux scattering or solder scattering when voids are defoamed and/or deaerated from molten solder by evacuating a chamber to a target degree of vacuum as well as in order to be able to perform brief evacuation, an evaluation control of a pump is performed. The evaluation control of the pump is performed in which the plural evacuation control properties (#1 through #4) with the gradients θ plotting the degrees of vacuum (pressure P) in relation to evacuation time (time t) when a chamber is evacuated by a predetermined pump output, are previously prepared; and the control are changed from evacuation control property of small pump output to evacuation control property of large pump output based on the initially set gradient θ in the evacuation control property.
Abstract translation: 在真空焊接装置及其控制方法中，为了防止当通过将室抽真空至目标真空度来使空隙脱泡和/或从熔融焊料脱气时的焊剂散射或焊料散射，以便能够 执行简单的疏散，执行泵的评估控制。 执行泵的评价控制，其中，具有梯度θ的多个抽真空控制特性（＃1至＃4）绘制真空度（压力P）相对于抽空时间（时间t）时的排气时间（时间t） 预先确定的泵输出; 根据撤离控制特性中的初始设定的梯度θ，将控制从小泵输出的抽空控制特性改变为大泵输出的排气控制特性。
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公开(公告)号：US20160250705A1
公开(公告)日：2016-09-01
申请号：US15033232
申请日：2014-06-13
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor： Tsutomu Hiyama , Yuta Saito
IPC: B23K3/08
CPC classification number: B23K3/08 , B01D47/06 , B01D47/16 , B01D53/265 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K3/0638 , B23K3/0653 , B23K35/362 , B23K2101/42
Abstract: A first water spray unit that sprays water into the gaseous mixture containing the flux component, a separation unit having an introduction port for introducing the gaseous mixture into which water is sprayed from the first water spray unit, and a second water spray unit that forms a precipitation flow inside of the separation unit. The separation unit uses a swirling flow to separate the flow component from the gaseous mixture.
Abstract translation: 第一喷水单元，其将水喷入含有助熔剂组分的气体混合物中，分离单元具有用于引入从第一喷水单元喷射水的气体混合物的引入口，以及形成第二喷水单元 分离单元内的沉淀流。 分离单元使用旋流将气体组分与气体混合物分离。
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