ELECTRONIC DEVICE FOR PROCESSING IMAGE DATA AND IMAGE DATA PROCESSING METHOD

    公开(公告)号:US20220345625A1

    公开(公告)日:2022-10-27

    申请号:US17861814

    申请日:2022-07-11

    Abstract: An electronic device is provided. The electronic device includes a camera module for acquiring image data, a memory for storing a program module for controlling the camera module, and a processor electrically connected to the camera module or the memory, wherein the program module includes an application associated with the camera module, a framework for processing one or more requests received by the application, a hardware interface for interfacing with the camera module, and a solution layer for interlinking the hardware interface and the framework, and performing a post-processing operation of the image data by using at least a part of the camera module.

    ELECTRONIC DEVICE FOR AUDIO INPUT AND METHOD FOR OPERATING THE SAME

    公开(公告)号:US20220295178A1

    公开(公告)日:2022-09-15

    申请号:US17568171

    申请日:2022-01-04

    Abstract: An electronic device and method are disclosed. The electronic device includes an internal microphone, a communication module, and at least one processor. The processor implements the method, including: receiving, through the communication module, a first audio signal input through an external microphone included in an external electronic device communicatively connected to the electronic device, activating the internal microphone in response to detecting a device switch event switching from the external microphone to the internal microphone while receiving the first audio signal, receiving a second audio signal input through the internal microphone, synchronizing and mixing the first audio signal and the second audio signal during a designated first time period, and deactivating the external microphone upon detecting lapse of the designated first time period.

    SEMICONDUCTOR DEVICES
    18.
    发明公开

    公开(公告)号:US20240172417A1

    公开(公告)日:2024-05-23

    申请号:US18420138

    申请日:2024-01-23

    CPC classification number: H10B12/315 H01L23/528

    Abstract: A semiconductor device includes a gate structure and a contact plug. The gate structure extends in a first direction parallel to the substrate, and includes a first conductive pattern, a second conductive pattern and a gate mask sequentially stacked. The contact plug contacts an end portion in the first direction of the gate structure, and includes a first extension portion extending in a vertical direction and contacting sidewalls of the gate mask and the second conductive pattern, a second extension portion under and contacting the first extension portion and a sidewall of the first conductive pattern, and a protrusion portion under and contacting the second extension portion. A bottom of the protrusion portion does not contact the first conductive pattern. A first slope of a sidewall of the first extension portion is greater than a second slope of a sidewall of the second extension portion.

    SEMICONDUCTOR DEVICES
    20.
    发明申请

    公开(公告)号:US20220271041A1

    公开(公告)日:2022-08-25

    申请号:US17484679

    申请日:2021-09-24

    Abstract: A semiconductor device includes a gate structure and a contact plug. The gate structure extends in a first direction parallel to the substrate, and includes a first conductive pattern, a second conductive pattern and a gate mask sequentially stacked. The contact plug contacts an end portion in the first direction of the gate structure, and includes a first extension portion extending in a vertical direction and contacting sidewalls of the gate mask and the second conductive pattern, a second extension portion under and contacting the first extension portion and a sidewall of the first conductive pattern, and a protrusion portion under and contacting the second extension portion. A bottom of the protrusion portion does not contact the first conductive pattern. A first slope of a sidewall of the first extension portion is greater than a second slope of a sidewall of the second extension portion.

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