专利检索 ap:("SAMSUNG SDI CO., LTD." OR "SAMSUNG ELECTRONICS CO., LTD.") AND inv:"Moohyun KOH" 第 1 页

1.

发明申请
COMPOSITION FOR REMOVING EDGE BEADS FROM METAL CONTAINING RESISTS, AND METHOD OF FORMING PATTERNS INCLUDING STEP OF REMOVING EDGE BEADS USING THE COMPOSITION 有权

公开(公告)号：US20230038110A1

公开(公告)日：2023-02-09

申请号：US17858921

申请日：2022-07-06

申请人： SAMSUNG SDI CO., LTD. , SAMSUNG ELECTRONICS CO., LTD.

发明人： Minyoung LEE , Hyungrang MOON , Ryunmin HEO , Minsoo KIM , Youngkwon KIM , Jaehyun KIM , Changsoo WOO , Jung Min CHOI , Moohyun KOH , Jungah KIM , Sungan DO , Sang Won BAE , Hoon HAN , SukKoo HONG

IPC分类号： G03F7/16 , G03F7/11

摘要： A composition for removing edge beads from a metal-containing resist, and a method of forming patterns including step of removing edge beads using the same are provided. The composition for removing edge beads from a metal-containing resist includes an organic solvent, and a heptagonal ring compound substituted with at least one hydroxyl group (—OH). The heptagonal ring compound has at least two double bonds in the ring.

2.

发明申请
METAL CONTAINING PHOTORESIST DEVELOPER COMPOSITION, AND METHOD OF FORMING PATTERNS INCLUDING DEVELOPING STEP USING THE SAME 有权

公开(公告)号：US20230037563A1

公开(公告)日：2023-02-09

申请号：US17858924

申请日：2022-07-06

申请人： SAMSUNG SDI CO., LTD. , SAMSUNG ELECTRONICS CO., LTD.

发明人： Ryunmin HEO , Hyungrang MOON , Minyoung LEE , Minsoo KIM , Youngkwon KIM , Jaehyun KIM , Changsoo WOO , Jung Min CHOI , Moohyun KOH , Jungah KIM , Sungan DO , Sang Won BAE , Hoon HAN , SukKoo HONG

IPC分类号： G03F7/32

摘要： A metal-containing photoresist developer composition, and a method of forming patterns including a step of developing using the same are provided. The metal-containing photoresist developer composition includes an organic solvent, and a heptagonal ring compound substituted with at least one hydroxy group (—OH). The heptagonal ring compound has at least two double bonds in the ring.

3.

发明公开
PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME 审中-公开

公开(公告)号：US20230176477A1

公开(公告)日：2023-06-08

申请号：US17841031

申请日：2022-06-15

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Sukkoo HONG , Moohyun KOH , Kyungoh KIM , Yechan KIM , Kyunghwan NOH , Sungan DO , Hyun-Ji SONG

IPC分类号： G03F7/004 , G03F7/38 , H01L21/027

CPC分类号： G03F7/0042 , G03F7/38 , H01L21/0274

摘要： A photoresist composition includes an organometallic compound including at least one metal-ligand bond, the organometallic compound including a metal core and at least one organic ligand bonded to the metal core, and being configured such that the at least one metal-ligand bond is not breakable by exposure to light or moisture; a photoinitiator generating an acid or a radical in response to exposure to light; and a solvent.